High speed memory module

Claim 2

A high-speed memory module defined by first and second elements: a) said first element comprising: i) a plurality of flexible, interior layers laminated together to form a substrate having opposed exterior surfaces, said substrate having a network of conductive traces and vias forming data paths therein; ii) at least two substantially quadrangular, rigid circuit boards, each of said boards laminarly split into substantially symmetric half-sections; iii) each of said half-sections having solder lands formed on a first face for mounting electronic components thereto and conductive traces and vias incorporated therein forming a continuation of said data paths; iv) each of said half-sections having an opposite second face for bonding to said exterior surfaces of said substrate; v) said half-sections laminated together on either side of a portion of said substrate with said substrate being sandwiched therebetween; vi) wherein any gap between two parallel spaced-apart edges of any two adjacent boards is wide enough to allow mounting of said boards in a parallel, face-to-face, layered arrangement by folding said substrate at said gap; vii) said gap being wide enough to allow for an air space between any opposite facing component attached to separate boards; b) said second element comprising: i) a rigid circuit board having a network of conductive traces and vias incorporated therein said board defined by spaced-apart first and second elongated edges; ii) a comb of connecting terminals integral with said second element along said first elongated edge, said comb connected to said traces and vias to continue said data paths; iii) said comb sized and dimensioned to engage a connecting port on a supporting structure; and, iv) a first plurality of feed-through holes engaging said data paths in said first element arranged for connection to a like second plurality of feed-through holes engaging said data paths formed in said second element; and, c) means for interconnecting said first and said second feed-through holes so that said data paths from each of said half-sections through to said support structure are of substantially equal lengths.

Claim 3

The high-speed memory module of claim 1 wherein said rigid circuit boards in said first element are multi-layered.

Claim 4

The high-speed memory module of claim 1 wherein said rigid circuit boards in said second element are multi-layered.

Claim 5

The high-speed memory module of claim 1 wherein said half-sections are laminated in a side-by-side, parallel spaced-apart configuration.

Claim 6

The high-speed memory module of claim 1 where said half-sections are laminated directly across from each other.

Claim 7

The high-speed memory module of claim 1 wherein a plurality of apertures are formed through said substrate and said circuit boards for receipt therethrough of fasteners to hold said boards in spaced-apart arrangement.

Claim 8

The high-speed memory module of claim 1 wherein said means for interconnecting said first and said second feed-through holes includes wires soldered through said holes.

Claim 9

The high-speed memory module of claim 1 wherein said assembly is folded into a U-shape.

Claim 10

A plurality of the assembly of claim 1 in combination with a socket electrically attached to an underlying support structure.

Claim 11

The high-speed memory module of claim 1 wherein said comb is the only electronic connection point between said high-speed memory module and said underlying support structure.

Claim 12

The high-speed memory module of claim 1 wherein said comb is the only mechanical connection between said high-speed memory module and said underlying support structure.

Claim 13

The high-speed memory module of claim 1 wherein said connecting port comprises a Single In Line Memory Module (SIMM) style port.

Claim 14

The high-speed memory module of claim 1 wherein said connecting port comprises a Dual Inline Memory Module (DIMM) style port.

Claim 15

The high-speed memory module of claim 1 wherein said connecting port comprises a Small Outline Dual Inline Memory Module (SODIMM) style port.

Claim 16

The high-speed memory module of claim 1 wherein said connecting port comprises a Personal Computer Memory Card International Association (PCMCIA) style port.

Claim 17

The high-speed memory module of claim 1 wherein said connecting port comprises a Micro Memory Card (MMC) style port.

Claim 18

The high-speed memory module of claim 1 wherein said solder pads are sized, dimensioned and positioned to electronically engage memory integrated circuit modules.

Claim 19

The high-speed memory module of claim 1 further including a plurality of holes formed in said substrate for air to pass therethrough and providing cooling to electronic components mounted on said module.

Claim 20

The high-speed memory module of claim 1 wherein at least some of said holes are located in said gap.

Claim 21

A high-speed memory module defined by first and second elements: a) said first element comprising: i) a plurality of flexible, interior layers laminated together to form a substrate having opposed exterior surfaces, said substrate having a network of conductive traces and vias forming data paths therein; ii) at least two quadrangular, multi-layered, rigid circuit boards, each of said boards laminarly split into symmetric half-sections; iii) each of said half-sections having solder lands formed on a first face for mounting electronic components thereto and conductive traces and vias incorporated therein forming a continuation of said data paths; iv) each of said half-sections having an opposite second face for bonding to said exterior surfaces of said substrate; v) said half-sections laminated together on either side of a portion of said substrate with said substrate being sandwiched therebetween; vi) said half-sections laminated in a sise-by-side, parallel spaced-apart configuration; vii) wherein any gap between two parallel spaced-apart edges of any two adjacent boards is wide enough to allow mounting of said boards in a parallel, face-to-face, layered arrangement by folding said substrate at said gap; viii) said gap being wide enough to allow for an air space between any opposite facing component attached to separate boards; and, b) said second element comprising: i) a multi-layered rigid circuit board having a network of conductive traces and vias incorporated therein said board defined by spaced-apart first and second elongated edges; ii) a comb of connecting terminals integral with said second element along said first elongated edge, said comb connected to said traces and vias to continue said data paths; iii) said comb sized and dimensioned to engage a connecting port on a supporting structure; and, iv) a first plurality of feed-through holes engaging said data paths in said first element arranged for connection to a like second plurality of feed-through holes engaging said data paths formed in said second element; and, c) means for interconnecting said first and said second feed-through holes so that said data paths from each of said half-sections through to said support structure are of equal lengths; d) wherein said assembly is folded into a U-shape about an axis passing horizontally through said substrate.

Claim 22

A high-speed memory module defined by first and second elements: a) said first element comprising: i) a plurality of flexible, interior layers laminated together to form a substrate having opposed exterior surfaces, said substrate having a network of conductive traces and vias forming data paths therein; ii) at least two quadrangular, multi-layered, rigid circuit boards, each of said boards laminarly split into symmetric half-sections; iii) each of said half-sections having solder lands formed on a first face for mounting electronic components thereto and conductive traces and vias incorporated therein forming a continuation of said data paths; iv) each of said half-sections having an opposite second face for bonding to said exterior surfaces of said substrate; v) said half-sections laminated together on either side of a portion of said substrate with said substrate being sandwiched therebetween; vi) said half-sections laminated in a sise-by-side, parallel spaced-apart configuration; vii) wherein any gap between two parallel spaced-apart edges of any two adjacent boards is wide enough to allow mounting of said boards in a parallel, face-to-face, layered arrangement by folding said substrate at said gap; viii) said gap being wide enough to allow for an air space between any opposite facing component attached to separate boards; and, b) said second element comprising: i) a multi-layered rigid circuit board having a network of conductive traces and vias incorporated therein said board defined by spaced-apart first and second elongated edges; ii) a comb of connecting terminals integral with said second element along said first elongated edge, said comb connected to said traces and vias to continue said data paths; iii) said comb sized and dimensioned to engage a connecting port on a supporting structure; and, iv) a first plurality of feed-through holes engaging said data paths in said first element arranged for connection to a like second plurality of feed-through holes engaging said data paths formed in said second element; and, c) means for interconnecting said first and said second feed-through holes so that said data paths from each of said half-sections through to said support structure are of equal lengths; d) wherein said assembly is folded into a U-shape about an axis passing horizontally through said substrate.

Claim 23

A high-speed memory module defined by first and second elements: a) said first element comprising: i) a plurality of flexible, interior layers laminated together to form a substrate having opposed exterior surfaces, said substrate having a network of conductive traces and vias forming data paths therein; ii) at least two quadrangular, rigid circuit boards, each of said boards laminarly split into symmetric half-sections; iii) each of said half-sections having solder lands formed on a first face for mounting electronic components thereto and conductive traces and vias incorporated therein forming a continuation of said data paths; iv) each of said half-sections having an opposite second face for bonding to said exterior surfaces of said substrate; v) said half-sections laminated together on either side of a portion of said substrate with said substrate being sandwiched therebetween; vi) wherein any gap between two parallel spaced-apart edges of any two adjacent boards is wide enough to allow mounting of said boards in a parallel, face-to-face, layered arrangement by folding said substrate at said gap; vii) said gap being wide enough to allow for an air space between any opposite facing component attached to separate boards; b) said second element comprising: i) a rigid circuit board having a network of conductive traces and vias incorporated therein said board defined by spaced-apart first and second elongated edges; ii) a comb of connecting terminals integral with said second element along said first elongated edge, said comb connected to said traces and vias to continue said data paths; iii) said comb sized and dimensioned to engage a connecting port on a supporting structure; and, iv) a first plurality of feed-through holes engaging said data paths in said first element arranged for connection to a like second plurality of feed-through holes engaging said data paths formed in said second element; and, c) means for interconnecting said first and said second feed-through holes so that said data paths from each of said half-sections through to said support structure are of equal lengths, wherein said fasteners are metal.

Claim 24

A high-speed memory module defined by first and second elements: a) said first element comprising: i) a plurality of flexible, interior layers laminated together to form a substrate having opposed exterior surfaces, said substrate having a network of conductive traces and vias forming data paths therein; ii) at least two quadrangular, rigid circuit boards, each of said boards laminarly split into symmetric half-sections; iii) each of said half-sections having solder lands formed on a first face for mounting electronic components thereto and conductive traces and vias incorporated therein forming a continuation of said data paths; iv) each of said half-sections having an opposite second face for bonding to said exterior surfaces of said substrate; v) said half-sections laminated together on either side of a portion of said substrate with said substrate being sandwiched therebetween; vi) wherein any gap between two parallel spaced-apart edges of any two adjacent boards is wide enough to allow mounting of said boards in a parallel, face-to-face, layered arrangement by folding said substrate at said gap; vii) said gap being wide enough to allow for an air space between any opposite facing component attached to separate boards; b) said second element comprising: i) a rigid circuit board having a network of conductive traces and vias incorporated therein said board defined by spaced-apart first and second elongated edges; ii) a comb of connecting terminals integral with said second element along said first elongated edge, said comb connected to said traces and vias to continue said data paths; iii) said comb sized and dimensioned to engage a connecting port on a supporting structure; and, iv) a first plurality of feed-through holes engaging said data paths in said first element arranged for connection to a like second plurality of feed-through holes engaging said data paths formed in said second element; and, c) means for interconnecting said first and said second feed-through holes so that said data paths from each of said half-sections through to said support structure are of equal lengths, wherein said fasteners are metal.

Claim 25

A high-speed memory module defined by first and second elements: a) said first element comprising: i) a plurality of flexible, interior layers laminated together to form a substrate having opposed exterior surfaces, said substrate having a network of conductive traces and vias forming data paths therein; ii) at least two quadrangular, rigid circuit boards, each of said boards laminarly split into symmetric half-sections; iii) each of said half-sections having solder lands formed on a first face for mounting electronic components thereto and conductive traces and vias incorporated therein forming a continuation of said data paths; iv) each of said half-sections having an opposite second face for bonding to said exterior surfaces of said substrate; v) said half-sections laminated together on either side of a portion of said substrate with said substrate being sandwiched therebetween; vi) wherein any gap between two parallel spaced-apart edges of any two adjacent boards is wide enough to allow mounting of said boards in a parallel, face-to-face, layered arrangement by folding said substrate at said gap; vii) said gap being wide enough to allow for an air space between any opposite facing component attached to separate boards; b) said second element comprising: i) a rigid circuit board having a network of conductive traces and vias incorporated therein said board defined by spaced-apart first and second elongated edges; ii) a comb of connecting terminals integral with said second element along said first elongated edge, said comb connected to said traces and vias to continue said data paths; iii) said comb sized and dimensioned to engage a connecting port on a supporting structure; and, iv) a first plurality of feed-through holes engaging said data paths in said first element arranged for connection to a like second plurality of feed-through holes engaging said data paths formed in said second element; and, c) means for interconnecting said first and said second feed-through holes so that said data paths from each of said half-sections through to said support structure are of equal lengths, wherein said standoffs are plastic.

Claim 26

A high-speed memory module defined by first and second elements: a) said first element comprising: i) a plurality of flexible, interior layers laminated together to form a substrate having opposed exterior surfaces, said substrate having a network of conductive traces and vias forming data paths therein; ii) at least two quadrangular, rigid circuit boards, each of said boards laminarly split into symmetric half-sections; iii) each of said half-sections having solder lands formed on a first face for mounting electronic components thereto and conductive traces and vias incorporated therein forming a continuation of said data paths; iv) each of said half-sections having an opposite second face for bonding to said exterior surfaces of said substrate; v) said half-sections laminated together on either side of a portion of said substrate with said substrate being sandwiched therebetween; vi) wherein any gap between two parallel spaced-apart edges of any two adjacent boards is wide enough to allow mounting of said boards in a parallel, face-to-face, layered arrangement by folding said substrate at said gap; vii) said gap being wide enough to allow for an air space between any opposite facing component attached to separate boards; b) said second element comprising: i) a rigid circuit board having a network of conductive traces and vias incorporated therein said board defined by spaced-apart first and second elongated edges; ii) a comb of connecting terminals integral with said second element along said first elongated edge, said comb connected to said traces and vias to continue said data paths; iii) said comb sized and dimensioned to engage a connecting port on a supporting structure; and, iv) a first plurality of feed-through holes engaging said data paths in said first element arranged for connection to a like second plurality of feed-through holes engaging said data paths formed in said second element; and, c) means for interconnecting said first and said second feed-through holes so that said data paths from each of said half-sections through to said support structure are of equal lengths, wherein said standoffs are plastic.

Claim 27

A high-speed memory module defined by first and second elements: a) said first element comprising: i) a plurality of flexible, interior layers laminated together to form a substrate having opposed exterior surfaces, said substrate having a network of conductive traces and vias forming data paths therein; ii) at least two quadrangular, rigid circuit boards, each of said boards laminarly split into symmetric half-sections; iii) each of said half-sections having solder lands formed on a first face for mounting electronic components thereto and conductive traces and vias incorporated therein forming a continuation of said data paths; iv) each of said half-sections having an opposite second face for bonding to said exterior surfaces of said substrate; v) said half-sections laminated together on either side of a portion of said substrate with said substrate being sandwiched therebetween; vi) wherein any gap between two parallel spaced-apart edges of any two adjacent boards is wide enough to allow mounting of said boards in a parallel, face-to-face, layered arrangement by folding said substrate at said gap; vii) said gap being wide enough to allow for an air space between any opposite facing component attached to separate boards; b) said second element comprising: i) a rigid circuit board having a network of conductive traces and vias incorporated therein said board defined by spaced-apart first and second elongated edges; ii) a comb of connecting terminals integral with said second element along said first elongated edge, said comb connected to said traces and vias to continue said data paths; iii) said comb sized and dimensioned to engage a connecting port on a supporting structure; and, iv) a first plurality of feed-through holes engaging said data paths in said first element arranged for connection to a like second plurality of feed-through holes engaging said data paths formed in said second element; and, c) means for interconnecting said first and said second feed-through holes so that said data paths from each of said half-sections through to said support structure are of equal lengths, wherein said standoffs include spacers.

Claim 28

A high-speed memory module defined by first and second elements: a) said first element comprising: i) a plurality of flexible, interior layers laminated together to form a substrate having opposed exterior surfaces, said substrate having a network of conductive traces and vias forming data paths therein; ii) at least two quadrangular, rigid circuit boards, each of said boards laminarly split into symmetric half-sections; iii) each of said half-sections having solder lands formed on a first face for mounting electronic components thereto and conductive traces and vias incorporated therein forming a continuation of said data paths; iv) each of said half-sections having an opposite second face for bonding to said exterior surfaces of said substrate; v) said half-sections laminated together on either side of a portion of said substrate with said substrate being sandwiched therebetween; vi) wherein any gap between two parallel spaced-apart edges of any two adjacent boards is wide enough to allow mounting of said boards in a parallel, face-to-face, layered arrangement by folding said substrate at said gap; vii) said gap being wide enough to allow for an air space between any opposite facing component attached to separate boards; b) said second element comprising: i) a rigid circuit board having a network of conductive traces and vias incorporated therein said board defined by spaced-apart first and second elongated edges; ii) a comb of connecting terminals integral with said second element along said first elongated edge, said comb connected to said traces and vias to continue said data paths; iii) said comb sized and dimensioned to engage a connecting port on a supporting structure; and, iv) a first plurality of feed-through holes engaging said data paths in said first element arranged for connection to a like second plurality of feed-through holes engaging said data paths formed in said second element; and, c) means for interconnecting said first and said second feed-through holes so that said data paths from each of said half-sections through to said support structure are of equal lengths, wherein said standoffs include spacers.

Claim 29

A high-speed memory module defined by first and second elements: a) said first element comprising: i) a plurality of flexible, interior layers laminated together to form a substrate having opposed exterior surfaces, said substrate having a network of conductive traces and vias forming data paths therein; ii) at least two quadrangular, rigid circuit boards, each of said boards laminarly split into symmetric half-sections; iii) each of said half-sections having solder lands formed on a first face for mounting electronic components thereto and conductive traces and vias incorporated therein forming a continuation of said data paths; iv) each of said half-sections having an opposite second face for bonding to said exterior surfaces of said substrate; v) said half-sections laminated together on either side of a portion of said substrate with said substrate being sandwiched therebetween; vi) wherein any gap between two parallel spaced-apart edges of any two adjacent boards is wide enough to allow mounting of said boards in a parallel, face-to-face, layered arrangement by folding said substrate at said gap; vii) said gap being wide enough to allow for an air space between any opposite facing component attached to separate boards; b) said second element comprising: i) a rigid circuit board having a network of conductive traces and vias incorporated therein said board defined by spaced-apart first and second elongated edges; ii) a comb of connecting terminals integral with said second element along said first elongated edge, said comb connected to said traces and vias to continue said data paths; iii) said comb sized and dimensioned to engage a connecting port on a supporting structure; and, iv) a first plurality of feed-through holes engaging said data paths in said first element arranged for connection to a like second plurality of feed-through holes engaging said data paths formed in said second element; and, c) means for interconnecting said first and said second feed-through holes so that said data paths from each of said half-sections through to said support structure are of equal lengths, wherein said means for interconnecting said first and said second feed-through holes includes solder bumps.

Claim 30

A high-speed memory module defined by first and second elements: a) said first element comprising: i) a plurality of flexible, interior layers laminated together to form a substrate having opposed exterior surfaces, said substrate having a network of conductive traces and vias forming data paths therein; ii) at least two quadrangular, rigid circuit boards, each of said boards laminarly split into symmetric half-sections; iii) each of said half-sections having solder lands formed on a first face for mounting electronic components thereto and conductive traces and vias incorporated therein forming a continuation of said data paths; iv) each of said half-sections having an opposite second face for bonding to said exterior surfaces of said substrate; v) said half-sections laminated together on either side of a portion of said substrate with said substrate being sandwiched therebetween; vi) wherein any gap between two parallel spaced-apart edges of any two adjacent boards is wide enough to allow mounting of said boards in a parallel, face-to-face, layered arrangement by folding said substrate at said gap; vii) said gap being wide enough to allow for an air space between any opposite facing component attached to separate boards; b) said second element comprising: i) a rigid circuit board having a network of conductive traces and vias incorporated therein said board defined by spaced-apart first and second elongated edges; ii) a comb of connecting terminals integral with said second element along said first elongated edge, said comb connected to said traces and vias to continue said data paths; iii) said comb sized and dimensioned to engage a connecting port on a supporting structure; and, iv) a first plurality of feed-through holes engaging said data paths in said first element arranged for connection to a like second plurality of feed-through holes engaging said data paths formed in said second element; and, c) means for interconnecting said first and said second feed-through holes so that said data paths from each of said half-sections through to said support structure are of equal lengths, wherein said means for interconnecting said first and said second feed-through holes includes solder bumps.