US6020111A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of manufacturing semiconductor device with patterned lamination of Si film and metal film
Assignee: Fujitsu Ltd
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Filing: 1998-03-10
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Granted: 2000-02-01
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Expires: 2018-03-10
Abstract
Abstract In a method of manufacturing a semiconductor device, a first film essentially consisting of silicon is deposited on the surface of a semiconductor substrate. A second film essentially consisting of material having a proper etching selection ratio relative to tungsten is deposited on the first film. A third film essentially consisting of tungsten is deposited on the second film. A resist pattern is formed on the third film. The third film is etched and patterned to the surface of the second film, by using the resist pattern as a mask. The second film is etched to have the same shape as the third film. The first film is etched to have the same shape as the third film. After the step of patterning the third film and before the step of patterning the first film, the resist pattern is heated to a temperature of 80° C. or higher, the semiconductor substrate is exposed in atmospheric air, and the resist pattern is removed.
Inventors
- 👤 Satoru Mihara
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 14:40
CPC Classifications
H; H10; H10P; H10P50/00; H10P50/20; H10P50/28; H10P50/282; H10P50/283; C; C23; C23F; C23F1/00; C23F1/02; H10P50/26; H10P50/264; H10P50/266; H10P50/267; H10D; H10D64/00; H10D64/01; H10D64/013; H10D64/01302; H10D64/01304; H10D64/01306; H10D64/01308; H10D64/01312
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
165 words
A method of manufacturing a semiconductor device comprising the steps of: depositing a first film essentially consisting of silicon on the surface of a semiconductor substrate; depositing on the first film a second film essentially consisting of material which serves as an etching stopper when tungsten is etched; depositing on the second film a third film essentially consisting of tungsten; forming a resist pattern on the third film; etching and patterning the third film to the surface of the second film, by using the resist pattern as a mask; patterning the second film to have the same shape as the third film; and patterning the first film to have the same shape as the third film, and the method further comprising the steps of: after said step of patterning the third film and before said step of patterning the first film, heating the resist pattern to a temperature of at least 80° C.; exposing the semiconductor substrate in atmospheric air; and removing the resist pattern.
Claim 2
Independent Claim
165 words
A method of manufacturing a semiconductor device comprising the steps of: depositing a first film essentially consisting of silicon on the surface of a semiconductor substrate; depositing on the first film a second film essentially consisting of material which serves as an etching stopper when tungsten is etched; depositing on the second film a third film essentially consisting of tungsten; forming a resist pattern on the third film; etching and patterning the third film to the surface of the second film, by using the resist pattern as a mask; patterning the second film to have the same shape as the third film; and patterning the first film to have the same shape as the third film, and the method further comprising the steps of: after said step of patterning the third film and before said step of patterning the first film, heating the resist pattern to a temperature of at least 80° C.; exposing the semiconductor substrate in atmospheric air; and removing the resist pattern.
Claim 3
Dependent Claim
67 words
A method of manufacturing a semiconductor device according to claim 1, wherein said step of patterning the second film includes the step of etching the second film at a temperature of at least 80° C., said step of etching the second film at a temperature of at least 80° C. functioning as said step of heating the resist pattern to a temperature of at least 80° C.
Claim 4
Dependent Claim
100 words
A method of manufacturing a semiconductor device according to claim 1, further comprising the steps of: depositing on the third film a fourth film essentially consisting of inorganic material, after said step of depositing the third film, wherein the resist pattern is formed on the fourth film at said step of forming the resist pattern; and etching and patterning the fourth film by using the resist pattern as a mask, before said step of patterning the third film, wherein the first mask is etched by using the fourth film as a mask at said step of patterning the first film.
Claim 5
Dependent Claim
35 words
A method of manufacturing a semiconductor device according to claim 1, further comprising the steps of: processing the surface of the semiconductor substrate with amine containing solution after said step of removing the resist pattern.
Claim 6
Dependent Claim
86 words
A method of manufacturing a semiconductor device according to claim 1, wherein the semiconductor substrate comprises an underlying substrate with a silicon surface layer and a gate insulating film of silicon oxide formed on the surface of the underlying substrate, and the method further comprises the step of forming a source region and a drain region by implanting impurities in the silicon surface layer of the underlying substrate on both sides of the patterned first film, after said steps of patterning the second and first films.
Claim 7
Dependent Claim
63 words
A method of manufacturing a semiconductor device according to claim 1, wherein said steps of patterning the second and first films etch the second and first films by using at least one of gases selected from a group consisting of Cl 2 gas, mixed gas of Cl 2 and O 2 , HBr gas, and mixed gas of HBr and O 2 .
Claim 8
Dependent Claim
27 words
A method of manufacturing a semiconductor device according to claim 1, wherein the second film is a TiN film or a lamination film of TiN and Ti.
Claim 9
Dependent Claim
33 words
A method of manufacturing a semiconductor device according to claim 1, wherein said step of etching the third film etches the third film at a substrate temperature of at most minus 20° C.
Claim 10
Independent Claim
153 words
A method of manufacturing a semiconductor device comprising the steps of: depositing a first film essentially consisting of silicon on the surface of a semiconductor substrate; depositing on the first film a second film essentially consisting of material which serves as an etching stopper when tungsten is etched; depositing on the second film a third film essentially consisting of tungsten; forming a resist pattern on the third film; etching and patterning the third film to the surface of the second film, by using the resist pattern as a mask; patterning the second film to have the same shape as the third film; and patterning the first film to have the same shape as the third film, and the method further comprising the step of: after said step of patterning the third film and before said step of patterning the first film, removing the resist pattern without exposing the semiconductor substrate into atmospheric air.
Claim 11
Independent Claim
153 words
A method of manufacturing a semiconductor device comprising the steps of: depositing a first film essentially consisting of silicon on the surface of a semiconductor substrate; depositing on the first film a second film essentially consisting of material which serves as an etching stopper when tungsten is etched; depositing on the second film a third film essentially consisting of tungsten; forming a resist pattern on the third film; etching and patterning the third film to the surface of the second film, by using the resist pattern as a mask; patterning the second film to have the same shape as the third film; and patterning the first film to have the same shape as the third film, and the method further comprising the step of: after said step of patterning the third film and before said step of patterning the first film, removing the resist pattern without exposing the semiconductor substrate into atmospheric air.
Claim 12
Dependent Claim
100 words
A method of manufacturing a semiconductor device according to claim 9, further comprising the steps of: depositing on the third film a fourth film essentially consisting of inorganic material, after said step of depositing the third film, wherein the resist pattern is formed on the fourth film at said step of forming the resist pattern; and etching and patterning the fourth film by using the resist pattern as a mask, before said step of patterning the third film, wherein the first mask is etched by using the fourth film as a mask at said step of patterning the first film.
Claim 13
Dependent Claim
35 words
A method of manufacturing a semiconductor device according to claim 9, further comprising the steps of: processing the surface of the semiconductor substrate with amine containing solution after said step of removing the resist pattern.
Claim 14
Dependent Claim
86 words
A method of manufacturing a semiconductor device according to claim 9, wherein the semiconductor substrate comprises an underlying substrate with a silicon surface layer and a gate insulating film of silicon oxide formed on the surface of the underlying substrate, and the method further comprises the step of forming a source region and a drain region by implanting impurities in the silicon surface layer of the underlying substrate on both sides of the patterned first film, after said steps of patterning the second and first films.
Claim 15
Dependent Claim
63 words
A method of manufacturing a semiconductor device according to claim 9, wherein said steps of patterning the second and first films etch the second and first films by using at least one of gases selected from a group consisting of Cl 2 gas, mixed gas of Cl 2 and O 2 , HBr gas, and mixed gas of HBr and O 2 .
Claim 16
Dependent Claim
27 words
A method of manufacturing a semiconductor device according to claim 9, wherein the second film is a TiN film or a lamination film of TiN and Ti.
Claim 17
Dependent Claim
33 words
A method of manufacturing a semiconductor device according to claim 9, wherein said step of etching the third film etches the third film at a substrate temperature of at most minus 20° C.
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| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 2003-01-31 | 2003-08-02 | 2004-02-01 | $2000.00 | Window Closed / Lapsed |
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