US6012626A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of forming ball grid array contacts
Assignee: Texas Instruments Inc
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Filing: 1997-11-05
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Granted: 2000-01-11
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Expires: 2017-11-05
Abstract
Abstract The invention is to a method for forming solder contact balls (12) for a ball grid array semiconductor device. A solder sheet (15) is formed having solder elements (18) extending out at least one side of the solder sheet (15). The solder sheet is placed over and aligned on a semiconductor package (50) on which solder balls (12) are to be electrically connected to contact areas (51). The solder sheet (15) is aligned with one solder element (18) over each contact area (51). The package (50) and solder sheet (15) is heated to cause the solder elements (18) on the solder sheet (15) to separate and reflow such that the surface tension of the reflowed solder of each solder element (18) forms a solder ball (12) over a contact area (51).
Inventors
- 👤 Joseph S. Antao
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 18:04
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3478; B; B23; B23K; B23K35/00; B23K35/02; B23K35/0222; B23K35/0244; H10; H10W; H10W70/00; H10W70/099; H05K2201/00; H05K2201/03; H05K2201/0302; H05K2201/0305; H05K2201/10; H05K2201/10227; H05K2201/10424; H05K2201/10613; H05K2201/10621; H05K2201/10734
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
115 words
A method for forming solder contact balls for a ball grid array semiconductor device, comprising the steps of: forming a continuous solder sheet having solder elements extending out at least one side of the continuous solder sheet; placing the continuous solder sheet over a semiconductor package on which solder balls are to be electrically connected to contact areas; aligning the continuous solder sheet with one solder element over each contact area; and heating the package and the continuous solder sheet to cause the solder elements on the continuous solder sheet to separate and reflow such that the surface tension of the reflowed solder of each solder element forms a solder ball over a contact area.
Claim 2
Independent Claim
115 words
A method for forming solder contact balls for a ball grid array semiconductor device, comprising the steps of: forming a continuous solder sheet having solder elements extending out at least one side of the continuous solder sheet; placing the continuous solder sheet over a semiconductor package on which solder balls are to be electrically connected to contact areas; aligning the continuous solder sheet with one solder element over each contact area; and heating the package and the continuous solder sheet to cause the solder elements on the continuous solder sheet to separate and reflow such that the surface tension of the reflowed solder of each solder element forms a solder ball over a contact area.
Claim 3
Dependent Claim
19 words
The method according to claim 1, wherein the solder elements extend out another side of the continuous solder sheet.
Claim 4
Dependent Claim
23 words
The method according to claim 1, wherein the continuous solder sheet is segmented with channels such that each segment includes a solder element.
Claim 5
Dependent Claim
23 words
The method according to claim 1, wherein the volume of each solder ball is controlled by controlling the size of each solder element.
Claim 6
Dependent Claim
28 words
The method according to claim 1, including the step of applying a solder flux to the contact area prior to aligning the solder elements over the contact areas.
Claim 7
Dependent Claim
27 words
The method according to claim 3, wherein the solder sheet segments are all the same size and are segmented such that each segment includes a solder element.
Claim 8
Independent Claim
120 words
A method for forming solder contact balls for a ball grid array semiconductor device, comprising the steps of: forming a continuous solder sheet having solder elements and segments, one for each segment, extending out at least one side of the solder sheet; placing the continuous solder sheet over a semiconductor package on which solder balls are to be electrically connected to contact areas; aligning the continuous solder sheet with one solder element over each contact area; and heating the package and the continuous solder sheet to cause the solder elements on the continuous solder sheet to separate and reflow such that the surface tension of the reflowed solder of each solder element forms a solder ball over a contact area.
Claim 9
Independent Claim
120 words
A method for forming solder contact balls for a ball grid array semiconductor device, comprising the steps of: forming a continuous solder sheet having solder elements and segments, one for each segment, extending out at least one side of the solder sheet; placing the continuous solder sheet over a semiconductor package on which solder balls are to be electrically connected to contact areas; aligning the continuous solder sheet with one solder element over each contact area; and heating the package and the continuous solder sheet to cause the solder elements on the continuous solder sheet to separate and reflow such that the surface tension of the reflowed solder of each solder element forms a solder ball over a contact area.
Claim 10
Dependent Claim
19 words
The method according to claim 7, wherein the solder elements extend out another side of the continuous solder sheet.
Claim 11
Dependent Claim
22 words
The method according to claim 7, wherein the solder sheet is segmented with channels such that each segment includes a solder element.
Claim 12
Dependent Claim
23 words
The method according to claim 7, wherein the volume of each solder ball is controlled by controlling the size of each solder element.
Claim 13
Dependent Claim
28 words
The method according to claim 7, including the step of applying a solder flux to the contact area prior to aligning the solder elements over the contact areas.
Claim 14
Dependent Claim
30 words
The method according to claim 1, wherein the continuous solder sheet segments are all the same size and are segmented such that each segment includes a centrally located solder element.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-01-10 | 2003-07-12 | 2004-01-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-01-10 | 2007-07-12 | 2008-01-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-01-10 | 2011-07-12 | 2012-01-11 | $7700.00 | Window Closed / Lapsed |