US5029748A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Solder preforms in a cast array
Assignee: TE Connectivity Corp
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Filing: 1989-03-15
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Granted: 1991-07-09
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Expires: 2009-03-15
Abstract
Abstract Cast solder preforms, rings or donuts suitable for use in a reflow solder process to interconnect through-hole pins in an electrical connector to plated through holes in a printed circuit board are disclosed. A plurality of solder donuts are cast into an array so that the plurality of donuts are initially formed as a single unit. The donuts can be either cast onto pins in a connector or cast onto a separate carrier for subsequent insertion onto the pins in a connector.
Inventors
- 👤 John H. Lauterbach
- 👤 Leon T. Ritchie
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 23:51
CPC Classifications
B; B23; B23K; B23K3/00; B23K3/08; B23K3/087; H; H01; H01R; H01R12/00; H01R12/50; H01R12/51; H01R12/55; H01R12/58; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3447; H05K3/3465; H05K3/3468; H01R4/00; H01R4/02; H05K2201/00; H05K2201/03; H05K2201/0302; H05K2201/0305; H05K2201/10; H05K2201/10227; H05K2201/10424; H05K2201/10613; H05K2201/10621; H05K2201/10704; H05K2201/10954; H05K2201/10984; H05K2203/00; H05K2203/04; H05K2203/0415; H05K2203/12; H05K2203/128
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
150 words
A method of soldering a plurality of through-hole electrical contact pins, positioned in a multipin electrical connector, in holes in a printed circuit board by reflowing the solder predisposed on the pins so that the predisposed solder flows into the holes, wherein a plurality of solder preforms, each of which has a pin-receiving hole extending therethrough, are cast onto a separate insulating carrier member in an array corresponding to the positions of the holes in the printed circuit board for predisposition on said pins, the solder preforms being cast by casting molten solder in a mold configured to form the array with the solder preforms positioned to correspond to the positions of the pins, wherein the array of solder preforms are held by said carrier member on the plurality of pins prior to positioning the connector on the printed circuit board, and reflowing said solder about said electrical contact pins.
Claim 2
Independent Claim
150 words
A method of soldering a plurality of through-hole electrical contact pins, positioned in a multipin electrical connector, in holes in a printed circuit board by reflowing the solder predisposed on the pins so that the predisposed solder flows into the holes, wherein a plurality of solder preforms, each of which has a pin-receiving hole extending therethrough, are cast onto a separate insulating carrier member in an array corresponding to the positions of the holes in the printed circuit board for predisposition on said pins, the solder preforms being cast by casting molten solder in a mold configured to form the array with the solder preforms positioned to correspond to the positions of the pins, wherein the array of solder preforms are held by said carrier member on the plurality of pins prior to positioning the connector on the printed circuit board, and reflowing said solder about said electrical contact pins.
Claim 3
Dependent Claim
60 words
The method of claim 1 wherein the separate carrier is positioned in a first position on pins in an electrical connector, the carrier and the preforms being shifted to a second position on the pins when the electrical connector is mounted on the printed circuit board, each preform in the second position being in contact with the printed circuit board.
Claim 4
Dependent Claim
17 words
The method of claim 4 wherein the plurality of solder preforms are cast in a continuous array.
Claim 5
Dependent Claim
41 words
The method of claim 3 wherein adjacent preforms are joined by a strip of solder, the strip of solder being thin enough so that each strip is severed during solder reflow so that individual solder preforms are separated during solder reflow.
Claim 6
Dependent Claim
49 words
The method of claim 3 wherein the individual solder preforms are each joined by thin segments to a solder web, the solder preforms extending below the solder web, the method including the further step of mechanically severing the thin segments when the solder preforms are positioned on the pins.
Claim 7
Dependent Claim
17 words
The method of claim 1 wherein the plurality of solder preforms are simultaneously cast in said array.
Claim 8
Dependent Claim
31 words
The method of claim 1 wherein said solder preforms consist of an alloy of tin and lead, the method comprising the further step of applying flux before reflowing the predisposed solder.
Claim 9
Dependent Claim
34 words
The method of claim 1 wherein the solder preforms are cast onto a separate carrier having holes therein which are arranged to correspond to the positions of the pins in the multipin electrical connector.
Claim 10
Dependent Claim
12 words
The method of claim 8 wherein the carrier is a film-like material.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-07-08 | 1995-01-07 | 1995-07-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-07-08 | 1999-01-07 | 1999-07-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-07-08 | 2003-01-07 | 2003-07-09 | $7700.00 | Window Closed / Lapsed |