US6011310A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Film carrier and semiconductor device using the same
Assignee: Nitto Denko Corp
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Filing: 1996-09-27
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Granted: 2000-01-04
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Expires: 2016-09-27
Abstract
Abstract Disclosed are a film carrier comprising an insulating layer having laid therein an electrically conductive circuit such that the circuit is not exposed on the surface thereof, wherein conductive passages from the conductive circuit to one surface of the insulating layer are formed in the insulating layer and via holes from said conductive circuit to the other surface of the insulating layer are formed and a semiconductor device prepared by mounting a semiconductor element on the insulating layer of the film carrier. The film carrier can sufficiently correspond to pitch-fining and high-density mounting of a semiconductor element wiring, can surely perform the connecting operation of inner lead bonding and outer lead bonding and gives the mounting area of as small as possible.
Inventors
- 👤 Toshiki Naito
- 👤 Kazuo Ouchi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 08:21
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/4007; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/688; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0347; H05K2201/0355; H05K2201/0364; H05K2201/0367; H05K2201/0388; H05K2201/0394; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/09481; H05K2201/095; H05K2201/09563; H05K2203/00; H05K2203/15; H05K2203/1572; H05K3/42; H05K3/423; H10W70/68; H10W70/682; H10W70/685; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W74/00; H10W74/10; H10W74/15; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
82 words
A film carrier comprising an insulating layer having laid therein an electrically conductive circuit such that the circuit is not exposed on a surface thereof, wherein conductive passages from the conductive circuit to one surface of the insulating layer are formed in the insulating layer and via holes from said conductive circuit to an opposed second surface of the insulating layer are formed; wherein said film carrier does not have conductive material all the way to the surface in the via holes.
Claim 2
Dependent Claim
82 words
A film carrier comprising an insulating layer having laid therein an electrically conductive circuit such that the circuit is not exposed on a surface thereof, wherein conductive passages from the conductive circuit to one surface of the insulating layer are formed in the insulating layer and via holes from said conductive circuit to an opposed second surface of the insulating layer are formed; wherein said film carrier does not have conductive material all the way to the surface in the via holes.
Claim 3
Dependent Claim
29 words
The film carrier of claim 1, wherein a recessed portion for mounting a semiconductor element is formed on the surface of the insulating layer having formed therein via holes.
Claim 4
Dependent Claim
112 words
A semiconductor device comprising a film carrier, said film carrier comprising an insulating layer having laid therein an electrically conductive circuit such that the circuit is not exposed on the surface thereof, wherein conductive passages from the conductive circuit to one surface of the insulating layer and via holes from said conductive circuit to an opposed second surface of the insulating layer are formed, and a semiconductor element mounted on the surface of the insulating layer, wherein electrode portions of the semiconductor element are connected to the via holes of the insulating layer; wherein said film carrier does not have conductive material all the way to the surface in the via holes.
Claim 5
Dependent Claim
112 words
A semiconductor device comprising a film carrier, said film carrier comprising an insulating layer having laid therein an electrically conductive circuit such that the circuit is not exposed on the surface thereof, wherein conductive passages from the conductive circuit to one surface of the insulating layer and via holes from said conductive circuit to an opposed second surface of the insulating layer are formed, and a semiconductor element mounted on the surface of the insulating layer, wherein electrode portions of the semiconductor element are connected to the via holes of the insulating layer; wherein said film carrier does not have conductive material all the way to the surface in the via holes.
Claim 6
Dependent Claim
44 words
The semiconductor device of claim 3, wherein a recessed portion for mounting a semiconductor element is formed on the surface of the insulating layer having formed therein via holes and at mounting the semiconductor element, the semiconductor element is placed in the recessed portion.
Claim 7
Dependent Claim
131 words
A semiconductor device comprising a film carrier, said film carrier comprising an insulating layer having laid therein an electrically conductive circuit such that the circuit is not exposed on the surface thereof, wherein conductive passages from the conductive circuit to one surface of the insulating layer and via holes from said conductive circuit to an opposed second surface of the insulating layer are formed, and a semiconductor element mounted on the surface of the insulating layer, wherein electrode portions of the semiconductor element are connected to the via holes of the insulating layer; wherein a recessed portion for mounting a semiconductor element is formed on the surface of the insulating layer having formed therein via holes and at mounting the semiconductor element, the semiconductor element is placed in the recessed portion.
Claim 8
Dependent Claim
131 words
A semiconductor device comprising a film carrier, said film carrier comprising an insulating layer having laid therein an electrically conductive circuit such that the circuit is not exposed on the surface thereof, wherein conductive passages from the conductive circuit to one surface of the insulating layer and via holes from said conductive circuit to an opposed second surface of the insulating layer are formed, and a semiconductor element mounted on the surface of the insulating layer, wherein electrode portions of the semiconductor element are connected to the via holes of the insulating layer; wherein a recessed portion for mounting a semiconductor element is formed on the surface of the insulating layer having formed therein via holes and at mounting the semiconductor element, the semiconductor element is placed in the recessed portion.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-01-03 | 2003-07-05 | 2004-01-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-01-03 | 2007-07-05 | 2008-01-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-01-03 | 2011-07-05 | 2012-01-04 | $7700.00 | Window Closed / Lapsed |