Abstract General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and semiconductor layers. Semiconductor devices are formed in a semiconductor layer of the membrane. The semiconductor membrane layer is initially formed from a substrate of standard thickness, and all but a thin surface layer of the substrate is then etched or polished away. In another version, the flexible membrane is used as support and electrical interconnect for conventional integrated circuit die bonded thereto, with the interconnect formed in multiple layers in the membrane. Multiple die can be connected to one such membrane, which is then packaged as a multi-chip module. Other applications are based on (circuit) membrane processing for bipolar and MOSFET transistor fabrication, low impedance conductor interconnecting fabrication, flat panel displays, maskless (direct write) lithography, and 3D IC fabrication.
A method of forming an interconnect circuit comprising the steps of: providing a free standing membrane formed of at least one layer of low stress dielectric; and forming a pattern of electrically conductive traces on the dielectric.
Claim 2
Independent Claim
37 words
A method of forming an interconnect circuit comprising the steps of: providing a free standing membrane formed of at least one layer of low stress dielectric; and forming a pattern of electrically conductive traces on the dielectric.
Claim 3
Dependent Claim
65 words
The method of claim 1, wherein the step of providing comprises: providing a dielectric substrate less than about 100 microns thick; forming films of polycrystalline silicon on both surfaces of the substrate; and etching away a portion of the substrate; wherein the pattern of electrically conductive traces are formed by patterning a metal film deposited on at least one of the films of polycrystalline silicon.
Claim 4
Independent Claim
36 words
A method of forming an interconnect circuit comprising the steps of: forming a free standing membrane having at least one layer of low stress dielectric; and forming a pattern of electrically conductive traces on the dielectric.
Claim 5
Independent Claim
36 words
A method of forming an interconnect circuit comprising the steps of: forming a free standing membrane having at least one layer of low stress dielectric; and forming a pattern of electrically conductive traces on the dielectric.
Claim 6
Dependent Claim
69 words
The method of claim 3, wherein the step of forming a free standing membrane comprises: providing a dielectric substrate less than about 100 mils thick; forming films of polycrystalline silicon on both surfaces of the substrate; and etching away a portion of the substrate; wherein the pattern of electrically conductive traces are formed by patterning a metal film deposited on at least one of the films of polycrystalline silicon.