US6005466A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Trimmable inductor structure
Assignee: Microchip Technology Caldicot Ltd
•
Filing: 1995-07-24
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Granted: 1999-12-21
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Expires: 2015-07-24
Abstract
Abstract To provide trimmable inductor structure for a multichip module, direct-chip-attach or surface mount assembly in which an inductive element is formed on or near a surface of the assembly, a planar chip of dielectric or ferrite material is mounted over the inductive element, this chip having on its upper surface a trimmable metallization layer, which may for example be patterned in concentric rings or in a spiral.
Inventors
- 👤 David John Pedder
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 18:09
CPC Classifications
H; H01; H01F; H01F27/00; H01F27/28; H01F27/29; H01F27/292; H01F17/00; H01F17/0006; H10; H10W; H10W44/00; H10W44/501; H10W90/00; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
92 words
A trimmable inductor structure, comprising: a) a first substrate part having an inductor element formed on an upper face thereof, the inductor element having an inductance value; b) a second substrate part mounted on the first substrate part and overlying the inductor element, the second substrate part having opposite, upper and lower surfaces; and c) a metallization layer on one of said surfaces and being inductively coupled to the inductor element, the metallization layer being selectively removable from said one of the surfaces to alter the inductance value of the inductor element.
Claim 2
Dependent Claim
92 words
A trimmable inductor structure, comprising: a) a first substrate part having an inductor element formed on an upper face thereof, the inductor element having an inductance value; b) a second substrate part mounted on the first substrate part and overlying the inductor element, the second substrate part having opposite, upper and lower surfaces; and c) a metallization layer on one of said surfaces and being inductively coupled to the inductor element, the metallization layer being selectively removable from said one of the surfaces to alter the inductance value of the inductor element.
Claim 3
Dependent Claim
20 words
The inductor structure in accordance with claim 1, wherein the first substrate part is a multichip module, type D substrate.
Claim 4
Dependent Claim
16 words
The inductor structure in accordance with claim 1, wherein the metallization layer has a spiral pattern.
Claim 5
Dependent Claim
23 words
The inductor structure in accordance with claim 1, wherein the second substrate part is a generally planar substrate constituted of a dielectric material.
Claim 6
Dependent Claim
24 words
The inductor structure in accordance with claim 1, wherein the second substrate part is a generally planar substrate constituted of high resistivity semiconductor material.
Claim 7
Dependent Claim
22 words
The inductor structure in accordance with claim 1, wherein the second substrate part is a generally planar substrate constituted of ferrite material.
Claim 8
Dependent Claim
23 words
The inductor structure in accordance with claim 1, wherein said one of the surfaces is the upper surface of the second substrate part.
Claim 9
Dependent Claim
22 words
The inductor structure in accordance with claim 1, wherein the inductor element has a spiral pattern on said one of the surfaces.
Claim 10
Dependent Claim
23 words
The inductor structure in accordance with claim 1, wherein the inductor element has a concentric square pattern on said one of the surfaces.
Claim 11
Dependent Claim
23 words
The inductor structure in accordance with claim 1, wherein the inductor element has a concentric circular pattern on said one of the surfaces.
Claim 12
Dependent Claim
36 words
The inductor structure in accordance with claim 1, wherein said one of the surfaces is the lower surface of the second substrate part, and wherein the second substrate part is constituted of an optically transparent material.
Claim 13
Dependent Claim
31 words
The inductor structure in accordance with claim 1, wherein the second substrate part is elevated relative to the first substrate part by a plurality of solder bumps located between the parts.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-12-20 | 2003-06-21 | 2003-12-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-12-20 | 2007-06-21 | 2007-12-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-12-20 | 2011-06-21 | 2011-12-21 | $7700.00 | Window Closed / Lapsed |