US6005262A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Flip-chip bonded VCSEL CMOS circuit with silicon monitor detector
Assignee: Nokia of America Corp
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Filing: 1998-01-27
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Granted: 1999-12-21
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Expires: 2018-01-27
Abstract
Abstract A flip-chip bonded VCSEL CMOS circuit for preventing rearwardly emitted photons from the VCSEL from interfering with CMOS operation. The CMOS has bonding pads affixed thereto and spaced apart to define a region. The VCSEL is mounted to the bonding pads so that a lower mirror of the VCSEL is positioned between the bonding pads and in close proximity to an upper, major surface of the CMOS. A blocking layer is provided and is positioned within the region defined by the bonding pads to absorb or reflect rearwardly emitted photons from the VCSEL. In another embodiment, the blocking layer is removed and a photon detector is formed in the CMOS for collecting the rearwardly emitted photons for use in determining, inter alia, VCSEL laser power.
Inventors
- 👤 John Cunningham
- 👤 Keith Goossen
- 👤 Ashok Krishnamoorthy
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 14:38
CPC Classifications
H; H01; H01S; H01S5/00; H01S5/02; H01S5/022; H01S5/023; H01S5/02325; H01S5/0233; H01S5/0234; H01S5/0235; H01S5/02355; H01S5/0237; H01S5/10; H01S5/18; H01S5/183; H10; H10W; H10W90/00; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
143 words
A flip-chip bonded VCSEL CMOS circuit for safeguarding a CMOS device from rearwardly emitted light, generated by a VCSEL associated with the circuit, said circuit comprising: a substrate; a CMOS device formed on said substrate and having a major surface, said CMOS device including a plurality of transistors having gate terminals, and a bonding pad formed on said major surface; an associated VCSEL having an upper mirror remote from the bonding pad for transmitting forwardly emitted light, and a lower mirror proximate said bonding pad for passing rearwardly emitted light, said VCSEL being mounted to said bonding pad and in electrical communication with said CMOS; and means on one of said major surface and said substrate for preventing a substantial portion of rearwardly emitted light generated by said VCSEL from impinging on the gate terminals and interfering with current flow of said transistors.
Claim 2
Dependent Claim
143 words
A flip-chip bonded VCSEL CMOS circuit for safeguarding a CMOS device from rearwardly emitted light, generated by a VCSEL associated with the circuit, said circuit comprising: a substrate; a CMOS device formed on said substrate and having a major surface, said CMOS device including a plurality of transistors having gate terminals, and a bonding pad formed on said major surface; an associated VCSEL having an upper mirror remote from the bonding pad for transmitting forwardly emitted light, and a lower mirror proximate said bonding pad for passing rearwardly emitted light, said VCSEL being mounted to said bonding pad and in electrical communication with said CMOS; and means on one of said major surface and said substrate for preventing a substantial portion of rearwardly emitted light generated by said VCSEL from impinging on the gate terminals and interfering with current flow of said transistors.
Claim 3
Dependent Claim
18 words
The circuit of claim 1, wherein said preventing means comprises a blocking layer formed on said major surface.
Claim 4
Dependent Claim
21 words
The circuit of claim 2, wherein said blocking layer absorbs a substantial portion of the rearwardly emitted light from said VCSEL.
Claim 5
Dependent Claim
13 words
The circuit of claim 2, wherein said blocking layer is comprised of aluminum.
Claim 6
Dependent Claim
16 words
The circuit of claim 2, wherein said blocking layer reflects rearwardly emitted light from said VCSEL.
Claim 7
Dependent Claim
19 words
The circuit of claim 5, wherein said blocking layer comprises one of silicon monoxide, calcium fluoride and zinc sulfide.
Claim 8
Dependent Claim
12 words
The circuit of claim 1, wherein said substrate is comprised of silicon.
Claim 9
Dependent Claim
20 words
The circuit of claim 1, wherein said VCSEL has a bonding pad which is mounted to said CMOS bonding pad.
Claim 10
Dependent Claim
28 words
The circuit of claim 8, wherein said CMOS bonding pad comprises a pair of bonding pads and wherein said VCSEL bonding pad comprises a pair of bonding pads.
Claim 11
Dependent Claim
28 words
The circuit of claim 1, wherein said preventing means comprises a detector formed on said substrate for detecting a substantial portion of rearwardly emitted light from said VCSEL.
Claim 12
Dependent Claim
27 words
The circuit of claim 10, further comprising an anti-reflective coating positioned above said detector for preventing rearwardly emitted light from re-entering said VCSEL through said lower mirror.
Claim 13
Dependent Claim
11 words
The circuit of claim 11, wherein said anti-reflection coating comprises aluminum.
Claim 14
Dependent Claim
12 words
The circuit of claim 10, wherein said substrate is comprised of silicon.
Claim 15
Dependent Claim
19 words
The circuit of claim 10, wherein said detector generates a signal indicative of a laser power of said VCSEL.
Claim 16
Dependent Claim
124 words
A flip-chip bonded VCSEL CMOS circuit for safeguarding a CMOS device from rearwardly emitted light, generated by a VCSEL associated with the circuit, said circuit comprising: a substrate; a CMOS device formed on said substrate and having a major surface, said CMOS device including a plurality of transistors having gate terminals, and a bonding pad formed on said major surface; an associated VCSEL having an upper mirror remote from the bonding pad for transmitting forwardly emitted light, and a lower mirror proximate said bonding pad for passing rearwardly emitted light, said VCSEL being mounted to said bonding pad and in electrical communication with said CMOS; and a detector formed on said substrate for detecting a substantial portion of rearwardly emitted light from said VCSEL.
Claim 17
Dependent Claim
124 words
A flip-chip bonded VCSEL CMOS circuit for safeguarding a CMOS device from rearwardly emitted light, generated by a VCSEL associated with the circuit, said circuit comprising: a substrate; a CMOS device formed on said substrate and having a major surface, said CMOS device including a plurality of transistors having gate terminals, and a bonding pad formed on said major surface; an associated VCSEL having an upper mirror remote from the bonding pad for transmitting forwardly emitted light, and a lower mirror proximate said bonding pad for passing rearwardly emitted light, said VCSEL being mounted to said bonding pad and in electrical communication with said CMOS; and a detector formed on said substrate for detecting a substantial portion of rearwardly emitted light from said VCSEL.
Claim 18
Dependent Claim
34 words
The circuit of claim 15, wherein said bonding pad comprises a pair of bonding pads spaced apart from each other to form a region, and wherein said detector is partially aligned with said region.
Claim 19
Dependent Claim
27 words
The circuit of claim 15, further comprising an anti-reflective coating positioned above said detector for preventing rearwardly emitted light from re-entering said VCSEL through said lower mirror.
Claim 20
Dependent Claim
11 words
The circuit of claim 17, wherein said anti-reflection coating comprises aluminum.
Claim 21
Dependent Claim
12 words
The circuit of claim 15, wherein said substrate is comprised of silicon.
Claim 22
Dependent Claim
19 words
The circuit of claim 15, wherein said detector generates a signal indicative of a laser power of said VCSEL.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-12-20 | 2003-06-21 | 2003-12-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-12-20 | 2007-06-21 | 2007-12-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-12-20 | 2011-06-21 | 2011-12-21 | $7700.00 | Window Closed / Lapsed |