Patent US5982256A successfully refreshed from Google Patents.
US5982256A
Expired / Lapsed
US
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Wiring board equipped with a line for transmitting a high frequency signal
Assignee: Kyocera Corp
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Filing: 1998-02-27
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Granted: 1999-11-09
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Expires: 2018-02-27
Abstract
Abstract A wiring board of the present invention is equipped with a laminated waveguide as a high-frequency signal transmission line. The laminated waveguide is composed of a dielectric substrate, a pair of main conductive layers laminated on the upper surface and the lower surface of the dielectric substrate, a plurality of via-holes extending in a thickness direction in the dielectric substrate so that they electrically connect the pair of the main conductive layers, and a sub-conductive layer provided in the dielectric substrate so that it is parallel to the main conductive layers and is electrically connected to the via-holes, the plurality of the via-holes form two rows extending in a signal transmitting direction with a mutual distance from each other, and in each row, the distance between adjacent via-holes is adjusted to less than 1/2 of a signal wavelength, a region surrounded with the pair of the main conductive layers and the two rows of the via-holes forms a signal transmitting region, and on both sides in the outside of the signal transmitting region, the sub-conductive layer is provided. The transmittting line by the laminated waveguide which is formed in this wiring board has especially excellent transmitting characteristics of high-frequency signals. In addition, since this wiring board can be easily produced by a laminating technology of ceramics, this wiring board also has excellent productivity.
Inventors
- 👤 Hiroshi Uchimura
- 👤 Takeshi Takenoshita
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 16:59
CPC Classifications
H; H01; H01P; H01P3/00; H01P3/02; H01P3/08; H01P3/088; H01P1/00; H01P1/04; H01P1/047; H05; H05K; H05K1/00; H05K1/02; H05K1/0213; H05K1/0216; H05K1/0218; H05K1/0219; H05K1/0237; H05K1/0296; H05K1/0298; H05K1/03; H05K1/0306; H05K2201/00; H05K2201/07; H05K2201/0707; H05K2201/0715; H05K2201/09; H05K2201/09209; H05K2201/0929; H05K2201/093; H05K2201/09336; H05K2201/095; H05K2201/09618; H05K2201/09654; H05K2201/0969; H05K2201/09718; H05K2201/09818; H05K2201/09845
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
181 words
A wiring board equipped with a laminated waveguide as a high-frequency signal transmission line, wherein the laminated waveguide comprises: a dielectric substrate, a pair of main conductive layers laminated on the upper surface and the lower surface of the dielectric substrate, a plurality of via-holes extending in a thickness direction in the dielectric substrate so that the plurality of via-holes electrically connect each other and connect the pair of main conductive layers, and a sub-conductive layer provided in the dielectric substrate so that the sub-conductive layer is parallel to the main conductive layers and is electrically connected to the via-holes; wherein the plurality of the via-holes form two rows extending in a signal transmitting direction with a mutual distance from each other, and the distance between adjacent via-holes in each row is adjusted to less than 1/2 of a signal wavelength, a region surrounded by the pair of the main conductive layers and the two rows of the via-holes forms a signal transmitting region, and on both sides in the outside of the signal transmitting region, the sub-conductive layer is provided.
Claim 2
Dependent Claim
181 words
A wiring board equipped with a laminated waveguide as a high-frequency signal transmission line, wherein the laminated waveguide comprises: a dielectric substrate, a pair of main conductive layers laminated on the upper surface and the lower surface of the dielectric substrate, a plurality of via-holes extending in a thickness direction in the dielectric substrate so that the plurality of via-holes electrically connect each other and connect the pair of main conductive layers, and a sub-conductive layer provided in the dielectric substrate so that the sub-conductive layer is parallel to the main conductive layers and is electrically connected to the via-holes; wherein the plurality of the via-holes form two rows extending in a signal transmitting direction with a mutual distance from each other, and the distance between adjacent via-holes in each row is adjusted to less than 1/2 of a signal wavelength, a region surrounded by the pair of the main conductive layers and the two rows of the via-holes forms a signal transmitting region, and on both sides in the outside of the signal transmitting region, the sub-conductive layer is provided.
Claim 3
Dependent Claim
57 words
A wiring board according to claim 1, wherein the dielectric substrate is formed by laminating a plurality of dielectric layers, the dielectric layer positioned at the central portion in the signal transmitting region has a higher dielectric constant than the other dielectric layers, and the sub-conductive layer is provided between the layers of the individual dielectric layers.
Claim 4
Dependent Claim
103 words
A wiring board according to claim 1, wherein the board has another high-frequency signal transmission line together with the laminated waveguide, at least one of the main conductive layers of the laminated waveguide has a hole or notched portion, a connecting via-hole is provided in the terminal portion of the other high-frequency signal transmission line, the connecting via-hole is inserted into the signal transmitting region of the laminated waveguide through the hole or notched portion so that the connecting via-hole does not contact the main conductive layer, and another high-frequency signal transmission line is coupled with the laminated waveguide by the connecting via-hole.
Claim 5
Dependent Claim
32 words
A wiring board according to claim 3, wherein the other high-frequency signal transmission line is a strip line, a microstrip line, a coplanar line, a grounded coplanar line, or a laminated waveguide.
Claim 6
Dependent Claim
61 words
A wiring board according to claim 1, wherein the board has another high-frequency signal transmission line together with the laminated waveguide, and the terminal portion of the other high-frequency signal transmission line is inserted into the signal transmitting region through the dielectric body substrate of the laminated waveguide whereby the other high-frequency signal transmission line is coupled with the laminated waveguide.
Claim 7
Dependent Claim
32 words
A wiring board according to claim 5, wherein the other high-frequency signal transmission line is a strip line, a microstrip line, a coplanar line, a grounded coplanar line, or a laminated waveguide.
Claim 8
Dependent Claim
51 words
A wiring board according to claim 1, wherein the board has another high-frequency signal transmission line together with the laminated waveguide, a slot hole is formed in one of the main conductive layers, and the other high-frequency signal transmission line is electromagnetically coupled with the laminated waveguide through the slot hole.
Claim 9
Dependent Claim
29 words
A wiring board according to claim 7 wherein the other high-frequency signal transmission line is a strip line, a microstrip line, a coplanar line, or a grounded coplanar line.
Claim 10
Dependent Claim
89 words
A wiring board equipped with a laminated waveguide as a high-frequency signal transmission line, wherein the laminated waveguide includes a laminated structure comprising: dielectric layers and conductive layers laminated alternately, and a plurality of via-holes extending parallel in a laminating direction and circumferentially spaced from each other, wherein each conductive layer is positioned at the outside of the via-holes and electrically connected to the via-holes, and by a region surrounded with the via-holes and the conductive layers, high-frequency signals are transmitted in a laminated direction using the dielectric layers.
Claim 11
Dependent Claim
89 words
A wiring board equipped with a laminated waveguide as a high-frequency signal transmission line, wherein the laminated waveguide includes a laminated structure comprising: dielectric layers and conductive layers laminated alternately, and a plurality of via-holes extending parallel in a laminating direction and circumferentially spaced from each other, wherein each conductive layer is positioned at the outside of the via-holes and electrically connected to the via-holes, and by a region surrounded with the via-holes and the conductive layers, high-frequency signals are transmitted in a laminated direction using the dielectric layers.
Claim 12
Dependent Claim
228 words
A wiring board equipped with a laminated waveguide as a high-frequency signal transmission line, wherein the laminated waveguide comprises: a dielectric substrate; a pair of main conductive layers laminated on the upper surface and the lower surface of the dielectric substrate; a plurality of via-holes extending in a thickness direction in the dielectric substrate so that the plurality of via-holes electrically connect the main conductive layers, and a sub-conductive layer provided in the dielectric substrate so that the sub-conductive layer is parallel to the main conductive layers and is electrically connected to the via-holes; wherein the plurality of the via-holes form two rows extending in a signal transmitting direction with a mutual distance from each other, and the distance between adjacent via-holes in each row is adjusted to less than 1/2 of a signal wavelength, a region surrounded by the pair of the main conductive layers and the two rows of the via-holes forms a signal transmitting region, and on both sides in the outside of the signal transmitting region, the sub-conductive layer is provided, and wherein the dielectric substrate is formed by laminating a plurality of dielectric layers, at least one dielectric layer positioned in the inner portion in the signal transmitting region having a higher dielectric constant than the other dielectric layers, and the sub-conductive layer is provided between the layers of the individual dielectric layers.
Claim 13
Dependent Claim
228 words
A wiring board equipped with a laminated waveguide as a high-frequency signal transmission line, wherein the laminated waveguide comprises: a dielectric substrate; a pair of main conductive layers laminated on the upper surface and the lower surface of the dielectric substrate; a plurality of via-holes extending in a thickness direction in the dielectric substrate so that the plurality of via-holes electrically connect the main conductive layers, and a sub-conductive layer provided in the dielectric substrate so that the sub-conductive layer is parallel to the main conductive layers and is electrically connected to the via-holes; wherein the plurality of the via-holes form two rows extending in a signal transmitting direction with a mutual distance from each other, and the distance between adjacent via-holes in each row is adjusted to less than 1/2 of a signal wavelength, a region surrounded by the pair of the main conductive layers and the two rows of the via-holes forms a signal transmitting region, and on both sides in the outside of the signal transmitting region, the sub-conductive layer is provided, and wherein the dielectric substrate is formed by laminating a plurality of dielectric layers, at least one dielectric layer positioned in the inner portion in the signal transmitting region having a higher dielectric constant than the other dielectric layers, and the sub-conductive layer is provided between the layers of the individual dielectric layers.
Claim 14
Dependent Claim
103 words
A wiring board according to claim 10, wherein the board has another high-frequency signal transmission line together with the laminated waveguide, at least one of the main conductive layers of the laminated waveguide has a hole or notched portion, a connecting via-hole is provided in the terminal portion of the other high-frequency signal transmission line, the connecting via-hole is inserted into the signal transmitting region of the laminated waveguide through the hole or notched portion so that the connecting via-hole does not contact the main conductive layer, and another high-frequency signal transmission line is coupled with the laminated waveguide by the connecting via-hole.
Claim 15
Dependent Claim
32 words
A wiring board according to claim 11, wherein the other high-frequency signal transmission line is a strip line, a microstrip line, a coplanar line, a grounded coplanar line, or a laminated waveguide.
Claim 16
Dependent Claim
61 words
A wiring board according to claim 10, wherein the board has another high-frequency signal transmission line together with the laminated waveguide, and the terminal portion of the other high-frequency signal transmission line is inserted into the signal transmitting region through the dielectric body substrate of the laminated waveguide whereby the other high-frequency signal transmission line is coupled with the laminated waveguide.
Claim 17
Dependent Claim
32 words
A wiring board according to claim 13, wherein the other high-frequency signal transmission line is a strip line, a microstrip line, a coplanar line, a grounded coplanar line, or a laminated waveguide.
Claim 18
Dependent Claim
51 words
A wiring board according to claim 10, wherein the board has another high-frequency signal transmission line together with the laminated waveguide, a slot hole is formed in one of the main conductive layers, and the other high-frequency signal transmission line is electromagnetically coupled with the laminated waveguide through the slot hole.
Claim 19
Dependent Claim
29 words
A wiring board according to claim 15 wherein the other high-frequency signal transmission line is a strip line, a microstrip line, a coplanar line, or a grounded coplanar line.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-11-08 | 2003-05-10 | 2003-11-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-11-08 | 2007-05-10 | 2007-11-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-11-08 | 2011-05-10 | 2011-11-09 | $7700.00 | Window Closed / Lapsed |