Patent US5982041A successfully refreshed from Google Patents.
US5982041A
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US
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Silicone die attach adhesive, method for the fabrication of semiconductor devices, and semiconductor devices
Assignee: DuPont Toray Specialty Materials KK
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Filing: 1997-04-09
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Granted: 1999-11-09
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Expires: 2017-04-09
Abstract
Abstract A silicone die attach adhesive comprising a silicone composition that cures both through the free radical reaction of acrylic-functional organopolysiloxane as induced by exposure to high-energy radiation and through the hydrosilylation reaction between alkenyl-functional organopolysiloxane and silicon-bonded hydrogen-functional organopolysiloxane. Also, a fabrication method characterized by mounting a semiconductor chip on a substrate or in a package with the aforesaid silicone die attach adhesive sandwiched between the semiconductor chip and substrate or package, then inducing the free radical reaction of the acrylic functional groups by exposing the die attach adhesive to high-energy radiation, and thereafter curing the die attach adhesive by the hydrosilylation reaction. A semiconductor device characterized in that it has been fabricated by the above-described method.
Inventors
- 👤 Osamu Mitani
- 👤 Kazumi Nakayoshi
- 👤 Rikako Tazawa
- 👤 Katsutoshi Mine
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 12:31
CPC Classifications
C; C08; C08J; C08J3/00; C08J3/24; C08J3/243; C08L; C08L83/00; C08L83/04; C09; C09J; C09J11/00; C09J11/02; C09J11/04; C09J183/00; C09J183/04; C09J183/06; C09J183/10; C08J2383/00; C08J2383/04; C08L2666/00; C08L2666/28; C09J2203/00; C09J2203/326; H; H10; H10W; H10W72/00; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/736; H10W90/751; H10W90/754; H10W90/756; Y; Y10; Y10T; Y10T428/00; Y10T428/31504; Y10T428/31652; Y10T428/31663
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
46 words
A silicone die attach adhesive prepared from a siloxane composition wherein said siloxane composition is curable via both a free radical reaction of an acrylic-functional organopolysiloxane as induced upon exposure to high-energy radiation and a hydrosilylation reaction between an alkenyl-functional organopolysiloxane and a silicon-bonded hydrogen-functional organopolysiloxane.
Claim 2
Dependent Claim
46 words
A silicone die attach adhesive prepared from a siloxane composition wherein said siloxane composition is curable via both a free radical reaction of an acrylic-functional organopolysiloxane as induced upon exposure to high-energy radiation and a hydrosilylation reaction between an alkenyl-functional organopolysiloxane and a silicon-bonded hydrogen-functional organopolysiloxane.
Claim 3
Dependent Claim
209 words
A siloxane composition, comprising: (A) 100 parts by weight parts of an organopolysiloxane composition comprising (a) 5 to 95 weight % of an acrylic functional group containing organopolysiloxane having an average of at least two silicon-bonded acrylic functional groups per molecule, said silicon bonded acrylic functional groups having the formula: ##STR18## wherein R 1 is hydrogen or a monovalent hydrocarbon group, R 2 is hydrogen or a monovalent hydrocarbon group, and R 3 is a C 1 to C 10 divalent hydrocarbon group; and (b) 95 to 5 weight % of an alkenyl group containing organopolysiloxane having an average of at least two silicon-bonded alkenyl groups per molecule; (B) a silicon-bonded hydrogen atom containing organopolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule, in a quantity that provides from 0.5 to 20 moles silicon-bonded hydrogen from component (B) per 1 mole silicon-bonded alkenyl in component (b); (C) 0.01 to 10 parts by weight of a photosensitizer; and (D) platinum catalyst in sufficient quantity to cure the curable siloxane compositions; wherein said siloxane composition is curable, via both (i) free radical reaction of an acrylic-functional organopolysiloxane as induced upon exposure to high-energy radiation; and (ii) hydrosilylation reaction between an alkenyl-functional organopolysiloxane and a silicon-bonded hydrogen-functional organopolysiloxane.
Claim 4
Dependent Claim
209 words
A siloxane composition, comprising: (A) 100 parts by weight parts of an organopolysiloxane composition comprising (a) 5 to 95 weight % of an acrylic functional group containing organopolysiloxane having an average of at least two silicon-bonded acrylic functional groups per molecule, said silicon bonded acrylic functional groups having the formula: ##STR18## wherein R 1 is hydrogen or a monovalent hydrocarbon group, R 2 is hydrogen or a monovalent hydrocarbon group, and R 3 is a C 1 to C 10 divalent hydrocarbon group; and (b) 95 to 5 weight % of an alkenyl group containing organopolysiloxane having an average of at least two silicon-bonded alkenyl groups per molecule; (B) a silicon-bonded hydrogen atom containing organopolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule, in a quantity that provides from 0.5 to 20 moles silicon-bonded hydrogen from component (B) per 1 mole silicon-bonded alkenyl in component (b); (C) 0.01 to 10 parts by weight of a photosensitizer; and (D) platinum catalyst in sufficient quantity to cure the curable siloxane compositions; wherein said siloxane composition is curable, via both (i) free radical reaction of an acrylic-functional organopolysiloxane as induced upon exposure to high-energy radiation; and (ii) hydrosilylation reaction between an alkenyl-functional organopolysiloxane and a silicon-bonded hydrogen-functional organopolysiloxane.
Claim 5
Dependent Claim
167 words
The product obtained from incipient materials: (A) 100 parts by weight parts of an organopolysiloxane composition comprising (a) 5 to 95 weight % of an acrylic functional group containing organopolysiloxane having an average of at least two silicon-bonded acrylic functional groups per molecule, said silicon bonded acrylic functional groups having the formula: ##STR19## wherein R 1 is hydrogen or a monovalent hydrocarbon group, R 2 is hydrogen or a monovalent hydrocarbon group, and R 3 is a C 1 to C 10 divalent hydrocarbon group; and (b) 95 to 5 weight % of an alkenyl group containing organopolysiloxane having an average of at least two silicon-bonded alkenyl groups per molecule; (B) a silicon-bonded hydrogen atom containing organopolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule, in a quantity that provides from 0.5 to 20 moles silicon-bonded hydrogen from component (B) per 1 mole silicon-bonded alkenyl in component (b); (C) 0.01 to 10 parts by weight of a photosensitizer; and (D) a platinum catalyst.
Claim 6
Dependent Claim
167 words
The product obtained from incipient materials: (A) 100 parts by weight parts of an organopolysiloxane composition comprising (a) 5 to 95 weight % of an acrylic functional group containing organopolysiloxane having an average of at least two silicon-bonded acrylic functional groups per molecule, said silicon bonded acrylic functional groups having the formula: ##STR19## wherein R 1 is hydrogen or a monovalent hydrocarbon group, R 2 is hydrogen or a monovalent hydrocarbon group, and R 3 is a C 1 to C 10 divalent hydrocarbon group; and (b) 95 to 5 weight % of an alkenyl group containing organopolysiloxane having an average of at least two silicon-bonded alkenyl groups per molecule; (B) a silicon-bonded hydrogen atom containing organopolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule, in a quantity that provides from 0.5 to 20 moles silicon-bonded hydrogen from component (B) per 1 mole silicon-bonded alkenyl in component (b); (C) 0.01 to 10 parts by weight of a photosensitizer; and (D) a platinum catalyst.
Claim 7
Dependent Claim
151 words
The product obtained from incipient materials: (A') 100 parts by weight parts of an alkenyl group containing organopolysiloxane having an average of at least two silicon-bonded alkenyl groups per molecule; (B') a silicon-bonded hydrogen atom containing organopolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule, in a quantity that provides from 0.5 to 20 moles silicon-bonded hydrogen from component (B) per 1 mole silicon-bonded alkenyl in component (A'); (C) 0.01 to 10 parts by weight of a photosensitizer; and (D) a platinum catalyst; wherein at least one component selected from the group consisting of component (A') component (B') has an average of at least two silicon-bonded acrylic functional groups per molecule having the formula: ##STR20## wherein R 1 is hydrogen or a monovalent hydrocarbon group, R 2 is hydrogen or a monovalent hydrocarbon group, and R 3 is a C 1 to C 10 divalent hydrocarbon group.
Claim 8
Dependent Claim
151 words
The product obtained from incipient materials: (A') 100 parts by weight parts of an alkenyl group containing organopolysiloxane having an average of at least two silicon-bonded alkenyl groups per molecule; (B') a silicon-bonded hydrogen atom containing organopolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule, in a quantity that provides from 0.5 to 20 moles silicon-bonded hydrogen from component (B) per 1 mole silicon-bonded alkenyl in component (A'); (C) 0.01 to 10 parts by weight of a photosensitizer; and (D) a platinum catalyst; wherein at least one component selected from the group consisting of component (A') component (B') has an average of at least two silicon-bonded acrylic functional groups per molecule having the formula: ##STR20## wherein R 1 is hydrogen or a monovalent hydrocarbon group, R 2 is hydrogen or a monovalent hydrocarbon group, and R 3 is a C 1 to C 10 divalent hydrocarbon group.
Claim 9
Dependent Claim
195 words
A siloxane composition, comprising: (A') 100 parts by weight parts of an alkenyl group containing organopolysiloxane having an average of at least two silicon-bonded alkenyl groups per molecule; (B') a silicon-bonded hydrogen atom containing organopolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule, in a quantity that provides from 0.5 to 20 moles silicon-bonded hydrogen from component (B) per 1 mole silicon-bonded alkenyl in component (A'); (C) 0.01 to 10 parts by weight of a photosensitizer; and (D) platinum catalyst in sufficient quantity to cure the curable siloxane composition wherein said siloxane composition is curable, via both (i) a free radical reaction of an acrylic-functional organopolysiloxane as induced upon exposure to high-energy radiation; and (ii) a hydrosilylation reaction between an alkenyl-functional organopolysiloxane and a silicon-bonded hydrogen-functional organopolysiloxane, and wherein at least one component selected from the group consisting of component (A') and component (B') has an average of at least two silicon-bonded acrylic functional groups having the formula: ##STR21## wherein R 1 is hydrogen or a monovalent hydrocarbon group, R 2 is hydrogen or a monovalent hydrocarbon group, and R 3 is a C 1 to C 10 divalent hydrocarbon group.
Claim 10
Dependent Claim
195 words
A siloxane composition, comprising: (A') 100 parts by weight parts of an alkenyl group containing organopolysiloxane having an average of at least two silicon-bonded alkenyl groups per molecule; (B') a silicon-bonded hydrogen atom containing organopolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule, in a quantity that provides from 0.5 to 20 moles silicon-bonded hydrogen from component (B) per 1 mole silicon-bonded alkenyl in component (A'); (C) 0.01 to 10 parts by weight of a photosensitizer; and (D) platinum catalyst in sufficient quantity to cure the curable siloxane composition wherein said siloxane composition is curable, via both (i) a free radical reaction of an acrylic-functional organopolysiloxane as induced upon exposure to high-energy radiation; and (ii) a hydrosilylation reaction between an alkenyl-functional organopolysiloxane and a silicon-bonded hydrogen-functional organopolysiloxane, and wherein at least one component selected from the group consisting of component (A') and component (B') has an average of at least two silicon-bonded acrylic functional groups having the formula: ##STR21## wherein R 1 is hydrogen or a monovalent hydrocarbon group, R 2 is hydrogen or a monovalent hydrocarbon group, and R 3 is a C 1 to C 10 divalent hydrocarbon group.
Claim 11
Dependent Claim
34 words
A semiconductor device, comprising: 1) a semiconductor chip; 2) a substrate; and 3) the silicone die attach adhesive of claim 1, wherein said silicone die attach adhesive connects said semiconductor chip to said substrate.
Claim 12
Dependent Claim
30 words
A semiconductor device, comprising: 1) a semiconductor chip; 2) a substrate; and 3) the siloxane composition of claim 2, wherein said siloxane composition connects said semiconductor chip to said substrate.
Claim 13
Dependent Claim
28 words
A semiconductor device, comprising: 1) a semiconductor chip; 2) a substrate; and 3) the product of claim 3, wherein said product connects said semiconductor chip to said substrate.
Claim 14
Dependent Claim
28 words
A semiconductor device, comprising: 1) a semiconductor chip; 2) a substrate; and 3) the product of claim 4, wherein said product connects said semiconductor chip to said substrate.
Claim 15
Dependent Claim
30 words
A semiconductor device, comprising: 1) a semiconductor chip; 2) a substrate; and 3) the siloxane composition of claim 5, wherein said siloxane composition connects said semiconductor chip to said substrate.
Claim 16
Dependent Claim
78 words
A method for fabricating a semiconductor device, said method comprising the steps of: providing a semiconductor chip; providing a substrate; connecting said semiconductor chip to said substrate using the silicone die attach of claim 1; then inducing a free radical reaction of the acrylic functional groups of said acrylic-functional organopolysiloxane of said silicone die attach adhesive by exposing said silicone die attach adhesive to high-energy radiation; and thereafter curing said silicone die attach adhesive via a hydrosilylation reaction.
Claim 17
Dependent Claim
71 words
A method for fabricating a semiconductor device, said method comprising the steps of: providing a semiconductor chip; providing a substrate; connecting said semiconductor chip to said substrate using the siloxane composition of claim 2; then inducing a free radical reaction of the acrylic functional groups of said component (a) of said siloxane composition by exposing said siloxane composition to high-energy radiation; and thereafter curing said siloxane composition via a hydrosilylation reaction.
Claim 18
Dependent Claim
63 words
A method for fabricating a semiconductor device, said method comprising the steps of: providing a semiconductor chip; providing a substrate; connecting said semiconductor chip to said substrate using the siloxane composition of claim 5; then inducing a free radical reaction of said acrylic functional groups by exposing said siloxane composition to high-energy radiation; and thereafter curing said hydrosilylation composition via a hydrosilylation reaction.
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