Flip chip bump structure and method of making

Claim 2

A semiconductor device comprising: a semiconductor substrate having a conductive bond pad; a toroidal shaped polyimide structure, the toroidal shaped polyimide structure having an inner sidewall defining an opening, an outer sidewall that surrounds the entire inner sidewall, and a top surface connected therebetween wherein the opening is over at least a portion of the conductive bond pad; a conductive layer formed over at least a portion of the toroidal shaped polyimide structure, wherein the conductive layer contacts the conductive pad; and a conductive bump structure connected to the conductive layer through the opening.

Claim 3

The device of claim 1, wherein the toroidal shaped polyimide structure is annular whereby the inner sidewall is defined by a first radius and the outer sidewall is defined by a second radius wherein the first radius is less than the second radius.

Claim 4

The device of claim 1 further comprising a passivation layer under at least a portion of the toroidal shaped polyimide structure.

Claim 5

The device of claim 1, wherein the conductive layer is formed over substantially all of the toroidal shaped polyimide structure.

Claim 6

The device of claim 1 further comprising a second polyimide area over a portion of the device, the second polyimide area separate from the toroidal shaped polyimide structure.

Claim 7

The device of claim 5 wherein the second polyimide area is toroidal shaped by having an inner sidewall defining an opening, an outer sidewall that surrounds the entire inner sidewall, and a top surface connected therebetween.

Claim 8

The device of claim 6 wherein another conductive bump structure is formed over the second polyimide area to form a second contact within the device.

Claim 9

The device of claim 1, wherein the conductive layer comprises a first conductive layer having a first metallurgy characteristic, and a second layer having a second metallurgy characteristic.

Claim 10

The device of claim 1 further comprising a package means coupled to the conductive bump structure.

Claim 11

The device of claim 9, wherein the package means is a Ball Grid Array package.

Claim 12

The device of claim 9, wherein the package means is a Chip Scale Package.

Claim 13

The device of claim 9, wherein an underfill material is directly adjacent to the conductive bump structure.

Claim 14

A semiconductor device having a plurality of contact structures, a cross section of one of the plurality of contact structures comprising: a surface; a first layered region along a first line extending substantially perpendicular from a semiconductor substrate, the first layered region comprising a passivation region formed over the semiconductor substrate, wherein a portion of the passivation region forms a portion of the surface over which no polyimide region is formed and under which no bond pad region is positioned; a second layered region along a second line extending substantially perpendicular from a semiconductor substrate and adjacent to the first line, the second layered region comprising a a bond pad region formed over the semiconductor substrate, the passivation region formed directly on the bond pad region, a polyimide region formed directly on the passivation region, and a conductive region formed directly on the polyimide region; and a third layered region along a third line extending substantially perpendicular from a semiconductor substrate and adjacent to the second line, the second line being between the third line and the first line, the third layered region comprising the bond pad region formed over the semiconductor substrate, and the conductive region formed directly on the bond pad region but no polyimide region.

Claim 15

A semiconductor device having a plurality of contact structures, a cross section of one of the plurality of contact structures comprising: a surface; a first layered region along a first line extending substantially perpendicular from a semiconductor substrate, the first layered region comprising a passivation region formed over the semiconductor substrate, wherein a portion of the passivation region forms a portion of the surface over which no polyimide region is formed and under which no bond pad region is positioned; a second layered region along a second line extending substantially perpendicular from a semiconductor substrate and adjacent to the first line, the second layered region comprising a a bond pad region formed over the semiconductor substrate, the passivation region formed directly on the bond pad region, a polyimide region formed directly on the passivation region, and a conductive region formed directly on the polyimide region; and a third layered region along a third line extending substantially perpendicular from a semiconductor substrate and adjacent to the second line, the second line being between the third line and the first line, the third layered region comprising the bond pad region formed over the semiconductor substrate, and the conductive region formed directly on the bond pad region but no polyimide region.

Claim 16

The device of claim 13, wherein the conductive region comprises an under bump metallurgy and a solder bump.

Claim 17

The device cross section of claim 13 furthers comprising: a fourth layered region along a fourth line extending substantially perpendicular from a semiconductor substrate and adjacent to the first line, the forth line being between the first line and the second line, the fourth layered region comprising the passivation region formed over the semiconductor substrate, and a polyimide region formed directly on the passivation region, wherein the polyimide region of the fourth layered region forms a portion of the surface.

Claim 18

The device cross section of claim 15, further comprising: a fifth layered region along a fifth line extending substantially perpendicular from a semiconductor substrate and adjacent to the fourth line, the fifth line being between the second line and the fourth line, the fifth layered region comprising the passivation layer formed over the semiconductor substrate, the polyimide region formed directly on the passivation region, and the second conductive region formed directly on the polyimide region, wherein a portion of the second conductive region forms a portion of the top surface.

Claim 19

A semiconductor device having a plurality of contact points, the device comprising: a substrate having electrical devices with electrodes where the electrical devices are formed on the substrate; a first bond pad and a second bond pad overlying the substrate and connected to electrodes of the electrical devices; a passivation layer over a portion of the first and second bond pads; a first toroidal shaped dielectric region over the first bond pad and a second toroidal shaped dielectric region over the second bond pad wherein the first and second toroidal shaped regions are physically separated from one another by a gap, each of the first and second toroidal shaped dielectric regions having an inner sidewall defining a contact opening to its respective bond pad and outer sidewall surrounding the inner sidewall; and a first conductive bump within the contact opening of the first toroidal shaped dielectric region and a second conductive bump within the contact opening of the second toroidal shaped dielectric region.

Claim 20

A semiconductor device having a plurality of contact points, the device comprising: a substrate having electrical devices with electrodes where the electrical devices are formed on the substrate; a first bond pad and a second bond pad overlying the substrate and connected to electrodes of the electrical devices; a passivation layer over a portion of the first and second bond pads; a first toroidal shaped dielectric region over the first bond pad and a second toroidal shaped dielectric region over the second bond pad wherein the first and second toroidal shaped regions are physically separated from one another by a gap, each of the first and second toroidal shaped dielectric regions having an inner sidewall defining a contact opening to its respective bond pad and outer sidewall surrounding the inner sidewall; and a first conductive bump within the contact opening of the first toroidal shaped dielectric region and a second conductive bump within the contact opening of the second toroidal shaped dielectric region.

Claim 21

The device of claim 17 wherein the first and second toroidal shaped dielectric regions are made of a polyimide material.

Claim 22

The device of claim 17 wherein the device is flip-chip mounted onto a larger substrate that contains conductive contact regions where the conductive contact regions are electrically coupled to the first and second bond pads.

Claim 23

The device of claim 19 wherein an underfill material is formed between the device and the larger substrate where the underfill material contacts both the passivation layer and the outer sidewall of the first and second toroidal shaped dielectric regions.

Claim 24

A semiconductor device having a top surface that is exposed to an ambient region, the device comprising: a conductive ball region that has a top surface exposed to the ambient region; a toroidal dielectric region surrounding a lower portion of the conductive ball region where a potion of the toroidal dielectric region is exposed to the ambient region; and a passivation layer underlying the toroidal dielectric region where a surface of the passivation region is exposed to the ambient region.

Claim 25

A semiconductor device having a top surface that is exposed to an ambient region, the device comprising: a conductive ball region that has a top surface exposed to the ambient region; a toroidal dielectric region surrounding a lower portion of the conductive ball region where a potion of the toroidal dielectric region is exposed to the ambient region; and a passivation layer underlying the toroidal dielectric region where a surface of the passivation region is exposed to the ambient region.

Claim 26

The device of claim 21 wherein the ambient region is filled with an underfill material whereby the underfill material is in contact with all of the conductive ball region, the toroidal dielectric region, and the passivation layer.