Integrated circuit for directly attaching to a glass substrate and method for manufacturing the same

Claim 2

An integrated circuit (IC) which attaches to a glass substrate, which includes an integrated circuit die comprising circuitry, and which includes cavities formed in a first surface thereof, the IC comprising: metal layers formed adjacent to the integrated circuit die within the cavities and coupled to the circuitry; conductive bumps formed within the cavities to electrically couple to the circuitry via the metal layers, the conductive bumps comprising a material that adheres to glass; and an adhesive deposited on regions of the first surface of the IC surrounding the cavities in which the conductive bumps are formed for adhering to the glass substrate when the IC is attached thereto, thereby strengthening the bond provided by connections between the conductive bumps and the glass substrate, wherein the conductive bumps extend farther from the first surface of the IC than does the adhesive.

Claim 3

The IC of claim 1, wherein the material from which the conductive bumps are formed comprises indium.

Claim 4

The IC of claim 1, wherein the material from which the conductive bumps are formed comprises an indium alloy.

Claim 5

The IC of claim 1, wherein the material from which the conductive bumps are formed liquefies in a temperature range of 145° centigrade to 180° centigrade.

Claim 6

An electronic device for displaying information to a user, the electronic device comprising: a display for presenting the information, the display including a glass substrate having conductive runners formed thereon; an integrated circuit (IC) for attaching to the glass substrate, the IC having cavities formed in a first surface thereof and including an integrated circuit die having circuitry included thereon, the IC comprising: metal layers formed adjacent to the integrated circuit die within the cavities and coupled to the circuitry; conductive bumps formed within the cavities to electrically couple to the circuitry via the metal layers, the conductive bumps comprising a material that adheres to glass such that the conductive bumps electrically couple the circuitry to the conductive runners of the glass substrate when heat is applied thereto; and an adhesive deposited on regions of the first surface of the IC surrounding the cavities in which the conductive bumps are formed for adhering to the glass substrate when the IC is attached thereto, thereby strengthening the bond provided by connections between the conductive bumps and the glass substrate, wherein the conductive bumps extend farther from the first surface of the IC than does the adhesive.

Claim 7

An electronic device for displaying information to a user, the electronic device comprising: a display for presenting the information, the display including a glass substrate having conductive runners formed thereon; an integrated circuit (IC) for attaching to the glass substrate, the IC having cavities formed in a first surface thereof and including an integrated circuit die having circuitry included thereon, the IC comprising: metal layers formed adjacent to the integrated circuit die within the cavities and coupled to the circuitry; conductive bumps formed within the cavities to electrically couple to the circuitry via the metal layers, the conductive bumps comprising a material that adheres to glass such that the conductive bumps electrically couple the circuitry to the conductive runners of the glass substrate when heat is applied thereto; and an adhesive deposited on regions of the first surface of the IC surrounding the cavities in which the conductive bumps are formed for adhering to the glass substrate when the IC is attached thereto, thereby strengthening the bond provided by connections between the conductive bumps and the glass substrate, wherein the conductive bumps extend farther from the first surface of the IC than does the adhesive.

Claim 8

The electronic device of claim 5, wherein the material from which the conductive bumps are formed comprises indium.

Claim 9

The electronic device of claim 5, wherein the material from which the conductive bumps are formed comprises an indium alloy.

Claim 10

The electronic device of claim 5, wherein the material from which the conductive bumps are formed liquefies in a temperature range of 145° centigrade to 180° centigrade.

Claim 11

The electronic device of claim 5, wherein the IC comprises a display driver for providing display signals to the display to generate presentation of the information.

Claim 12

The electronic device of claim 5, further comprising: a printed circuit board on which device circuitry is mounted for performing operations of the electronic device, the printed circuit board including conductive pads formed thereon; and a connector coupled between the conductive pads of the printed circuit board and the conductive runners formed on the glass substrate for providing electrical signals from the device circuitry to the circuitry of the IC.

Claim 13

The electronic device of claim 10, wherein: the device circuitry includes a receiver for receiving a radio signal and a decoder for recovering a message from the radio signal; and the IC includes a display driver for providing display signals to the display to generate presentation of the information in accordance with the message decoded by the device circuitry.