US5976284A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Patterned conducting polymer surfaces and process for preparing the same and devices containing the same
Assignee: Geo Centers Inc
•
Filing: 1997-05-12
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Granted: 1999-11-02
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Expires: 2017-05-12
Abstract
Abstract Patterned conducting polymer surfaces exhibiting excellent properties may be prepared by: (a) forming a surface of a conducting polymer on a surface of a substrate; (b) forming a surface of a blocking material on said surface of said conducting polymer in a pattern-wise fashion, to obtain a first patterned surface containing regions of exposed conducting polymer and regions of blocking material; (c) treating said first patterned surface with an agent which: (i) removes said conducting polymer from said regions of exposed conducting polymer; (ii) decreases the conductivity of said conducting polymer in said regions of exposed conducting polymer; or (iii) increases the conductivity of said conducting polymer in said regions of exposed conducting polymer; and (d) removing said blocking material to obtain a second patterned surface containing an exposed pattern of conducting polymer.
Inventors
- 👤 Jeffrey M. Calvert
- 👤 Terrence G. Vargo
- 👤 Ranganathan Shashidhar
- 👤 Mu-San Chen
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 15:08
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/02; G; G02; G02F; G02F1/00; G02F1/01; G02F1/13; G02F1/133; G02F1/1333; G02F1/1343; G02F1/13439; G03; G03F; G03F7/00; G03F7/0005; G03F7/0007; H01; H01B; H01B1/00; H01B1/06; H01B1/12; H01B1/124; H01B1/125; H01B1/127; H01B1/128; H01G; H01G11/00; H01G11/22; H01G11/30; H01G11/48; H01G11/54; H01G11/56; G02F1/133305; Y; Y02; Y02E; Y02E60/00; Y02E60/13
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
119 words
A process for preparing a patterned conducting polymer surface, said process comprising: (a) forming a surface of a conducting polymer on a surface of a substrate; (b) forming a surface of a blocking material on said surface of said conducting polymer in a pattern-wise fashion, to obtain a first patterned surface containing regions of exposed conducting polymer and regions of blocking material; (c) treating said first patterned surface with an agent which: (i) removes said conducting polymer from said regions of exposed conducting polymer; or (ii) decreases the conductivity of said conducting polymer in said regions of exposed conducting polymer; and (d) removing said blocking material to obtain a second patterned surface containing an exposed pattern of conducting polymer.
Claim 2
Dependent Claim
119 words
A process for preparing a patterned conducting polymer surface, said process comprising: (a) forming a surface of a conducting polymer on a surface of a substrate; (b) forming a surface of a blocking material on said surface of said conducting polymer in a pattern-wise fashion, to obtain a first patterned surface containing regions of exposed conducting polymer and regions of blocking material; (c) treating said first patterned surface with an agent which: (i) removes said conducting polymer from said regions of exposed conducting polymer; or (ii) decreases the conductivity of said conducting polymer in said regions of exposed conducting polymer; and (d) removing said blocking material to obtain a second patterned surface containing an exposed pattern of conducting polymer.
Claim 3
Dependent Claim
27 words
The process of claim 1, wherein said first patterned surface is treated with an agent which removes said conducting polymer from said regions of exposed conducting polymer.
Claim 4
Dependent Claim
66 words
The process of claim 2, wherein said substrate is selected from the group consisting of glass, quartz, silica, silicon, silicon nitride, alumina, aluminum nitride, titania, titanium nitride, diamond, waxes, polyesters, polyvinylacetate, polyolefins, polyethers, polyvinylmethylether, polyvinylbutylether, polyamides, polyacrylamide, polyimides, polycarbonates, polysulfones, polyketones, fluoropolymers, aromatic hydrocarbon polymers, acrylate and acrylic acid polymers, phenolic polymers, polyvinylalcohol, polyamines, polypeptides, siloxane polymers, polyvinylchloride, polyvinylbenzylchloride, polychlorostyrene, polyvinylbutyral, copolymers thereof, and mixtures thereof.
Claim 5
Dependent Claim
31 words
The process of claim 2, wherein said conducting polymer is seleceted from the group consisting of cis and trans polyacetylenes, polydiacetylenes, polyparaphenylenes, polypyrroles, polythiophenes, polybithiophenes, polyisothiophenes, polyphenylenevinylenes, polythienylvinlenes, polyphenylenesulfide, and polyaniline.
Claim 6
Dependent Claim
11 words
The process of claim 2, wherein said conducting polymer is polypyrrole.
Claim 7
Dependent Claim
24 words
The process of claim 5, wherein said agent is selected from the group consisting of ion milling, plasma etching, hypochlorite salts, and cerium (IV).
Claim 8
Dependent Claim
12 words
The process of claim 5, wherein said agent is a hypochlorite salt.
Claim 9
Dependent Claim
135 words
The process of claim 5, wherein said forming a surface of a blocking material on said surface of said conducting polymer in a pattern-wise fashion, to obtain a first patterned surface containing regions of exposed conducting polymer and regions of blocking material, comprises: (b 1 ) forming a surface of a resist on said surface of said conducting polymer; (b 2 ) exposing said surface of said resist to actinic radiation in a pattern-wise fashion to obtain a patterned surface containing regions of resist which have been exposed to said actinic radiation and regions of resist which have not been exposed to said actinic radiation; and (b 3 ) developing said patterned surface obtained in step (b 2 ) to obtain a patterned surface containing regions of exposed conducting polymer and regions of remaining resist.
Claim 10
Dependent Claim
11 words
The process of claim 2, wherein said conducting polymer is polyaniline.
Claim 11
Dependent Claim
25 words
The process of claim 9, wherein said agent is selected from the group consisting of ion milling, plasma etching, hypochlorite salts, and cerium (IV) salts.
Claim 12
Dependent Claim
12 words
The process of claim 9, wherein said agent is a hypochlorite salt.
Claim 13
Dependent Claim
135 words
The process of claim 9, wherein said forming a surface of a blocking material on said surface of said conducting polymer in a pattern-wise fashion, to obtain a first patterned surface containing regions of exposed conducting polymer and regions of blocking material, comprises: (b 1 ) forming a surface of a resist on said surface of said conducting polymer; (b 2 ) exposing said surface of said resist to actinic radiation in a pattern-wise fashion to obtain a patterned surface containing regions of resist which have been exposed to said actinic radiation and regions of resist which have not been exposed to said actinic radiation; and (b 3 ) developing said patterned surface obtained in step (b 2 ) to obtain a patterned surface containing regions of exposed conducting polymer and regions of remaining resist.
Claim 14
Dependent Claim
30 words
The process of claim 1, wherein said first patterned surface is treated with an agent which decreases the conductivity of said conducting polymer in said regions of exposed conducting polymer.
Claim 15
Dependent Claim
66 words
The process of claim 13, wherein said substrate is selected from the group consisting of glass, quartz, silica, silicon, silicon nitride, alumina, aluminum nitride, titania, titanium nitride, diamond, waxes, polyesters, polyvinylacetate, polyolefins, polyethers, polyvinylmethylether, polyvinylbutylether, polyamides, polyacrylamide, polyimides, polycarbonates, polysulfones, polyketones, fluoropolymers, aromatic hydrocarbon polymers, acrylate and acrylic acid polymers, phenolic polymers, polyvinylalcohol, polyamines, polypeptides, siloxane polymers, polyvinylchloride, polyvinylbenzylchloride, polychlorostyrene, polyvinylbutyral, copolymers thereof, and mixtures thereof.
Claim 16
Dependent Claim
31 words
The process of claim 13, wherein said conducting polymer is seleceted from the group consisting of cis and trans polyacetylenes, polydiacetylenes, polyparaphenylenes, polypyrroles, polythiophenes, polybithiophenes, polyisothiophenes, polyphenylenevinylenes, polythienylvinlenes, polyphenylenesulfide, and polyaniline.
Claim 17
Dependent Claim
11 words
The process of claim 13, wherein said conducting polymer is polypyrrole.
Claim 18
Dependent Claim
32 words
The process of claim 16, wherein said agent is selected from the group consisting of aqueous R 4-x NH x + OH - (where R is C 1-4 -alkyl) and aerial oxidation.
Claim 19
Dependent Claim
24 words
The process of claim 14, wherein said agent is a aqueous R 4-x NH x + OH - (where R is C 1-4 -alkyl).
Claim 20
Dependent Claim
135 words
The process of claim 14, wherein said forming a surface of a blocking material on said surface of said conducting polymer in a pattern-wise fashion, to obtain a first patterned surface containing regions of exposed conducting polymer and regions of blocking material, comprises: (b 1 ) forming a surface of a resist on said surface of said conducting polymer; (b 2 ) exposing said surface of said resist to actinic radiation in a pattern-wise fashion to obtain a patterned surface containing regions of resist which have been exposed to said actinic radiation and regions of resist which have not been exposed to said actinic radiation; and (b 3 ) developing said patterned surface obtained in step (b 2 ) to obtain a patterned surface containing regions of exposed conducting polymer and regions of remaining resist.
Claim 21
Dependent Claim
11 words
The process of claim 13, wherein said conducting polymer is polyaniline.
Claim 22
Dependent Claim
32 words
The process of claim 20, wherein said agent is selected from the group consisting of aqueous R 4-x NH x + OH - (where R is C 1-4 -alkyl) and aerial oxidation.
Claim 23
Dependent Claim
23 words
The process of claim 20, wherein said agent is aqueous R 4-x NH x + OH - (where R is C 1-4 -alkyl).
Claim 24
Dependent Claim
135 words
The process of claim 20, wherein said forming a surface of a blocking material on said surface of said conducting polymer in a pattern-wise fashion, to obtain a first patterned surface containing regions of exposed conducting polymer and regions of blocking material, comprises: (b 1 ) forming a surface of a resist on said surface of said conducting polymer; (b 2 ) exposing said surface of said resist to actinic radiation in a pattern-wise fashion to obtain a patterned surface containing regions of resist which have been exposed to said actinic radiation and regions of resist which have not been exposed to said actinic radiation; and (b 3 ) developing said patterned surface obtained in step (b 2 ) to obtain a patterned surface containing regions of exposed conducting polymer and regions of remaining resist.
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| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 7.5 Years (Year 8) | 2006-11-01 | 2007-05-03 | 2007-11-02 | $3760.00 | Window Closed / Lapsed |
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