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US5968279A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of cleaning wafer substrates

Assignee: Mattson Technology Inc
•
Filing: 1997-06-13
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Granted: 1999-10-19
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Expires: 2017-06-13
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Abstract

Abstract The silicon surface of a wafer is cleaned at room temperature in a separate pre-clean chamber prior to epitaxial deposition. Fluorine atoms generated, for example, from NF3 gas, enter the pre-clean chamber, contact the silicon surface, and etch away native oxide, contaminated silicon, and other damage incurred from prior wafer processes. The cleaned wafer is then transferred in an oxygen-free environment to a deposition chamber, for epitaxial deposition. By cleaning at reduced temperatures, autodoping, slip, and other stress-related problems are alleviated. By using a separate chamber for cleaning, system throughput is increased when compared to prior systems using conventional cleaning methods.

Inventors

  • 👤 Joseph H. MacLeish
  • 👤 Mahesh K. Sanganeria

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 01:47
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0402; H10P72/0406

Claims Analysis

Total Claims: 15
Claim 1
Independent Claim 54 words
A method for cleaning a silicon surface comprising: inserting a wafer into a pre-clean chamber, wherein said pre-clean chamber is separate from a deposition chamber; and introducing a nitrogen trifluoride gas mixture into said pre-clean chamber, wherein said wafer in said pre-clean chamber is at a temperature lower than a temperature for epitaxial deposition.
Claim 2
Independent Claim 54 words
A method for cleaning a silicon surface comprising: inserting a wafer into a pre-clean chamber, wherein said pre-clean chamber is separate from a deposition chamber; and introducing a nitrogen trifluoride gas mixture into said pre-clean chamber, wherein said wafer in said pre-clean chamber is at a temperature lower than a temperature for epitaxial deposition.
Claim 3
Dependent Claim 39 words
The method of claim 1 wherein said nitrogen trifluoride gas mixture comprises a diluent at a flow rate in the range of approximately 20-200 sccm and nitrogen trifluoride at a flow rate in the range of approximately 2-30 sccm.
Claim 4
Dependent Claim 19 words
The method of claim 2 wherein said diluent is selected from the group consisting of argon, nitrogen and helium.
Claim 5
Dependent Claim 24 words
The method of claim 1 wherein said nitrogen trifluoride gas mixture is at a pressure in the range of approximately 0.1 to 10 torr.
Claim 6
Dependent Claim 24 words
The method of claim 1 wherein said nitrogen trifluoride gas mixture is subjected to an RF power in the range of approximately 100-500 watts.
Claim 7
Dependent Claim 16 words
The method of claim 1 wherein said temperature of said wafer is at approximately room temperature.
Claim 8
Independent Claim 48 words
A system for cleaning a silicon surface comprising a pre-clean chamber, wherein said pre-clean chamber is separate from a deposition chamber, and wherein said pre-clean chamber comprises means for introducing fluorine atoms into said pre-clean chamber for cleaning a wafer at a temperature lower than for epitaxial deposition.
Claim 9
Independent Claim 48 words
A system for cleaning a silicon surface comprising a pre-clean chamber, wherein said pre-clean chamber is separate from a deposition chamber, and wherein said pre-clean chamber comprises means for introducing fluorine atoms into said pre-clean chamber for cleaning a wafer at a temperature lower than for epitaxial deposition.
Claim 10
Dependent Claim 29 words
The method of claim 1, further comprising generating a plasma with said nitrogen trifluoride gas mixture by a plasma generator outside of said pre-clean chamber prior to said introducing.
Claim 11
Dependent Claim 24 words
The method of claim 1, further comprising heating nitrogen trifluoride gas by a heating source outside of said pre-claim chamber prior to said introducing.
Claim 12
Dependent Claim 25 words
The system of claim 7, further comprising a means for generating said fluorine atoms, wherein said means for generating are located outside said pre-clean chamber.
Claim 13
Dependent Claim 14 words
The system of claim 10, wherein said means for generating is a plasma generator.
Claim 14
Dependent Claim 14 words
The system of claim 10, wherein said means for generating is a heating source.
Claim 15
Dependent Claim 12 words
The system of claim 7, wherein said temperature is approximately room temperature.

References Cited (Backward Citations)

US4985372A Cited
US5228950A Cited
US5413670A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2002-10-18 2003-04-19 2003-10-19 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2006-10-18 2007-04-19 2007-10-19 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2010-10-18 2011-04-19 2011-10-19 $7700.00 Window Closed / Lapsed

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