Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
55 words
An anisotropically electroconductive adhesive comprising an electrically insulating adhesive matrix and electroconductive particles dispersed in the matrix, wherein the electroconductive particles comprise at least two electroconductive particulate products of different average particle sizes and wherein each particle of both the particulate products is coated with an electrically insulating resin insoluble in the insulating adhesive matrix.
Claim 2
Dependent Claim
55 words
An anisotropically electroconductive adhesive comprising an electrically insulating adhesive matrix and electroconductive particles dispersed in the matrix, wherein the electroconductive particles comprise at least two electroconductive particulate products of different average particle sizes and wherein each particle of both the particulate products is coated with an electrically insulating resin insoluble in the insulating adhesive matrix.
Claim 3
Dependent Claim
32 words
An anisotropically electroconductive adhesive as claimed in claim 1, wherein the particles of said at least two electroconductive particulate products of different average particle sizes are deformable upon application of a pressure.
Claim 4
Dependent Claim
45 words
An anisotropically electroconductive adhesive as claimed in claim 1, wherein the hardness of the particles of the electroconductive particulate product having smaller average particle size is at least the same as that of the particles of the electroconductive particulate product having greater average particle size.
Claim 5
Dependent Claim
87 words
An anisotropically electroconductive adhesive as claimed in claim 1, wherein the K-value for the particles of the electroconductive particulate product having smaller average particle size is 350 kgf/mm 2 or higher and that for the particles of the electroconductive particulate product having greater average particle size is 450 kgf/mm 2 or lower and wherein the K-value for the particles of the electroconductive particulate product having smaller average particle size is greater relative to that for the particles of the electroconductive particulate product having greater average particle size.
Claim 6
Dependent Claim
43 words
An anisotropically electroconductive adhesive as claimed in claim 1, wherein the total number of particles for the electroconductive particulate product having smaller average particle size in the adhesive is greater than that for the electroconductive particulate product having greater average particle size therein.
Claim 7
Dependent Claim
33 words
An anisotropically electroconductive adhesive as claimed in claim 1, wherein the electroconductive particles dispersed therein are composed of two electroconductive particulate products of average particle sizes of 3±0.5 μm and 5±0.5 μm, respectively.
Claim 8
Dependent Claim
32 words
An anisotropically electroconductive adhesive as claimed in claim 1, which is to be used for connecting terminal electrodes of an IC chip with corresponding terminals of an electric circuit on a substrate.
Claim 9
Dependent Claim
40 words
An anisotropically electroconductive adhesive as claimed in claim 1, which is to be used for connecting microbumps of a size of 4,000 μm 2 or smaller formed on an IC chip with corresponding terminals of electric circuit on a substrate.
Claim 10
Dependent Claim
64 words
An anisotropically electroconductive adhesive film comprising an anisotropically electroconductive adhesive, the said adhesive comprising an electrically insulating adhesive matrix and electroconductive particles dispersed in the matrix, wherein the electroconductive particles comprise at least two electroconductive particulate products of different average particle sizes and wherein each particle of both the particulate products is coated with an electrically insulating resin insoluble in the insulating adhesive matrix.
Claim 11
Dependent Claim
64 words
An anisotropically electroconductive adhesive film comprising an anisotropically electroconductive adhesive, the said adhesive comprising an electrically insulating adhesive matrix and electroconductive particles dispersed in the matrix, wherein the electroconductive particles comprise at least two electroconductive particulate products of different average particle sizes and wherein each particle of both the particulate products is coated with an electrically insulating resin insoluble in the insulating adhesive matrix.
Claim 12
Dependent Claim
33 words
An anisotropically electroconductive adhesive film as claimed in claim 9, which is to be used for connecting terminal electrodes of an IC chip with corresponding terminals of an electric circuit on a substrate.
Claim 13
Dependent Claim
42 words
An anisotropically electroconductive adhesive film as claimed in claim 9, which is to be used for binding microbumps of a size of 4,000 μm 2 or smaller formed on an IC chip with corresponding terminals of an electric circuit on a substrate.
Claim 14
Dependent Claim
85 words
An anisotropically electroconductive adhesive film as claimed in claim 9, wherein the content of the electroconductive particles in the adhesive film in terms of number of particles thereof per unit surface area of the film is in the range from 30,000 to 80,000 particles/mm 2 , for the particles of the electroconductive particulate product having smaller average particle size, and is in the range from 10,000 to 30,000 particles/mm 2 , for the particles of the electroconductive particulate product having greater average particle size, respectively.
Claim 15
Dependent Claim
46 words
An anisotropically electroconductive adhesive film as claimed in claim 9, wherein the thickness of the film is 1-3 times the sum of the height of the microbump formed on the IC chip to be bound plus the height of the circuit pattern formed on the substrate.