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US5963429A Expired / Lapsed US ⏱️ 0.0 years remaining

Printed circuit substrate with cavities for encapsulating integrated circuits

Assignee: Intermedics Inc
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Filing: 1997-08-20
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Granted: 1999-10-05
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Expires: 2017-08-20
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Abstract

Abstract A printed circuit board substrate includes cavities in which electronic components, such as integrated circuits, are mounted and encapsulated. Once the electronic components are encapsulated, other electronic components can be mounted above the encapsulated component on the top surface of the substrate, thereby increasing the number of components that can be mounted to a circuit board of a given area. The encapsulated components are mounted using any one of a variety of techniques. The substrate may include multiple conductive layers for electrically interconnecting the encapsulated components to other components.

Inventors

  • 👤 Philip H. Chen

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-03 17:47
CPC Classifications
H; H10; H10W; H10W90/00; A; A61; A61N; A61N1/00; A61N1/18; A61N1/32; A61N1/36; A61N1/372; A61N1/375; A61N1/3758; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W72/00; H10W72/071; H10W72/073; H10W72/07351; H10W72/07352; H10W72/30; H10W72/321; H10W72/851; H10W72/874; H10W72/884; H10W90/20; H10W90/22; H10W90/701; H10W90/721; H10W90/724; H10W90/751; H10W90/754

Claims Analysis

Total Claims: 12
Claim 1
Independent Claim 87 words
A printed circuit board, comprising: a substrate including a top surface and a cavity; a first electronic device disposed in said cavity; encapsulation material covering said first electronic device and forming a support surface; and a second electronic device at least partially supported by said support surface of said encapsulating material, wherein said support surface has a first predetermined surface area and said second electronic device has a footprint of a second predetermined area, and wherein said second predetermined area is less than said first predetermined area.
Claim 2
Dependent Claim 87 words
A printed circuit board, comprising: a substrate including a top surface and a cavity; a first electronic device disposed in said cavity; encapsulation material covering said first electronic device and forming a support surface; and a second electronic device at least partially supported by said support surface of said encapsulating material, wherein said support surface has a first predetermined surface area and said second electronic device has a footprint of a second predetermined area, and wherein said second predetermined area is less than said first predetermined area.
Claim 3
Dependent Claim 25 words
The printed circuit board of claim 1 wherein said support surface of said encapsulating material is substantially coplanar with said top surface of said substrate.
Claim 4
Dependent Claim 16 words
The printed circuit board of claim 1 wherein said first electronic device is an integrated circuit.
Claim 5
Dependent Claim 15 words
The printed circuit board of claim 3 said second electronic device is an integrated circuit.
Claim 6
Dependent Claim 29 words
The printed circuit board of claim 1 wherein said second electronic device is mounted on said substrate such that said footprint is entirely within said first predetermined surface area.
Claim 7
Dependent Claim 68 words
A printed circuit board, comprising: a substrate including a top surface and a cavity: a first electronic device disposed in said cavity; encapsulation material covering said first electronic device and forming a support surface; and a second electronic device at least partially supported by said support surface of said encapsulating material, wherein said support surface of said encapsulating material is recessed from said top surface of said substrate.
Claim 8
Dependent Claim 68 words
A printed circuit board, comprising: a substrate including a top surface and a cavity: a first electronic device disposed in said cavity; encapsulation material covering said first electronic device and forming a support surface; and a second electronic device at least partially supported by said support surface of said encapsulating material, wherein said support surface of said encapsulating material is recessed from said top surface of said substrate.
Claim 9
Dependent Claim 115 words
An implantable medical device comprising: an electrode configurable to deliver an electrical shock to a heart; and a printed circuit board configured to provide said electrical shock, wherein the printed circuit board comprises: a substrate including a top surface and a cavity; a first electronic device mounted in said cavity; encapsulation material covering said first electronic device and forming a support surface; and a second electronic device at least partially supported by said support surface of said encapsulating material, wherein said support surface has a first predetermined surface area and said second electronic device has a footprint of a second predetermined area, and wherein said second predetermined area is less than said first predetermined area.
Claim 10
Dependent Claim 115 words
An implantable medical device comprising: an electrode configurable to deliver an electrical shock to a heart; and a printed circuit board configured to provide said electrical shock, wherein the printed circuit board comprises: a substrate including a top surface and a cavity; a first electronic device mounted in said cavity; encapsulation material covering said first electronic device and forming a support surface; and a second electronic device at least partially supported by said support surface of said encapsulating material, wherein said support surface has a first predetermined surface area and said second electronic device has a footprint of a second predetermined area, and wherein said second predetermined area is less than said first predetermined area.
Claim 11
Dependent Claim 97 words
An implantable medical device which comprises: an electrode configurable to deliver an electrical shock to a heart; and a printed circuit board configured to provide said electrical shock, wherein the printed circuit board comprises: a substrate including a top surface and a cavity; a first electronic device mounted in said cavity; encapsulation material covering said first electronic device and forming a support surface; and a second electronic device at least partially supported by said support surface of said encapsulating material, wherein said support surface of said encapsulating material is recessed from said top surface of said substrate.
Claim 12
Dependent Claim 97 words
An implantable medical device which comprises: an electrode configurable to deliver an electrical shock to a heart; and a printed circuit board configured to provide said electrical shock, wherein the printed circuit board comprises: a substrate including a top surface and a cavity; a first electronic device mounted in said cavity; encapsulation material covering said first electronic device and forming a support surface; and a second electronic device at least partially supported by said support surface of said encapsulating material, wherein said support surface of said encapsulating material is recessed from said top surface of said substrate.

References Cited (Backward Citations)

JPS5944852A Cited
JPH0226080A Cited
US5182632A Cited
US5373843A Cited
JPH0621328A Cited
JPH0730059A Cited
US5608262A Cited
US5646828A Cited
US5801438A Cited
US5831833A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2002-10-04 2003-04-05 2003-10-05 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2006-10-04 2007-04-05 2007-10-05 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2010-10-04 2011-04-05 2011-10-05 $7700.00 Window Closed / Lapsed

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