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US5959842A Expired / Lapsed US ⏱️ 0.0 years remaining

Surface mount power supply package and method of manufacture thereof

Assignee: TE Connectivity Solutions GmbH
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Filing: 1998-05-14
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Granted: 1999-09-28
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Expires: 2018-05-14
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Abstract

Abstract A surface mount package for containing a board-mounted power supply, a method of manufacturing the same and a board-mounted power supply employing the package. In one embodiment, the package includes: (1) a plurality of leads having first ends and second, surface mount ends, (2) a dielectric lead frame that retains the plurality of leads in predetermined positions relative to one another such that at least some of the second, surface mount ends are co-planar, the first ends couplable to the board-mounted power supply, (3) a shell, coupled to the lead frame, that forms a portion of a periphery of the surface mount package and (4) potting material located between the lead frame and the shell.

Inventors

  • 👤 Scott E. Leonard
  • 👤 Yi Teh Shih
  • 👤 William L. Woods, Jr.

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 18:57
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/02; H05K7/10; H05K7/1092; H05K1/00; H05K1/02; H05K1/14; H05K1/141; H05K2201/00; H05K2201/10; H05K2201/10007; H05K2201/1003; H05K2201/10166; H05K2201/10227; H05K2201/10424; H05K2203/00; H05K2203/08; H05K2203/082; H05K3/00; H05K3/30; H05K3/303; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H05K3/3447; H05K3/36; H05K3/368

Claims Analysis

Total Claims: 24
Claim 1
Independent Claim 106 words
A surface mount package for containing a board-mounted power supply, comprising: a plurality of leads having first ends and second, surface mount ends; a dielectric lead frame that retains said plurality of leads in predetermined positions relative to one another such that at least some of said second, surface mount ends are co-planar, said first ends couplable to said board-mounted power supply; a shell, coupled to said lead frame, that forms a portion of a periphery of said surface mount package; and potting material located between said lead frame and said shell and adapted to resist movement of said board-mounted power supply within said surface-mount package.
Claim 2
Dependent Claim 106 words
A surface mount package for containing a board-mounted power supply, comprising: a plurality of leads having first ends and second, surface mount ends; a dielectric lead frame that retains said plurality of leads in predetermined positions relative to one another such that at least some of said second, surface mount ends are co-planar, said first ends couplable to said board-mounted power supply; a shell, coupled to said lead frame, that forms a portion of a periphery of said surface mount package; and potting material located between said lead frame and said shell and adapted to resist movement of said board-mounted power supply within said surface-mount package.
Claim 3
Dependent Claim 26 words
The package as recited in claim 1 wherein said first ends are through-hole mount ends adapted to pass through corresponding vias in said board-mounted power supply.
Claim 4
Dependent Claim 30 words
The package as recited in claim 1 wherein said lead frame has a potting port that allows said potting material to be introduced between said lead frame and said shell.
Claim 5
Dependent Claim 30 words
The package as recited in claim 1 wherein said lead frame has a retention clip that engages and mechanically retains said board-mounted power supply in contact with said first ends.
Claim 6
Dependent Claim 38 words
The package as recited in claim 1 wherein said board-mounted power supply has a magnetic core associated therewith, said package further comprising a compliant material, proximate said magnetic core, that absorbs compressive forces generated in said potting material.
Claim 7
Dependent Claim 27 words
The package as recited in claim 1 wherein said shell has a retention clip that engages and mechanically retains said lead frame in contact with said shell.
Claim 8
Dependent Claim 18 words
The package as recited in claim 1 wherein said lead frame and said shell are composed of plastic.
Claim 9
Independent Claim 117 words
A method of manufacturing a surface mount package for containing a board-mounted power supply, comprising the steps of: forming a plurality of leads having first ends and second, surface mount ends; retaining, with a dielectric lead frame, said plurality of leads in predetermined positions relative to one another such that at least some of said second, surface mount ends are co-planar, said first ends couplable to said board-mounted power supply; coupling a shell to said lead frame, said shell forming a portion of a periphery of said surface mount package; and introducing potting material between said lead frame and said shell, said potting material adapted to resist movement of said board-mounted power supply within said surface-mount package.
Claim 10
Independent Claim 117 words
A method of manufacturing a surface mount package for containing a board-mounted power supply, comprising the steps of: forming a plurality of leads having first ends and second, surface mount ends; retaining, with a dielectric lead frame, said plurality of leads in predetermined positions relative to one another such that at least some of said second, surface mount ends are co-planar, said first ends couplable to said board-mounted power supply; coupling a shell to said lead frame, said shell forming a portion of a periphery of said surface mount package; and introducing potting material between said lead frame and said shell, said potting material adapted to resist movement of said board-mounted power supply within said surface-mount package.
Claim 11
Dependent Claim 26 words
The method as recited in claim 8 wherein said first ends are through-hole mount ends adapted to pass through corresponding vias in said board-mounted power supply.
Claim 12
Dependent Claim 28 words
The method as recited in claim 8 wherein said step of introducing comprises the step of introducing said potting material through a potting port in said lead frame.
Claim 13
Dependent Claim 36 words
The method as recited in claim 8 wherein said lead frame has a retention clip, said method further comprising the step of engaging and mechanically retaining a board-mounted power supply in contact with said first ends.
Claim 14
Dependent Claim 46 words
The method as recited in claim 8 wherein said board-mounted power supply has a magnetic core associated therewith, said method further comprising the step of placing a compliant material proximate said magnetic core, said compliant material adapted to absorb compressive forces generated in said potting material.
Claim 15
Dependent Claim 38 words
The method as recited in claim 8 wherein said shell has a retention clip, said step of coupling comprising the step of engaging and mechanically retaining said lead frame in contact with said shell with said retention clip.
Claim 16
Dependent Claim 28 words
The method as recited in claim 8 wherein said lead frame and said shell are composed of plastic and wherein said lead frame comprises a removable pick-and-place bridge.
Claim 17
Dependent Claim 118 words
A surface mount packaged power supply, comprising: a plurality of leads having first ends and second, surface mount ends; a dielectric lead frame that retains said plurality of leads in predetermined positions relative to one another such that at least some of said second, surface mount ends are co-planar; a power supply having a magnetic core associated therewith and conductors coupled to at least some of said first ends; a shell, coupled to said lead frame, that forms a portion of a periphery of said surface mount package; and potting material, located between said lead frame and said shell and at least partially surrounding said power supply, that resists movement of said power supply within said surface-mount package.
Claim 18
Dependent Claim 118 words
A surface mount packaged power supply, comprising: a plurality of leads having first ends and second, surface mount ends; a dielectric lead frame that retains said plurality of leads in predetermined positions relative to one another such that at least some of said second, surface mount ends are co-planar; a power supply having a magnetic core associated therewith and conductors coupled to at least some of said first ends; a shell, coupled to said lead frame, that forms a portion of a periphery of said surface mount package; and potting material, located between said lead frame and said shell and at least partially surrounding said power supply, that resists movement of said power supply within said surface-mount package.
Claim 19
Dependent Claim 39 words
The power supply as recited in claim 15 wherein said first ends are through-hole mount ends and wherein said power supply comprises a circuit board having corresponding vias therein, said through-hole mount ends adapted to pass through said vias.
Claim 20
Dependent Claim 31 words
The power supply as recited in claim 15 wherein said lead frame has a potting port that allows said potting material to be introduced between said lead frame and said shell.
Claim 21
Dependent Claim 31 words
The power supply as recited in claim 15 wherein said lead frame has a retention clip that engages and mechanically retains said board-mounted power supply in contact with said first ends.
Claim 22
Dependent Claim 26 words
The power supply as recited in claim 15 further comprising a compliant material, proximate said magnetic core, that absorbs compressive forces generated in said potting material.
Claim 23
Dependent Claim 28 words
The power supply as recited in claim 15 wherein said shell has a retention clip that engages and mechanically retains said lead frame in contact with said shell.
Claim 24
Dependent Claim 19 words
The power supply as recited in claim 15 wherein said lead frame and said shell are composed of plastic.

References Cited (Backward Citations)

US4645943A Cited
US4899256A Cited
US5526234A Cited
USD357901S Cited
US5757251A Cited
US5703754A Cited
US5835350A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2002-09-27 2003-03-29 2003-09-28 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2006-09-27 2007-03-29 2007-09-28 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2010-09-27 2011-03-29 2011-09-28 $7700.00 Window Closed / Lapsed

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