Patent US5949138A successfully refreshed from Google Patents.
US5949138A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Heat spreader
Assignee: Texas Instruments Inc
•
Filing: 1997-10-31
•
Granted: 1999-09-07
•
Expires: 2017-10-31
Abstract
Abstract A heat spreader (10) is provided for dissipating heat from a semiconductor die (32). The heat spreader (10) comprises a thermally conductive sheet (12) having an aperture (14) formed therein. At least one set of opposing members (20) extends inwardly, but do not contact, within the aperture (14). The opposing members (20) can receive adhesive material for securing the semiconductor die (32) to the heat spreader (10) such that the semiconductor die (32) is disposed over the aperture (14).
Inventors
- 👤 Primitivo A. Palasi
- 👤 Ronaldo M. Arguelles
- 👤 Philip B. Simon
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 14:44
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/778
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
58 words
A device for dissipating heat from a semiconductor die comprising a thermally conductive sheet having an aperture formed therein and at least one set of opposing members extending inwardly but not contacting within the aperture, the opposing members operable to receive adhesive material for securing the semiconductor die such that the semiconductor die is disposed over the aperture.
Claim 2
Independent Claim
58 words
A device for dissipating heat from a semiconductor die comprising a thermally conductive sheet having an aperture formed therein and at least one set of opposing members extending inwardly but not contacting within the aperture, the opposing members operable to receive adhesive material for securing the semiconductor die such that the semiconductor die is disposed over the aperture.
Claim 3
Dependent Claim
32 words
The device of claim 1, wherein each opposing member further comprises: at least one extension extending inwardly in the aperture from the thermally conductive sheet; and a platform coupled to the extension.
Claim 4
Dependent Claim
42 words
The device of claim 1, wherein the aperture has a shape that is substantially similar to a perimeter edge of the semiconductor die such that the semiconductor die overlaps the thermally conductive sheet at the perimeter edge when secured to the device.
Claim 5
Dependent Claim
13 words
The device of claim 1, wherein the aperture has a substantially rectangular shape.
Claim 6
Dependent Claim
34 words
The device of claim 1, wherein: the aperture has a substantially rectangular shape defining a plurality of corners; and each opposing member further comprises an extension extending inwardly in the aperture from a corner.
Claim 7
Dependent Claim
17 words
The device of claim 5, wherein each opposing member further comprises a platform connected to the extension.
Claim 8
Dependent Claim
34 words
The device of claim 1, wherein: the aperture has a substantially rectangular shape defining a plurality of sides; and each opposing member further comprises an extension extending inwardly in the aperture from a side.
Claim 9
Dependent Claim
12 words
The device of claim 1, wherein the device is formed from metal.
Claim 10
Dependent Claim
24 words
The device of claim 1, wherein the device is formed from a material selected from the group comprising copper, aluminum, gold, silver, and titanium.
Claim 11
Independent Claim
100 words
A device for dissipating heat from a semiconductor die, comprising: a thermally conductive sheet having an aperture formed therein, the aperture having a shape that is substantially similar to a perimeter edge of the semiconductor die; at least one set of opposing members coupled to the thermally conductive sheet and extending inwardly but not contacting within the aperture, the opposing members operable to receive adhesive material for securing the semiconductor die such that the semiconductor die is disposed over the aperture; and wherein the semiconductor die overlaps the thermally conductive sheet at the perimeter edge when secured to the device.
Claim 12
Independent Claim
100 words
A device for dissipating heat from a semiconductor die, comprising: a thermally conductive sheet having an aperture formed therein, the aperture having a shape that is substantially similar to a perimeter edge of the semiconductor die; at least one set of opposing members coupled to the thermally conductive sheet and extending inwardly but not contacting within the aperture, the opposing members operable to receive adhesive material for securing the semiconductor die such that the semiconductor die is disposed over the aperture; and wherein the semiconductor die overlaps the thermally conductive sheet at the perimeter edge when secured to the device.
Claim 13
Dependent Claim
32 words
The device of claim 10, wherein each opposing member further comprises: at least one extension extending inwardly in the aperture from the thermally conductive sheet; and a platform coupled to the extension.
Claim 14
Dependent Claim
34 words
The device of claim 10, wherein: the aperture has a substantially rectangular shape defining a plurality of corners; and each opposing member further comprises an extension extending inwardly in the aperture from a corner.
Claim 15
Dependent Claim
17 words
The device of claim 12, wherein each opposing member further comprises a platform connected to the extension.
Claim 16
Dependent Claim
34 words
The device of claim 10, wherein: the aperture has a substantially rectangular shape defining a plurality of sides; and each opposing member further comprises an extension extending inwardly in the aperture from a side.
Claim 17
Dependent Claim
24 words
The device of claim 10, wherein the device is formed from a material selected from the group comprising copper, aluminum, gold, silver, and titanium.
Claim 18
Dependent Claim
87 words
A packaged semiconductor device comprising: a semiconductor die; a heat spreader comprising a thermally conductive sheet having an aperture formed therein and at least one set of opposing members extending inwardly in the aperture, the heat spreader attached to the semiconductor die at the opposing members such that the semiconductor die is disposed over the aperture, the heat spreader operable to transfer heat away from the semiconductor die; and a leadframe attached to the heat spreader, the leadframe operable to transfer heat away from the heat spreader.
Claim 19
Dependent Claim
87 words
A packaged semiconductor device comprising: a semiconductor die; a heat spreader comprising a thermally conductive sheet having an aperture formed therein and at least one set of opposing members extending inwardly in the aperture, the heat spreader attached to the semiconductor die at the opposing members such that the semiconductor die is disposed over the aperture, the heat spreader operable to transfer heat away from the semiconductor die; and a leadframe attached to the heat spreader, the leadframe operable to transfer heat away from the heat spreader.
Claim 20
Dependent Claim
39 words
The device of claim 16, wherein: the semiconductor die has a perimeter edge; and the aperture has a shape substantially similar to the perimeter edge of the semiconductor die such that the semiconductor die overlaps the thermally conductive sheet.
Claim 21
Dependent Claim
36 words
The device of claim 16, further comprising mold compound in contact with the semiconductor die at an upper surface, the mold compound in further contact with the semiconductor die at a bottom surface through the aperture.
Claim 22
Dependent Claim
34 words
The device of claim 16, wherein: the aperture has a substantially rectangular shape defining a plurality of corners; and each opposing member further comprises an extension extending inwardly in the aperture from a corner.
Claim 23
Dependent Claim
34 words
The device of claim 16, wherein: the aperture has a substantially rectangular shape defining a plurality of sides; and each opposing member further comprises an extension extending inwardly in the aperture from a side.
References Cited (Backward Citations)
JPS54140469A
Cited
JPS59207645A
Cited
US5477081A
Cited
US5206794A
Cited
US5644164A
Cited
US5783860A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-09-06 | 2003-03-08 | 2003-09-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-09-06 | 2007-03-08 | 2007-09-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-09-06 | 2011-03-08 | 2011-09-07 | $7700.00 | Window Closed / Lapsed |