Patent CA819067A successfully refreshed from Google Patents.
Patent US5948204A successfully refreshed from Google Patents.
US5948204A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Wafer carrier ring method and apparatus for chemical-mechanical planarization
Assignee: Intel Corp
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Filing: 1996-12-30
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Granted: 1999-09-07
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Expires: 2016-12-30
Abstract
Abstract The present invention discloses an improvement on a wafer carrier ring for use in a chemical-mechanical polishing apparatus for uniformly polishing semiconductor wafers. The apparatus comprises of a ring assembly, a stainless steel backing plate and a rubber bladder for holding the ring assembly and the backing plate. The ring assembly comprises of two rings. The first ring is made of a soft material such as Delrin or PBT for holding the stainless steel backing plate which is attached to the wafer. A top portion of the first ring is cutoff to leave an annular notch. The second ring is made of a hard material such as stainless steel and is fitted into the annular notch of the first ring. Both rings are attached to the rubber bladder through two sets of screws which are evenly spaced through a circular path concentric to the circumference of the first ring. The stainless steel material of the second ring improves the sealing to the rubber bladder and reduces the bending of the first ring during the polishing process. The results include reduced leakage from the sealing and reducing particle counts.
Inventors
- 👤 James G. Maveety
- 👤 George T. Waller
- 👤 Wayne Gaynor
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 18:07
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/70; H10P72/76; H10P72/7604; H10P72/7616; B; B24; B24B; B24B37/00; B24B37/27; B24B37/30; B24B37/32; H10P72/7624; H10P52/00; H10P52/40; H10P52/402
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
111 words
A method for sealing a wafer carrier plate to a backing plate during a polishing process, the method comprising: securing the backing plate to a rubber bladder; coupling a ring assembly to the carrier plate with the rubber bladder therebetween for sealing and securing the backing plate during the polishing process, the ring assembly including a first ring and a second ring, the first ring having an annular cutoff portion, the second ring being coupled to the first ring by fitting the second ring into the annular cutoff portion of the first ring; and holding the backing plate and the ring assembly together during the polishing process by said rubber bladder.
Claim 2
Independent Claim
111 words
A method for sealing a wafer carrier plate to a backing plate during a polishing process, the method comprising: securing the backing plate to a rubber bladder; coupling a ring assembly to the carrier plate with the rubber bladder therebetween for sealing and securing the backing plate during the polishing process, the ring assembly including a first ring and a second ring, the first ring having an annular cutoff portion, the second ring being coupled to the first ring by fitting the second ring into the annular cutoff portion of the first ring; and holding the backing plate and the ring assembly together during the polishing process by said rubber bladder.
Claim 3
Dependent Claim
40 words
The method of claim 1 wherein the first ring is attached to the wafer carrier plate and the rubber bladder by a first set of screws spaced evenly on a circular path concentric with a circumference of the first ring.
Claim 4
Dependent Claim
58 words
The method of claim 2 wherein the second ring to the first ring further comprises attaching the second ring is attached to the wafer carrier plate and the rubber bladder by a second set of screws spaced evenly on a circular path concentric with a circumference of the first ring and interleaved with the first set of screws.
Claim 5
Dependent Claim
22 words
The method of claim 1 wherein the annular cutoff portion is created by cutting off a top portion of the first ring.
Claim 6
Dependent Claim
25 words
The method of claim 1 wherein the first ring is made of a first material and the second ring is made of a second material.
Claim 7
Dependent Claim
12 words
The method of claim 5 wherein the second material is stainless steel.
Claim 8
Dependent Claim
26 words
The method of claim 5 wherein the first material is selected from the group consisting of polybutylene terephthalate, acetyl plastic, polyester, and poly ether ether ketone.
Claim 9
Dependent Claim
132 words
A tool assembly for use in a polishing process for a wafer comprising: a backing plate for holding the wafer during the polishing process; a frame structure coupled to the backing plate, the frame structure provides a frame attachment to the backing plate; a ring assembly coupled to the frame structure for sealing and securing the backing plate during the polishing processing, the ring assembly comprising: a first ring having an annular cutoff portion, and a second ring coupled to the first ring by fitting the second ring into the annular cutoff portion of the first ring; and a rubber bladder coupled to the backing plate, the frame structure and the ring assembly, the rubber bladder holds the backing plate, the frame structure, and the ring assembly together during the polishing process.
Claim 10
Dependent Claim
132 words
A tool assembly for use in a polishing process for a wafer comprising: a backing plate for holding the wafer during the polishing process; a frame structure coupled to the backing plate, the frame structure provides a frame attachment to the backing plate; a ring assembly coupled to the frame structure for sealing and securing the backing plate during the polishing processing, the ring assembly comprising: a first ring having an annular cutoff portion, and a second ring coupled to the first ring by fitting the second ring into the annular cutoff portion of the first ring; and a rubber bladder coupled to the backing plate, the frame structure and the ring assembly, the rubber bladder holds the backing plate, the frame structure, and the ring assembly together during the polishing process.
Claim 11
Dependent Claim
46 words
The tool assembly of claim 15 wherein the frame structure further comprises: a wafer carrier plate; a retaining ring for providing a support to the wafer carrier; and a first plurality of screws to attach the retaining ring to the rubber bladder and the backing plate.
Claim 12
Dependent Claim
26 words
The tool assembly of claim 15 wherein the first ring is made of a first material and the second ring is made of a second material.
Claim 13
Dependent Claim
27 words
The tool assembly of claim 10 wherein the first material is selected from the group consisting of polybutylene terephthalate, acetyl plastic, polyester, and poly ether ether ketone.
Claim 14
Dependent Claim
13 words
The tool assembly of claim 10 wherein the second material is stainless steel.
Claim 15
Dependent Claim
40 words
The tool assembly of claim 10 wherein the first ring is attached to the frame structure and the rubber bladder by a second plurality of screws spaced evenly on a circular path concentric with a circumference of the first ring.
Claim 16
Dependent Claim
48 words
The tool assembly of claim 13 wherein the second ring is attached to the frame structure and the rubber bladder by a third plurality of screws spaced evenly on a circular path concentric with the circumference of the first ring and interleaved with the second plurality of screws.
References Cited (Backward Citations)
US5635083A
Cited
US5624299A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-09-06 | 2003-03-08 | 2003-09-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-09-06 | 2007-03-08 | 2007-09-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-09-06 | 2011-03-08 | 2011-09-07 | $7700.00 | Window Closed / Lapsed |