US5943597A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Bumped semiconductor device having a trench for stress relief
Assignee: NXP USA Inc
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Filing: 1998-06-15
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Granted: 1999-08-24
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Expires: 2018-06-15
Abstract
Abstract A bumped semiconductor device including bond pad (12) formed on a semiconductor die (10), and a passivation layer (14) overlying the semiconductor die and a portion of the bond pad (12). A solder bump (22) is formed so as to overlie the bond pad (12), and a stress isolation trench (15) is formed in the passivation layer (14), so as to surround the solder bump (22).
Inventors
- 👤 James H. Kleffner
- 👤 Addi Burjorji Mistry
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 16:58
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/20; H10W72/90; H10W72/221; H10W72/241; H10W72/242; H10W72/251; H10W72/29; H10W72/921; H10W72/923; H10W72/931; H10W72/934; H10W72/941; H10W72/9415; H10W74/00; H10W74/10; H10W74/131; H10W74/137; H10W74/147
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
60 words
A method of forming a bumped semiconductor device, the method comprising the steps of: providing a substrate having a bond pad; forming a passivation layer wherein a portion of the passivation layer overlies the bond pad; patterning the passivation layer to form a trench; and forming a bump overlying the bond pad, wherein the bump is surrounded by the trench.
Claim 2
Independent Claim
60 words
A method of forming a bumped semiconductor device, the method comprising the steps of: providing a substrate having a bond pad; forming a passivation layer wherein a portion of the passivation layer overlies the bond pad; patterning the passivation layer to form a trench; and forming a bump overlying the bond pad, wherein the bump is surrounded by the trench.
Claim 3
Dependent Claim
17 words
The method of claim 1, wherein the trench is continuous and forms a closed-loop surrounding the bump.
Claim 4
Dependent Claim
20 words
The method of claim 1, wherein an entirety of the trench extends through an entire thickness of the passivation layer.
Claim 5
Dependent Claim
15 words
The method of claim 1, wherein an entirety of the trench overlies the bond pad.
Claim 6
Dependent Claim
25 words
The method of claim 1, wherein the passivation layer includes a material selected from a group consisting of silicon dioxide, silicon oxynitride, and silicon nitride.
Claim 7
Dependent Claim
22 words
The method of claim 1, further comprising a step of forming an additional layer, wherein the additional layer overlies the passivation layer.
Claim 8
Dependent Claim
12 words
The method of claim 6, wherein the additional layer comprises a polyimide.
Claim 9
Dependent Claim
12 words
The method of claim 6, wherein the additional layer fills the trench.
Claim 10
Dependent Claim
17 words
The method of claim 1, wherein the trench has a width of at least approximately 0.5 microns.
Claim 11
Dependent Claim
18 words
The method of claim 1, wherein the step of forming the bump is performed using an evaporation process.
Claim 12
Dependent Claim
18 words
The method of claim 1, wherein the step of forming the bump is performed using a plating process.
Claim 13
Dependent Claim
50 words
The method of claim 1, wherein: patterning the passivation layer also forms an opening; the opening and the trench are separated by a portion of the passivation layer; and the portion of the passivation layer is bounded by a perimeter of the opening and an inner perimeter of the trench.
Claim 14
Dependent Claim
17 words
The method of claim 12, wherein at least a portion of the bump lies within the opening.
References Cited (Backward Citations)
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Cited
US5834374A
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US5844782A
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US5821608A
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US5834848A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-08-23 | 2003-02-22 | 2003-08-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-08-23 | 2007-02-22 | 2007-08-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-08-23 | 2011-02-22 | 2011-08-24 | $7700.00 | Window Closed / Lapsed |