§
Luxuse
Patent Intelligence
Sign In
Patent US5940271A successfully refreshed from Google Patents.
← Back to Patent Explorer
US5940271A Expired / Lapsed US ⏱️ 0.0 years remaining

Stiffener with integrated heat sink attachment

Assignee: Bell Semiconductor LLC
•
Filing: 1997-05-02
•
Granted: 1999-08-17
•
Expires: 2017-05-02
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract An electronic semiconductor device package, the package comprising: a substrate having traces; a die attached to the substrate; first level interconnects of the die to the traces of the substrate; and a stiffener attached to the substrate, wherein the stiffener comprises at least one clip. A system for attaching a heat sink to an electronic semiconductor device package, the system comprising: a stiffener of the electronic package which is attachable to the electronic package; and at least one clip that is integral with the stiffener and secures the heat sink to the stiffener. A method of detachably attaching a heat sink to an electronic semiconductor device package, the method comprising: attaching a stiffener to the package, wherein the stiffener comprises at least one clip; positioning a heat sink adjacent the stiffener; and engaging the clip with the heat sink, wherein the heat sink is secured to the stiffener by the clip.

Inventors

  • 👤 Atila Mertol

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 11:46
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/60; H10W40/641; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W70/685; H10W72/00; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754

Claims Analysis

Total Claims: 9
Claim 1
Independent Claim 87 words
An electronic semiconductor device package, said package comprising: a substrate having traces; a die attached to said substrate; first level interconnects electrically coupling said die to the traces of said substrate; a stiffener attached to said substrate, wherein said stiffener comprises at least one J shaped clip having a ridge; and a heat sink having a ridge adjacent to said stiffener, wherein the ridge of the J shaped clip of said stiffener engages the ridge of the heat sink to secure said heat sink to said stiffener.
Claim 2
Dependent Claim 87 words
An electronic semiconductor device package, said package comprising: a substrate having traces; a die attached to said substrate; first level interconnects electrically coupling said die to the traces of said substrate; a stiffener attached to said substrate, wherein said stiffener comprises at least one J shaped clip having a ridge; and a heat sink having a ridge adjacent to said stiffener, wherein the ridge of the J shaped clip of said stiffener engages the ridge of the heat sink to secure said heat sink to said stiffener.
Claim 3
Dependent Claim 57 words
An electronic semiconductor devise package, said package comprising: a substrate having traces; a die attached to said substrate; first level interconnects electrically coupling said die to the traces of said substrate; and a stiffener attached to said substrate, wherein said stiffener comprises at least one clip, wherein said clip comprises a set of oppositely facing elbow clips.
Claim 4
Dependent Claim 57 words
An electronic semiconductor devise package, said package comprising: a substrate having traces; a die attached to said substrate; first level interconnects electrically coupling said die to the traces of said substrate; and a stiffener attached to said substrate, wherein said stiffener comprises at least one clip, wherein said clip comprises a set of oppositely facing elbow clips.
Claim 5
Dependent Claim 16 words
A package as in claim 2, wherein said stiffener comprises a shape similar to said substrate.
Claim 6
Dependent Claim 22 words
A package as in claim 2, wherein said stiffener comprises an opening for encapsulant, whereby the stiffener functions as a dam ring.
Claim 7
Dependent Claim 23 words
A package as in claim 2, further comprising a plurality of stiffeners, wherein each stiffener of said plurality is attached to the substrate.
Claim 8
Dependent Claim 17 words
A package as in claim 5, wherein each stiffener of said plurality comprises at least one clip.
Claim 9
Dependent Claim 32 words
A package as in claim 2, further comprising: a heat sink adjacent said stiffener, wherein the clip of said stiffener engages the heat sink to secure said heat sink to said stiffener.

References Cited (Backward Citations)

US4323914A Cited
US5003429A Cited
US5621615A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2002-08-16 2003-02-15 2003-08-17 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2006-08-16 2007-02-15 2007-08-17 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2010-08-16 2011-02-15 2011-08-17 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag