Claims Analysis
Total Claims: 32
Claim 1
Independent Claim
85 words
A phase shifting photomask fabrication method comprising the steps of: forming a recess in a substrate; forming an opaque layer on the substrate and the recess; forming a protection layer having openings on the opaque layer; etching the opaque layer through the openings; forming side wall spacers on each side wall of the opaque layer and the protection layer; etching the substrate to a predetermined depth by using the side wall spacers as a mask; removing the side wall spacers; and removing the protection layer.
Claim 2
Dependent Claim
85 words
A phase shifting photomask fabrication method comprising the steps of: forming a recess in a substrate; forming an opaque layer on the substrate and the recess; forming a protection layer having openings on the opaque layer; etching the opaque layer through the openings; forming side wall spacers on each side wall of the opaque layer and the protection layer; etching the substrate to a predetermined depth by using the side wall spacers as a mask; removing the side wall spacers; and removing the protection layer.
Claim 3
Dependent Claim
30 words
The method of claim 1, wherein the step of forming a recess uses a substrate of a material selected from a group consisting of quartz, silicon, glass, and silicon nitride.
Claim 4
Dependent Claim
19 words
The method of claim 1, wherein the step of forming the protection layer comprises forming an inorganic photoresist layer.
Claim 5
Dependent Claim
33 words
The method of claim 1, wherein the step of forming the protection layer comprises forming an inorganic Ge--Se type photoresist layer having an Ag compound layer within the inorganic Ge--Se type photoresist layer.
Claim 6
Dependent Claim
17 words
The method of claim 1, wherein the step of forming the side wall spacers uses a polymer.
Claim 7
Dependent Claim
22 words
The method of claim 1, wherein a width of each side wall spacer corresponds to a width of a corresponding sub-opening pattern.
Claim 8
Dependent Claim
143 words
A phase shifting photomask fabrication method comprising the steps of: forming a recess in a substrate; forming an opaque layer on the substrate and the recess; forming a first photoresist layer having openings; forming side wall spacers on side walls of the first photoresist layer; etching the opaque layer by using the side wall spacers as a mask to expose an exposed portion of the substrate; forming a second photoresist layer on the exposed portion of the transparent substrate, the first photoresist layer, and the side wall spacers; removing portions of the second photoresist layer not covering the exposed portion of the substrate; removing the first photoresist layer and selected portions of the opaque layer; etching selected portions of the transparent substrate to a depth sufficient to carry out a phase shift; and removing the side wall spacers and the second photoresist layer.
Claim 9
Dependent Claim
143 words
A phase shifting photomask fabrication method comprising the steps of: forming a recess in a substrate; forming an opaque layer on the substrate and the recess; forming a first photoresist layer having openings; forming side wall spacers on side walls of the first photoresist layer; etching the opaque layer by using the side wall spacers as a mask to expose an exposed portion of the substrate; forming a second photoresist layer on the exposed portion of the transparent substrate, the first photoresist layer, and the side wall spacers; removing portions of the second photoresist layer not covering the exposed portion of the substrate; removing the first photoresist layer and selected portions of the opaque layer; etching selected portions of the transparent substrate to a depth sufficient to carry out a phase shift; and removing the side wall spacers and the second photoresist layer.
Claim 10
Dependent Claim
33 words
The method of claim 7, wherein the step of forming a recess in a substrate uses a substrate of a material selected from a group consisting of quartz, silicon, glass, and silicon nitride.
Claim 11
Dependent Claim
20 words
The method of claim 7, wherein the step of forming the first photoresist layer comprises forming an inorganic photoresist layer.
Claim 12
Dependent Claim
34 words
The method of claim 7, wherein the step of forming the first photoresist layer comprises forming an inorganic Ge--Se type photoresist layer having an Ag compound layer within the inorganic Ge--Se type photoresist layer.
Claim 13
Dependent Claim
19 words
The method of claim 7, wherein the step of forming the plurality of side wall spacers uses a polymer.
Claim 14
Dependent Claim
61 words
The method of claim 7, wherein the step of forming the second photoresist layer further comprises the steps of: forming a negative photoresist layer over the substrate, the first photoresist layer, and the side wall spacers; shining a light from beneath the substrate; and removing portions of the negative photoresist layer by treating the negative photoresist layer with a developing solution.
Claim 15
Dependent Claim
20 words
The method of claim 7, wherein the step of forming the second photoresist layer comprises forming a negative photoresist layer.
Claim 16
Independent Claim
92 words
A method of forming a phase shifting photomask comprising the steps of: forming a recess in a substrate; depositing an opaque layer; depositing a first photoresist layer; patterning the first photoresist layer to form openings in the first photoresist layer; removing portions of the opaque layer below the openings in the first photoresist layer; depositing a second photoresist layer; etching the second photoresist layer to form side wall spacers; etching the substrate to a depth sufficient to generate a phase shift; and removing the side wall spacers and the second photoresist layer.
Claim 17
Independent Claim
92 words
A method of forming a phase shifting photomask comprising the steps of: forming a recess in a substrate; depositing an opaque layer; depositing a first photoresist layer; patterning the first photoresist layer to form openings in the first photoresist layer; removing portions of the opaque layer below the openings in the first photoresist layer; depositing a second photoresist layer; etching the second photoresist layer to form side wall spacers; etching the substrate to a depth sufficient to generate a phase shift; and removing the side wall spacers and the second photoresist layer.
Claim 18
Dependent Claim
29 words
The method of claim 14, wherein the step of forming the recess uses substrate of a material selected from a group consisting of quartz, silicon, glass, and silicon nitride.
Claim 19
Dependent Claim
20 words
The method of claim 14, wherein the step of depositing the first photoresist layer comprises depositing an inorganic photoresist layer.
Claim 20
Dependent Claim
34 words
The method of claim 14, wherein the step of depositing the first photoresist layer comprises depositing an inorganic Ge--Se type photoresist layer having an Ag compound layer within the inorganic Ge--Se type photoresist layer.
Claim 21
Dependent Claim
16 words
The method of claim 14, wherein the step of forming side wall spacers uses a polymer.
Claim 22
Dependent Claim
22 words
The method of claim 14, wherein a width of each side wall spacer corresponds to a width of the corresponding sub-opening pattern.
Claim 23
Dependent Claim
18 words
The method of claim 14, wherein the step of depositing the opaque layer comprises depositing a chromium layer.
Claim 24
Independent Claim
106 words
A method of forming a phase shifting photomask comprising the steps of: forming recesses in a substrate; depositing an opaque layer; depositing a first photoresist layer; forming openings in the first photoresist layer; forming side wall spacers on side walls of the first photoresist layer; forming openings in the opaque layer; depositing a second photoresist layer; removing the second photoresist layer except for portions of the second photoresist layer covering the openings in the opaque layer; removing the first photoresist layer and selected portions of the opaque layer; etching the substrate to form sub-opening patterns; and removing the second photoresist layer and the side wall spacers.
Claim 25
Independent Claim
106 words
A method of forming a phase shifting photomask comprising the steps of: forming recesses in a substrate; depositing an opaque layer; depositing a first photoresist layer; forming openings in the first photoresist layer; forming side wall spacers on side walls of the first photoresist layer; forming openings in the opaque layer; depositing a second photoresist layer; removing the second photoresist layer except for portions of the second photoresist layer covering the openings in the opaque layer; removing the first photoresist layer and selected portions of the opaque layer; etching the substrate to form sub-opening patterns; and removing the second photoresist layer and the side wall spacers.
Claim 26
Dependent Claim
29 words
The method of claim 21, wherein the step of forming the recess uses substrate of a material selected from a group consisting of quartz, silicon, glass, and silicon nitride.
Claim 27
Dependent Claim
20 words
The method of claim 21, wherein the step of depositing the first photoresist layer comprises depositing an inorganic photoresist layer.
Claim 28
Dependent Claim
34 words
The method of claim 21, wherein the step of depositing the first photoresist layer comprises depositing an inorganic Ge--Se type photoresist layer having an Ag compound layer within the inorganic Ge--Se type photoresist layer.
Claim 29
Dependent Claim
16 words
The method of claim 21, wherein the step of forming side wall spacers uses a polymer.
Claim 30
Dependent Claim
22 words
The method of claim 21, wherein a width of each side wall spacer corresponds to a width of the corresponding sub-opening pattern.
Claim 31
Dependent Claim
18 words
The method of claim 21, wherein the step of depositing the opaque layer comprises depositing a chromium layer.
Claim 32
Dependent Claim
24 words
The method of claim 21, wherein the step of removing the first photoresist layer and selected portions of the opaque layer uses anisotropic etching.