Patent US4313788A successfully refreshed from Google Patents.
Patent US5931580A successfully refreshed from Google Patents.
US5931580A
Expired / Lapsed
US
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Apparatus for measuring junction temperature
Assignee: Renesas Electronics America Inc
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Filing: 1997-07-21
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Granted: 1999-08-03
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Expires: 2017-07-21
Abstract
Abstract The junction temperature of a die inside an electronic component is empirically determined by use of a board simulator that simulates a target board on which the electronic component is to be operated. The board simulator includes a thermoelectric cooler used to electrically control the board simulator's thermal resistivity. The board simulator's thermal resistivity is determined in a first calibration step by measuring the difference in temperatures between two thermocouples mounted on two sides of the board simulator. Then, the board simulator is attached to a test component that includes a heating element and a temperature sensor. In a second calibration step, for a known thermal power generated by the heating element, the junction temperature of the test component is measured for different values of thermal resistivity of the board simulator. Next in a measurement step, the user determines the thermal resistivity of the target board. Then the user uses the measured resistivity to look up the junction temperature of the test component from the calibration measurements, which is the estimated junction temperature of the electronic component. The board simulator includes a heat sink, a peltier device coupled to the heat sink and an optional coupon coupled to the peltier device. The coupon can be formed of the same material as the target board, or of a different material of a known thermal conductivity.
Inventors
- 👤 Christopher P. Wyland
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 08:14
CPC Classifications
G; G01; G01K; G01K7/00; G01K7/01; G01K7/015
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
127 words
An apparatus comprising: a thermoelectric cooler having a first side and second side opposite said first side; a first temperature sensor coupled to said first side, said first temperature sensor indicating a measurement of said first temperature; a test component coupled to said first side, wherein said test component comprises: a package for supporting an integrated circuit die; a heating element located inside said package, said heating element capable of being coupled to a power supply, said heating element converting electrical power received from said power supply into thermal power dissipated by said package, said heating element being at a junction temperature; and a second temperature sensor located in said package adjacent said heating element, said second temperature sensor indicating a measurement representative of said junction temperature.
Claim 2
Independent Claim
127 words
An apparatus comprising: a thermoelectric cooler having a first side and second side opposite said first side; a first temperature sensor coupled to said first side, said first temperature sensor indicating a measurement of said first temperature; a test component coupled to said first side, wherein said test component comprises: a package for supporting an integrated circuit die; a heating element located inside said package, said heating element capable of being coupled to a power supply, said heating element converting electrical power received from said power supply into thermal power dissipated by said package, said heating element being at a junction temperature; and a second temperature sensor located in said package adjacent said heating element, said second temperature sensor indicating a measurement representative of said junction temperature.
Claim 3
Dependent Claim
61 words
The apparatus of claim 1 wherein said second temperature sensor comprises a bridge circuit having at least a power terminal, a ground terminal, a first sensor terminal, and a second sensor terminal, wherein said measurement is indicated by a voltage difference between a first voltage potential at said first sensor terminal and a second voltage potential at said second sensor terminal.
Claim 4
Dependent Claim
103 words
The apparatus of claim 2 wherein said bridge circuit includes a first diode, a second diode, a first resistor, and a second resistor, and an anode of said first diode is coupled to said power terminal, a cathode of said first diode is coupled to said first sensor terminal, an anode of said second diode is coupled to said power terminal, a cathode of said second diode is coupled to said second sensor terminal, said first resistor is coupled between said first sensor terminal and said ground terminal and said second resistor is coupled between said second sensor terminal and said ground terminal.
Claim 5
Dependent Claim
30 words
The apparatus of claim 1 wherein said second temperature sensor comprises a diode having a terminal, wherein said measurement is indicated by a voltage at said terminal of said diode.
Claim 6
Dependent Claim
19 words
The apparatus of claim 1 further comprising: a heat sink coupled to said second side of said thermoelectric cooler.
Claim 7
Dependent Claim
19 words
The apparatus of claim 5 further comprising: a third temperature sensor located in a region adjacent said heat sink.
Claim 8
Independent Claim
181 words
An apparatus comprising: a thermoelectric cooler having a first side and second side opposite said first side, said thermoelectric cooler having the property of using electrical power to cause said first side to be at a first temperature different from a second temperature of said second side; a first temperature sensor thermally coupled to said first side, said first temperature sensor indicating a measurement of said first temperature; a heat sink thermally coupled to said second side, said heat sink having the property of dissipating heat from said second side; and a second temperature sensor located in a region adjacent said heat sink; a test component coupled to said first side, wherein said test component comprises: a package for supporting one or more integrated circuit die; a heating element located inside said package, said heating element capable of converting electrical power into thermal power dissipated by said package, said heating element being at a junction temperature; and a third temperature sensor located in said package adjacent said heating element, said third temperature sensor indicating a measurement representative of said junction temperature.
Claim 9
Independent Claim
181 words
An apparatus comprising: a thermoelectric cooler having a first side and second side opposite said first side, said thermoelectric cooler having the property of using electrical power to cause said first side to be at a first temperature different from a second temperature of said second side; a first temperature sensor thermally coupled to said first side, said first temperature sensor indicating a measurement of said first temperature; a heat sink thermally coupled to said second side, said heat sink having the property of dissipating heat from said second side; and a second temperature sensor located in a region adjacent said heat sink; a test component coupled to said first side, wherein said test component comprises: a package for supporting one or more integrated circuit die; a heating element located inside said package, said heating element capable of converting electrical power into thermal power dissipated by said package, said heating element being at a junction temperature; and a third temperature sensor located in said package adjacent said heating element, said third temperature sensor indicating a measurement representative of said junction temperature.
Claim 10
Dependent Claim
31 words
The apparatus of claim 7 wherein said heating element comprises a resistor formed on said integrated circuit die, said resistor converting electrical power into thermal power for dissipation by said package.
Claim 11
Dependent Claim
61 words
The apparatus of claim 7 wherein said third temperature sensor comprises a bridge circuit having at least a power terminal, a ground terminal, a first sensor terminal, and a second sensor terminal, wherein said measurement is indicated by a voltage difference between a first voltage potential at said first sensor terminal and a second voltage potential at said second sensor terminal.
Claim 12
Dependent Claim
103 words
The apparatus of claim 9 wherein said bridge circuit includes a first diode, a second diode, a first resistor and a second resistor, and an anode of said first diode is coupled to said power terminal, a cathode of said first diode is coupled to said first sensor terminal, an anode of said second diode is coupled to said power terminal, a cathode of said second diode is coupled to said second sensor terminal, said first resistor is coupled between said first sensor terminal and said ground terminal and said second resistor is coupled between said second sensor terminal and said ground terminal.
Claim 13
Dependent Claim
30 words
The apparatus of claim 7 wherein said third temperature sensor comprises a diode having a terminal, wherein said measurement is indicated by a voltage at said terminal of said diode.
Claim 14
Dependent Claim
55 words
The apparatus of claim 7 further comprising a coupon formed of a predetermined material and thermally coupled to said first side of said thermoelectric cooler, wherein said test component has a plurality of terminals enclosing a first area and said coupon has a second area, said second area being approximately equal to said first area.
Claim 15
Dependent Claim
35 words
The apparatus of claim 7, wherein said heating element comprises: a plurality of gates formed in said integrated circuit die, said plurality of gates converting electrical power into thermal power for dissipation by said package.
Claim 16
Independent Claim
194 words
An apparatus comprising: a thermoelectric cooler having a first side and second side opposite said first side, said thermoelectric cooler said thermoelectric cooler having the property of using electrical power to cause said first side to be at a first temperature different from a second temperature of said second side; a first temperature sensor coupled to said first side, said first temperature sensor indicating a measurement of said first temperature; a heat sink coupled to said second side, said heat sink having the property of dissipating heat from said second side; and a second temperature sensor located in a region adjacent said heat sink; a test component coupled to said first side, wherein said test component comprises: a package for supporting an integrated circuit die; a heating element located inside said package, said heating element capable of being coupled to a power supply, said heating element converting electrical power received from said power supply into thermal power dissipated by said package, said heating element being at a junction temperature; and a third temperature sensor located in said package adjacent said heating element, said third temperature sensor indicating a measurement representative of said junction temperature.
Claim 17
Independent Claim
194 words
An apparatus comprising: a thermoelectric cooler having a first side and second side opposite said first side, said thermoelectric cooler said thermoelectric cooler having the property of using electrical power to cause said first side to be at a first temperature different from a second temperature of said second side; a first temperature sensor coupled to said first side, said first temperature sensor indicating a measurement of said first temperature; a heat sink coupled to said second side, said heat sink having the property of dissipating heat from said second side; and a second temperature sensor located in a region adjacent said heat sink; a test component coupled to said first side, wherein said test component comprises: a package for supporting an integrated circuit die; a heating element located inside said package, said heating element capable of being coupled to a power supply, said heating element converting electrical power received from said power supply into thermal power dissipated by said package, said heating element being at a junction temperature; and a third temperature sensor located in said package adjacent said heating element, said third temperature sensor indicating a measurement representative of said junction temperature.
Claim 18
Dependent Claim
31 words
The apparatus of claim 14 wherein said heating element comprises a resistor formed on said integrated circuit die, said resistor converting electrical power into thermal power for dissipation by said package.
Claim 19
Dependent Claim
61 words
The apparatus of claim 14 wherein said third temperature sensor comprises a bridge circuit having at least a power terminal, a ground terminal, a first sensor terminal, and a second sensor terminal, wherein said measurement is indicated by a voltage difference between a first voltage potential at said first sensor terminal and a second voltage potential at said second sensor terminal.
Claim 20
Dependent Claim
103 words
The apparatus of claim 16 wherein said bridge circuit includes a first diode, a second diode, a first resistor, and a second resistor, and an anode of said first diode is coupled to said power terminal, a cathode of said first diode is coupled to said first sensor terminal, an anode of said second diode is coupled to said power terminal, a cathode of said second diode is coupled to said second sensor terminal, said first resistor is coupled between said first sensor terminal and said ground terminal and said second resistor is coupled between said second sensor terminal and said ground terminal.
Claim 21
Dependent Claim
30 words
The apparatus of claim 14 wherein said third temperature sensor comprises a diode having a terminal, wherein said measurement is indicated by a voltage at said terminal of said diode.
Claim 22
Dependent Claim
55 words
The apparatus of claim 14 further comprising a coupon formed of a predetermined material and thermally coupled to said first side of said thermoelectric cooler, wherein said test component has a plurality of terminals enclosing a first area and said coupon has a second area, said second area being approximately equal to said first area.
Claim 23
Dependent Claim
35 words
The apparatus of claim 14, wherein said heating element comprises: a plurality of gates formed in said integrated circuit die, said plurality of gates converting electrical power into thermal power for dissipation by said package.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-08-02 | 2003-02-01 | 2003-08-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-08-02 | 2007-02-01 | 2007-08-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-08-02 | 2011-02-01 | 2011-08-03 | $7700.00 | Window Closed / Lapsed |