Cooling air duct and cooling apparatus

Claim 2

A cooling air duct provided on a wall of a housing, in which a heat source is disposed for inducting external air into said housing or venting air in said housing to outside said housing in order to cool inside said housing, said cooling air duct comprising: an expansion chamber formed on an air path for communicating the inside and the outside of said housing with each other; and an inner side duct member having a plurality of ventilating inner side slits formed therein in such a manner as to open to the inside of said housing, and an outer side duct member having a plurality of ventilating outer side slits formed therein in such a manner as to open to the outside of said housing, said inner side duct member and said outer side duct member being disposed in a spaced relationship with said ventilating inner side slits and said ventilating outer side slits positioned alternately such that said air path is formed between said inner side duct member and said outer side duct member and said expansion chamber is formed on said air path.

Claim 3

A cooling air duct as claimed in claim 1, further comprising an acoustic member provided in said expansion chamber.

Claim 4

A cooling apparatus for cooling inside of a housing in which a heat source is disposed, said cooling apparatus comprising: a cooling air duct made of a conductive material and provided on a wall of said housing for inducting external air into the inside of said housing; two different semiconductor elements made of different materials and connected to said cooling air duct; a power supply for supplying current to said two semiconductor elements, wherein said cooling air duct has an air path formed therein for communicating the inside and outside of said housing with each other and further has an expansion chamber formed on said air path therein, and said cooling air duct includes an inner side duct member having a plurality of ventilating inner side slits formed therein in such a manner as to open to the inside of said housing, and an outer side duct member having a plurality of ventilating outer side slits formed therein in such a manner as to open to the outside of said housing, said inner side duct member and said outer side duct member being disposed in a spaced relationship with said ventilating inner side slits and said ventilating outer side slits positioned alternately such that said air path is formed between said inner side duct member and said outer side duct member and said expansion chamber is formed on said air path.

Claim 5

A cooling apparatus for cooling inside of a housing in which a heat source is disposed, said cooling apparatus comprising: a cooling air duct made of a conductive material and provided on a wall of said housing for inducting external air into the inside of said housing; two different semiconductor elements made of different materials and connected to said cooling air duct; a power supply for supplying current to said two semiconductor elements, wherein said cooling air duct has an air path formed therein for communicating the inside and outside of said housing with each other and further has an expansion chamber formed on said air path therein, and said cooling air duct includes an inner side duct member having a plurality of ventilating inner side slits formed therein in such a manner as to open to the inside of said housing, and an outer side duct member having a plurality of ventilating outer side slits formed therein in such a manner as to open to the outside of said housing, said inner side duct member and said outer side duct member being disposed in a spaced relationship with said ventilating inner side slits and said ventilating outer side slits positioned alternately such that said air path is formed between said inner side duct member and said outer side duct member and said expansion chamber is formed on said air path.

Claim 6

A cooling apparatus for cooling inside of a housing in which a heat source is disposed, said cooling apparatus comprising: a cooling air duct made of a conductive material and provided on a wall of said housing for inducting external air into the inside of said housing; two different semiconductor elements made of different materials and connected to said cooling air duct; a power supply for supplying current to said two semiconductor elements, wherein said cooling air duct has an air path formed therein for communicating the inside and the outside of said housing with each other and further has an expansion chamber formed on said air path therein; and said cooling air duct includes an acoustic member provided in said expansion chamber.

Claim 7

A cooling apparatus for cooling inside of a housing in which a heat source is disposed, said cooling apparatus comprising: a cooling air duct made of a conductive material and provided on a wall of said housing for inducting external air into the inside of said housing; two different semiconductor elements made of different materials and connected to said cooling air duct; a power supply for supplying current to said two semiconductor elements, wherein said cooling air duct has an air path formed therein for communicating the inside and the outside of said housing with each other and further has an expansion chamber formed on said air path therein; and said cooling air duct includes an acoustic member provided in said expansion chamber.

Claim 8

A cooling apparatus as claimed in claim 3, wherein said cooling air duct includes an acoustic member provided in said expansion chamber.

Claim 9

A cooling apparatus as claimed in claim 3, further comprising: a temperature sensor for detecting a temperature of the inside of said housing; and a control circuit for controlling current amounts to be supplied from said power supply to said two semiconductor elements in response to a result of the detection by said temperature sensor.

Claim 10

A cooling apparatus as claimed in claim 4, further comprising: a temperature sensor for detecting a temperature of the inside of said housing; and a control circuit for controlling current amounts to be supplied from said power supply to said two semiconductor elements in response to a result of the detection by said temperature sensor.

Claim 11

A cooling apparatus as claimed in claim 5, further comprising: a temperature sensor for detecting a temperature of the inside of said housing; and a control circuit for controlling current amounts to be supplied from said power supply to said two semiconductor elements in response to a result of the detection by said temperature sensor.

Claim 12

A cooling air duct as claimed in claim 1, wherein said inner side duct member and said outer side duct member are disposed in a spaced relationship by a fixed distance from each other.

Claim 13

A cooling apparatus as claimed in claim 3, wherein said inner side duct member and said outer side duct member are disposed in a spaced relationship by a fixed distance from each other.

Claim 14

A cooling air duct comprising: means for attaching said cooling air duct to a wall of a housing in which a heat source is disposed; means for communicating said housing with outside said housing; a first means for opening to the inside of said housing; a second means for opening to the outside of said housing; wherein said first means and said second means are disposed so as to be interspersed with one another, such that an air path is formed between said first means and said second means, with said communicating means being formed along said path.

Claim 15

A cooling air duct comprising: means for attaching said cooling air duct to a wall of a housing in which a heat source is disposed; means for communicating said housing with outside said housing; a first means for opening to the inside of said housing; a second means for opening to the outside of said housing; wherein said first means and said second means are disposed so as to be interspersed with one another, such that an air path is formed between said first means and said second means, with said communicating means being formed along said path.