Semiconductor memory

Claim 2

A semiconductor memory according comprising: A. a memory chip; B. a plurality of banks arranged on said memory chip, for storing and outputting multi-bit data, independently of one another, each comprising: a. a plurality of memory-cell blocks, each comprising two sub-blocks, sense amplifiers, word lines, data lines and column-selecting lines, each of said sub-blocks composed of one memory cell array, said sense amplifiers located between said two sub-blocks, said word lines, data lines and column-selecting lines arranged on the memory cell arrays constituting said two sub-blocks, said memory-cell blocks spaced apart along columns of memory cells and the column-selecting lines and data lines, and said sub-blocks spaced apart also along the columns of memory cells; b. at least one column decoder located at a first end of every column of memory cells and connected to said column-selecting lines; c. a plurality of row decoders located at a first end of every row of memory cells along which said word line extend, and connected to said word lines, each of said row decoders provided for one memory-cell block; d. a plurality of DQ buffers located at a second end of every row of memory cells; e. a cell-array controller located at the first end of every row of memory cells, for controlling the reading and writing of the multi-bit data; C. a data input/output region provided on said memory chip, for receiving multi-bit data from an external device and outputting multi-bit data to an external device; and D. a data bus provided for said plurality of banks, extending parallel to the columns of memory cells, for transferring multi-bit data between said plurality of banks, one the one hand, and said data input/output region, on the other.

Claim 3

The semiconductor memory according to claim 1, wherein each of said banks has local DQ-line pairs located among said sub-blocks, extending parallel to the rows of memory cells and connected to said sense amplifiers, and global DQ-line pairs provided on said memory-cell blocks, extending parallel to the columns of memory cells and connecting said local DQ-line pairs to said DQ buffers.

Claim 4

The semiconductor memory according to claim 2, further comprising switches arranged among said local DQ-line pairs, on the one hand, and said global DQ-line pairs, on the other.

Claim 5

The semiconductor memory according to claim 3, wherein each of said switches is composed of an N-channel MOS transistor.

Claim 6

The semiconductor memory according to claim 1, wherein each of said banks has a bank-selecting circuit at the second end of every row of memory cells, and said bank-selecting circuit connects one of said banks to said data bus and disconnects the remaining banks from said data bus, in order to output and receive the multi-bit data.

Claim 7

The semiconductor memory according to claim 1, wherein said plurality of banks are four banks which are arranged in two rows and two columns.

Claim 8

The semiconductor memory according to claim 1, further comprising column-selecting switches located among said sub-blocks and connected to said column-selecting lines.

Claim 9

The semiconductor memory according to claim 1, wherein said data input/output region is located at the first end of every row of memory cells.

Claim 10

The semiconductor memory according to claim 1, wherein said data input/output region is rectangular, provided on a center part of said memory chip and extending parallel to the columns of memory cells.

Claim 11

The semiconductor memory according to claim 1, wherein said data input/output region has a plurality of data input/output circuits for receiving and outputting bits of the multi-bit data at the same time.

Claim 12

The semiconductor memory according to claim 1, wherein said data bus is provided on a center part of said memory chip and extending parallel to the columns of memory cells, and some of said banks are located on a first side of said data bus and the remaining banks are located on a second side of said data bus.

Claim 13

The semiconductor memory according to claim 1, wherein said column-selecting lines are divided into groups which are completely separated from one another, and each of said banks has a plurality of column decoders for controlling the groups of column-selecting lines, respectively.

Claim 14

The semiconductor memory according to claim 1, wherein each of said row decoders selects one of the two sub-blocks and then one of the word lines extending over the sub-block selected.

Claim 15

The semiconductor memory according to claim 1, wherein at least one of said column decoders has a first function of selecting one of said column-selecting lines and a second function of selecting at least two of said column-selecting lines, and said first and second functions are switched from one to the other in accordance with a control signal.

Claim 16

A semiconductor memory according comprising: A. a memory chip; B. a plurality of main banks arranged on said memory chip, for storing and outputting multi-bit data, independently of one another, each composed of a plurality of sub-banks, each of which comprises: a. a plurality of memory-cell blocks, each comprising two sub-blocks, sense amplifiers, word lines, data lines and column-selecting lines, each of said sub-blocks composed of one memory cell array, said sense amplifiers located between said two sub-blocks, said word lines, data lines and column-selecting lines arranged on the memory cell arrays constituting said two sub-blocks, said memory-cell blocks spaced apart along columns of memory cells and the column-selecting lines and data lines, and said sub-blocks spaced apart also along the columns of memory cells; b. at least one column decoder located at a first end of every column of memory cells and connected to said column-selecting lines; c. a plurality of row decoders located at a first end of every row of memory cells along which said word line extend, and connected to said word lines, each of said row decoders provided for one memory-cell block; d. a plurality of DQ buffers located at a second end of every column of memory cells; e. a cell-array controller located at the first end of very row of memory cells, for controlling the reading and writing of the multi-bit data; C. a data input/output region provided on said memory chip, for receiving multi-bit data from an external device and outputting multi-bit data to an external device; and D. a plurality of data buses provided for at least two of said sub-banks, extending parallel to the rows of memory cells, for transferring multi-bit data between said sub-banks, one the one hand, and said data input/output region, on the other.

Claim 17

A semiconductor memory according comprising: A. a memory chip; B. a plurality of main banks arranged on said memory chip, for storing and outputting multi-bit data, independently of one another, each composed of a plurality of sub-banks, each of which comprises: a. a plurality of memory-cell blocks, each comprising two sub-blocks, sense amplifiers, word lines, data lines and column-selecting lines, each of said sub-blocks composed of one memory cell array, said sense amplifiers located between said two sub-blocks, said word lines, data lines and column-selecting lines arranged on the memory cell arrays constituting said two sub-blocks, said memory-cell blocks spaced apart along columns of memory cells and the column-selecting lines and data lines, and said sub-blocks spaced apart also along the columns of memory cells; b. at least one column decoder located at a first end of every column of memory cells and connected to said column-selecting lines; c. a plurality of row decoders located at a first end of every row of memory cells along which said word line extend, and connected to said word lines, each of said row decoders provided for one memory-cell block; d. a plurality of DQ buffers located at a second end of every column of memory cells; e. a cell-array controller located at the first end of very row of memory cells, for controlling the reading and writing of the multi-bit data; C. a data input/output region provided on said memory chip, for receiving multi-bit data from an external device and outputting multi-bit data to an external device; and D. a plurality of data buses provided for at least two of said sub-banks, extending parallel to the rows of memory cells, for transferring multi-bit data between said sub-banks, one the one hand, and said data input/output region, on the other.

Claim 18

The semiconductor memory according to claim 15, wherein each of said sub-banks has local DQ-line pairs located among said sub-blocks, extending parallel to the rows of memory cells and connected to said sense amplifiers, and global DQ-line pairs provided on said memory-cell blocks, extending parallel to the columns of memory cells and connecting said local DQ-line pairs to said DC buffers.

Claim 19

The semiconductor memory according to claim 16, further comprising switches arranged among said local DQ-line pairs, on the one hand, and said global DQ-line pairs, on the other.

Claim 20

The semiconductor memory according to claim 17, wherein each of said switches is composed of an N-channel MOS transistor.

Claim 21

The semiconductor memory according to claim 16, wherein each of said sub-banks has a bank-selecting circuit at the second end of every row of memory cells, and said bank-selecting circuit connects at least two of said banks constituting all main banks to said data buses and disconnects the remaining sub-banks from said data buses, in order to output and receive the multi-bit data.

Claim 22

The semiconductor memory according to claim 19, wherein data items are transferred through difference data buses, between the sub-banks selected, one the one hand, and said data input/output region, on the other.

Claim 23

The semiconductor memory according to claim 15, further comprising column-selecting switches located among said sub-blocks and connected to said column-selecting lines.

Claim 24

The semiconductor memory according to claim 15, wherein each of said main banks is composed of an n number of sub-banks, and said data input/output region has a plurality of data input/output circuits for receiving and outputting n times the bits of said multi-bit data, at the same time.

Claim 25

The semiconductor memory according to claim 15, wherein said column-selecting lines are divided into groups which are completely separated from one another, and each of said banks has a plurality of column decoders for controlling the groups of column-selecting lines, respectively.

Claim 26

The semiconductor memory according to claim 15, wherein each of said row decoders selects one of the two sub-blocks and then one of the word lines extending over the sub-block selected.

Claim 27

The semiconductor memory according to claim 15, wherein said data input/output region is rectangular, provided on a center part of said memory chip and extending parallel to the columns of memory cells.

Claim 28

The semiconductor memory according to claim 25, wherein said data buses are provided on both sides of said data input/output region and extend parallel to the rows of memory cells and at right angles to said data input/output region.

Claim 29

The semiconductor memory according to claim 26, said data buses extend parallel to the columns of memory cells and said sub-banks are located on both sides of said data buses.

Claim 30

The semiconductor memory according to claim 27, wherein said sub-banks are eight banks which are arranged in four rows and two columns.

Claim 31

The semiconductor memory according to claim 15, wherein said data input/output region is located at the first end of every row of memory cells.

Claim 32

The semiconductor memory according to claim 29, wherein said data input/output region extends parallel to the columns of memory cells and said data buses extend parallel to the rows of memory cells, on the first side of said data input/output region.

Claim 33

The semiconductor memory according to claim 30, said data buses extend parallel to the rows of memory cells and said sub-banks are located on both sides of said data buses.

Claim 34

The semiconductor memory according to claim 31, wherein said sub-banks are eight banks which are arranged in four rows and two columns.

Claim 35

A semiconductor memory according comprising: A. a memory chip; B. a plurality of main banks arranged on said memory chip, for storing and outputting multi-bit data, independently of one another, each composed of a plurality of sub-banks, each of which comprises: a. a plurality of memory-cell blocks, each comprising two sub-blocks, sense amplifiers, word lines, data lines and column-selecting lines, each of said sub-blocks composed of one memory cell array, said sense amplifiers located between said two sub-blocks, said word lines, data lines and column-selecting lines arranged on the memory cell arrays constituting said two sub-blocks, said memory-cell/blocks spaced apart along columns of memory cells and the column-selecting lines and data lines, and said sub-blocks spaced apart also along the columns of memory cells; b. at least one column decoder located at a first end of every column of memory cells and connected to said column-selecting lines; c. a plurality of row decoders located at a first end of every row of memory cells along which said word line extend, and connected to said word lines, each of said row decoders provided for one memory-cell block; d. a plurality of DQ buffers located at a second end of every row of memory cells, each of said DQ buffers provided for one memory-cell block; e. a cell-array controller located at the first end of every row of memory cells, for controlling the reading and writing of the multi-bit data; C. a plurality of data input/output regions provided on said memory chip, for receiving multi-bit data from an external device and outputting multi-bit data to an external device; and D. a plurality of data buses provided for at least two of said sub-banks, extending parallel to the rows of memory cells, for transferring multi-bit data between said sub-banks, one the one hand, and said data input/output regions, on the other, wherein said input/output regions are spaced apart along the rows of memory cells, said data buses are arranged on both sides of each of said data input/output regions and spaced apart along the columns of memory cells, and said sub-banks are arranged on both sides of each of said data buses.

Claim 36

A semiconductor memory according comprising: A. a memory chip; B. a plurality of main banks arranged on said memory chip, for storing and outputting multi-bit data, independently of one another, each composed of a plurality of sub-banks, each of which comprises: a. a plurality of memory-cell blocks, each comprising two sub-blocks, sense amplifiers, word lines, data lines and column-selecting lines, each of said sub-blocks composed of one memory cell array, said sense amplifiers located between said two sub-blocks, said word lines, data lines and column-selecting lines arranged on the memory cell arrays constituting said two sub-blocks, said memory-cell/blocks spaced apart along columns of memory cells and the column-selecting lines and data lines, and said sub-blocks spaced apart also along the columns of memory cells; b. at least one column decoder located at a first end of every column of memory cells and connected to said column-selecting lines; c. a plurality of row decoders located at a first end of every row of memory cells along which said word line extend, and connected to said word lines, each of said row decoders provided for one memory-cell block; d. a plurality of DQ buffers located at a second end of every row of memory cells, each of said DQ buffers provided for one memory-cell block; e. a cell-array controller located at the first end of every row of memory cells, for controlling the reading and writing of the multi-bit data; C. a plurality of data input/output regions provided on said memory chip, for receiving multi-bit data from an external device and outputting multi-bit data to an external device; and D. a plurality of data buses provided for at least two of said sub-banks, extending parallel to the rows of memory cells, for transferring multi-bit data between said sub-banks, one the one hand, and said data input/output regions, on the other, wherein said input/output regions are spaced apart along the rows of memory cells, said data buses are arranged on both sides of each of said data input/output regions and spaced apart along the columns of memory cells, and said sub-banks are arranged on both sides of each of said data buses.

Claim 37

The semiconductor memory according to claim 33, wherein each of said sub-banks has local DQ-line pairs located among said sub-blocks, extending parallel to the rows of memory cells and connected to said sense amplifiers, and global DQ-line pairs provided on said memory-cell blocks, extending parallel to the columns of memory cells and connecting said local DQ-line pairs to said DC buffers.

Claim 38

The semiconductor memory according to claim 34, further comprising switches arranged among said local DQ-line pairs, on the one hand, and said global DQ-line pairs, on the other.

Claim 39

The semiconductor memory according to claim 35, wherein each of said switches is composed of an N-channel MOS transistor.

Claim 40

The semiconductor memory according to claim 33, wherein each of said sub-banks has a bank-selecting circuit at the second end of every column of memory cells, and said bank-selecting circuit connects at least two of said banks constituting all main banks to said data buses and disconnects the remaining sub-banks from said data buses, in order to output and receive the multi-bit data.

Claim 41

The semiconductor memory according to claim 37, wherein data items are transferred through difference data buses, between the sub-banks selected, one the one hand, and said data input/output regions, on the other.

Claim 42

The semiconductor memory according to claim 33, further comprising column-selecting switches located among said sub-blocks and connected to said column-selecting lines.

Claim 43

The semiconductor memory according to claim 33, wherein each of said main banks is composed of an n number of sub-banks, and each of said data input/output regions has a plurality of data input/output circuits for receiving and outputting the bits of said multi-bit data, at the same time.

Claim 44

The semiconductor memory according to claim 33, wherein said column-selecting lines are divided into groups which are completely separated from one another, and each of said sub-banks has a plurality of column decoders for controlling the groups of column-selecting lines, respectively.

Claim 45

The semiconductor memory according to claim 33, wherein each of said row decoders selects one of the two sub-blocks and then one of the word lines extending over the sub-block selected.

Claim 46

The semiconductor memory according to claim 33, wherein said sub-banks are eight banks which are arranged in four rows and two columns.

Claim 47

The semiconductor memory according to claim 33, wherein each of said main banks operate in synchronism with a clock signal to store and output the multi-bit data.

Claim 48

A semiconductor memory chip comprising: a memory chip; a plurality of banks arranged on said memory chip, each bank for writing and reading multi-bit data independently of other banks, each bank comprising: a plurality of memory-cell blocks, each including two sub-blocks, sense amplifiers and DQ lines, each of said sub-blocks including a memory cell array, word lines and data lines, said word lines extending in a row direction, said data lines extending in a column direction, said sense amplifiers and DQ lines located between said two sub-blocks, said DQ lines extending parallel to said word lines, and said DQ lines connected to said sense amplifiers, column-selecting lines arranged on said plurality of memory-cell blocks, said column-selecting lines extending parallel to said data lines, a column decoder connected to said column-selecting lines, a row decoder connected to said word lines, a DQ buffer connected to said DQ lines, a bank selector for selecting one of said plurality of banks, and a cell-array controller for controlling the writing and the reading of the multi-bit data; a data input/output region provided on said memory chip; and a data bus arranged between said plurality of banks, connected to said plurality of banks, extending parallel to said data lines, for transferring multi-bit data between said one of said plurality of banks and said data input/output region.

Claim 49

A semiconductor memory chip comprising: a memory chip; a plurality of banks arranged on said memory chip, each bank for writing and reading multi-bit data independently of other banks, each bank comprising: a plurality of memory-cell blocks, each including two sub-blocks, sense amplifiers and DQ lines, each of said sub-blocks including a memory cell array, word lines and data lines, said word lines extending in a row direction, said data lines extending in a column direction, said sense amplifiers and DQ lines located between said two sub-blocks, said DQ lines extending parallel to said word lines, and said DQ lines connected to said sense amplifiers, column-selecting lines arranged on said plurality of memory-cell blocks, said column-selecting lines extending parallel to said data lines, a column decoder connected to said column-selecting lines, a row decoder connected to said word lines, a DQ buffer connected to said DQ lines, a bank selector for selecting one of said plurality of banks, and a cell-array controller for controlling the writing and the reading of the multi-bit data; a data input/output region provided on said memory chip; and a data bus arranged between said plurality of banks, connected to said plurality of banks, extending parallel to said data lines, for transferring multi-bit data between said one of said plurality of banks and said data input/output region.

Claim 50

A semiconductor memory according to claim 45, wherein said plurality of banks are two banks.

Claim 51

A semiconductor memory according to claim 45, wherein said plurality of banks are four banks.

Claim 52

A semiconductor memory according to claim 45, further comprising column-selecting switches located among said two sub-blocks and connected to said column-selecting lines.

Claim 53

A semiconductor memory chip comprising: a memory chip; a plurality of banks arranged on said memory chip, each bank for writing and reading multi-bit data independently of other banks, each bank comprising: a plurality of memory-cell blocks, each including pairs of sub-blocks, sense amplifiers corresponding to each pair of said sub-blocks and DQ lines, each of said sub-blocks including a memory cell array, word lines and data lines, said word lines extending in a row direction, said data lines extending in a column direction, said sense amplifiers and DQ lines located between said two sub-blocks, said DQ lines extending parallel to said word lines, and said DQ lines connected to said sense amplifiers, column-selecting lines arranged on said plurality of memory-cell blocks, said column-selecting lines extending parallel to said data lines, a column decoder connected to said column-selecting lines, a row decoder connected to said word lines, a DQ buffer connected to said DQ lines, a bank selector for selecting one of said plurality of banks, and a cell-array controller for controlling the writing and the reading of the multi-bit data; a data input/output region provided on said memory chip; and a data bus arranged between said plurality of banks, connected to said plurality of banks, extending parallel to said data lines, for transferring multi-bit data between said one of said plurality of banks and said data input/output region.

Claim 54

A semiconductor memory chip comprising: a memory chip; a plurality of banks arranged on said memory chip, each bank for writing and reading multi-bit data independently of other banks, each bank comprising: a plurality of memory-cell blocks, each including pairs of sub-blocks, sense amplifiers corresponding to each pair of said sub-blocks and DQ lines, each of said sub-blocks including a memory cell array, word lines and data lines, said word lines extending in a row direction, said data lines extending in a column direction, said sense amplifiers and DQ lines located between said two sub-blocks, said DQ lines extending parallel to said word lines, and said DQ lines connected to said sense amplifiers, column-selecting lines arranged on said plurality of memory-cell blocks, said column-selecting lines extending parallel to said data lines, a column decoder connected to said column-selecting lines, a row decoder connected to said word lines, a DQ buffer connected to said DQ lines, a bank selector for selecting one of said plurality of banks, and a cell-array controller for controlling the writing and the reading of the multi-bit data; a data input/output region provided on said memory chip; and a data bus arranged between said plurality of banks, connected to said plurality of banks, extending parallel to said data lines, for transferring multi-bit data between said one of said plurality of banks and said data input/output region.

Claim 55

A semiconductor memory according to claim 49, wherein said plurality of banks are two banks.

Claim 56

A semiconductor memory according to claim 49, wherein said plurality of banks are four banks.

Claim 57

A semiconductor memory according to claim 49, further comprising column-selecting switches located among said two sub-blocks and connected to said column-selecting lines.