US5921087A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for cooling integrated circuits using a thermoelectric module
Assignee: Intel Corp
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Filing: 1997-04-22
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Granted: 1999-07-13
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Expires: 2017-04-22
Abstract
Abstract An integrated circuit cooling device in which a thermoelectric module (TEM) is built into a printed circuit board (PCB) so that the TEM converts heat generated by an integrated circuit on the PCB into DC power that is then supplied to a DC--DC regulator to drive a cooling fan. In one embodiment, the cooling fan is incorporated within a heat sink disposed on one side of the PCB so that the built-in TEM is between the heat sink and the integrated circuit being cooled. In an alternate embodiment, the cooling fan is located remotely from the heat sink.
Inventors
- 👤 Rakesh Bhatia
- 👤 Robert D. Padilla
- 👤 II James G. Hermerding
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 07:12
CPC Classifications
H; H10; H10N; H10N10/00; H10N10/10; H10N10/13; F; F25; F25B; F25B21/00; F25B21/02; H10W; H10W40/00; H10W40/20; H10W40/28; H05; H05K; H05K1/00; H05K1/02; H05K1/0201; H05K1/18; H05K1/182
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
59 words
An apparatus comprising: a printed circuit board (PCB); a thermoelectric module (TEM) incorporated into the PCB, said TEM to receive heat generated by an integrated circuit (IC) coupled to the TEM and to convert the heat into output DC power; and a cooling fan, at least partially operated by the output DC power, to blow air across the IC.
Claim 2
Independent Claim
59 words
An apparatus comprising: a printed circuit board (PCB); a thermoelectric module (TEM) incorporated into the PCB, said TEM to receive heat generated by an integrated circuit (IC) coupled to the TEM and to convert the heat into output DC power; and a cooling fan, at least partially operated by the output DC power, to blow air across the IC.
Claim 3
Dependent Claim
39 words
The apparatus of claim 1, further comprising: a heat sink to couple to the PCB on a first side of the PCB, wherein the IC is to couple to the PCB on a second side opposite the heat sink.
Claim 4
Dependent Claim
15 words
The apparatus of claim 2, wherein the cooling fan is incorporated into the heat sink.
Claim 5
Dependent Claim
16 words
The apparatus of claim 1, wherein the cooling fan is located remotely from the heat sink.
Claim 6
Dependent Claim
28 words
The apparatus of claim 1, wherein the PCB and the TEM comprise a continuous planar board, and the TEM comprises a predetermined area in the continuous planar board.
Claim 7
Dependent Claim
22 words
The apparatus of claim 1, wherein the PCB comprises a hollowed opening, and wherein the TEM snuggedly incorporates into the hollowed opening.
Claim 8
Dependent Claim
63 words
The apparatus of claim 1, wherein the TEM comprises: a plurality of p-n junction pairs electrically coupled in series, wherein each p-n junction pair comprises a p-type semiconductor material and an n-type semiconductor material electrically coupled in series, wherein the p-n junction pairs generate DC current in response to a heat differential between a first side and a second side of the TEM.
Claim 9
Dependent Claim
18 words
The apparatus of claim 7, wherein the TEM is comprised of p-type and n-type bismuth telluride semiconductor material.
Claim 10
Dependent Claim
30 words
The apparatus of claim 7, further comprising: at least one pair of leads which extend from the TEM, wherein the leads supply the DC current from the p-n junction pairs.
Claim 11
Independent Claim
55 words
A method comprising: incorporating a thermoelectric module (TEM) into a printed circuit board (PCB); attaching an integrated circuit (IC) to the TEM of the PCB; converting heat from the IC into DC power using the TEM; supplying the DC power to a cooling fan; and blowing air from the cooling fan to cool the IC.
Claim 12
Independent Claim
55 words
A method comprising: incorporating a thermoelectric module (TEM) into a printed circuit board (PCB); attaching an integrated circuit (IC) to the TEM of the PCB; converting heat from the IC into DC power using the TEM; supplying the DC power to a cooling fan; and blowing air from the cooling fan to cool the IC.
Claim 13
Dependent Claim
25 words
The method of claim 10, wherein the air is blown across a heat sink coupled to the PCB on a side opposite the integrated circuit.
Claim 14
Dependent Claim
26 words
The method of claim 10 wherein the incorporating the TEM comprises: forming the TEM in a predetermined area of the PCB as the PCB is formed.
Claim 15
Dependent Claim
25 words
The method of claim 10 wherein the incorporating the TEM comprises: forming an opening in the PCB; and snuggedly fitting the TEM into the opening.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-07-12 | 2003-01-11 | 2003-07-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-07-12 | 2007-01-11 | 2007-07-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-07-12 | 2011-01-11 | 2011-07-13 | $7700.00 | Window Closed / Lapsed |