Process for producing a semiconductor device using anisotropic conductive adhesive

Claim 2

A process for producing a semiconductor device, said process comprising the steps of: forming an anisotropic conductive adhesive layer, which includes a thermoplastic or thermosetting resin and conductive particles which have a uniform particle size and are distributed in generally equal pitch to form a single layer in the adhesive component in the vicinity of one surface thereof adjacent to the circuit board dispersed therein, on a surface of a circuit board on which electrode terminal contacts are arranged so as to correspond to electrode terminals of a semiconductor chip which is to be mounted on said circuit board; softening said anisotropic conductive adhesive layer; placing said semiconductor chip in such a manner that said electrode terminals of the semiconductor chip coincide with said electrode terminal contacts of the circuit board through said anisotropic conductive adhesive layer; and pressing said semiconductor chip against said circuit board so that said electrode terminals are electrically connected to said electrode terminal contacts and, simultaneously, said semiconductor chip is physically fixed to said circuit board when said anisotropic conductive adhesive layer is hardened.

Claim 3

A process as set forth in claim 1, wherein said anisotropic conductive adhesive layer is formed on said surface of the circuit board at least on an area on which said semiconductor chip is mounted.

Claim 4

A process as set forth in claim 1, wherein said a strip-like circuit board comprising a plurality of said circuit boards continuously arranged in a longitudinal direction is used and said anisotropic conductive adhesive layer is formed on said surface of the respective circuit board at least on an area on which the respective semiconductor chip is mounted.

Claim 5

A process as set forth in claim 3, wherein said anisotropic conductive adhesive layer is formed on said strip-like circuit board along a longitudinal direction thereof, including at least semiconductor chip mount areas of the respective circuit boards.

Claim 6

A process as set forth in claim 1, wherein said circuit board is a flexible circuit board.

Claim 7

A process as set forth in claim 1, wherein said electrode terminal contacts are arranged in an frame-shaped area of said circuit board and said anisotropic conductive adhesive layer is formed along said frame-shaped area.

Claim 8

A process as set forth in claim 3, wherein said circuit board is provided, on a second surface opposite to said first surface on which said electrode terminal contacts and a wiring pattern are arranged, with conductive lands electrically connected to said wiring pattern and, after said semiconductor chip is mounted on said circuit board, external connecting terminals are attached to said conductive lands.

Claim 9

A process for producing a semiconductor device, said process comprising the following steps of: preparing a semiconductor wafer forming a plurality of semiconductor chips having bump-like electrode terminals; preparing a wafer-mounting substrate having electrode terminal contacts arranged so as to correspond to said electrode terminals; forming an anisotropic conductive adhesive layer, which includes a thermoplastic or thermosetting resin and conductive particles which have a uniform particle size and are distributed in generally equal pitch to form a single layer in the adhesive component in the vicinity of one surface thereof adjacent to the circuit board dispersed therein, on a surface of said wafer-mounting substrate on which said electrode terminal contacts are arranged; placing said semiconductor wafer in such a manner that said electrode terminals of the semiconductor wafer coincide with said electrode terminal contacts of the wafer-mounting substrate through said anisotropic conductive adhesive layer; pressing said semiconductor wafer against said wafer-mounting substrate so that said electrode terminals are electrically connected and, simultaneously, said semiconductor wafer is fixed to said electrode terminal contacts and to said circuit board; and cutting said semiconductor wafer and said wafer-mounting substrate into individual pieces including respective semiconductor chips.

Claim 10

A process for producing a semiconductor device, said process comprising the following steps of: preparing a semiconductor wafer forming a plurality of semiconductor chips having bump-like electrode terminals; preparing a wafer-mounting substrate having electrode terminal contacts arranged so as to correspond to said electrode terminals; forming an anisotropic conductive adhesive layer, which includes a thermoplastic or thermosetting resin and conductive particles which have a uniform particle size and are distributed in generally equal pitch to form a single layer in the adhesive component in the vicinity of one surface thereof adjacent to the circuit board dispersed therein, on a surface of said wafer-mounting substrate on which said electrode terminal contacts are arranged; placing said semiconductor wafer in such a manner that said electrode terminals of the semiconductor wafer coincide with said electrode terminal contacts of the wafer-mounting substrate through said anisotropic conductive adhesive layer; pressing said semiconductor wafer against said wafer-mounting substrate so that said electrode terminals are electrically connected and, simultaneously, said semiconductor wafer is fixed to said electrode terminal contacts and to said circuit board; and cutting said semiconductor wafer and said wafer-mounting substrate into individual pieces including respective semiconductor chips.

Claim 11

A process as set forth in claim 8, wherein said wafer-mounting substrate is provided with slits along which said semiconductor chip and said wafer-mounting substrate are cut into said individual pieces.

Claim 12

A process as set forth in claim 8, wherein said electrode terminal contacts are arranged in frame-shaped areas of said wafer-mounting substrate and said anisotropic conductive adhesive layer is formed along said respective frame-shaped area.

Claim 13

A process as set forth in claim 8, wherein said wafer-mounting substrate is provided, on a second surface opposite to said first surface on which said electrode terminal contacts and a wiring pattern are arranged, with conductive lands electrically connected to said wiring pattern.

Claim 14

A process as set forth in claim 8, wherein slits are formed along outer peripheries of regions, on which semiconductor chips are to be mounted, after said anisotropic conductive adhesive film is adhered to said wafer-mounting substrate.

Claim 15

The method of claim 1 wherein the anisotropic conductive adhesive layer includes a non-conductive resin of an epoxy, polyolefin or polyamide and conductive particles of resin balls having a metal plating thereon or metal balls.

Claim 16

The method of claim 8 wherein the anisotropic conductive adhesive layer includes a non-conductive resin of an epoxy, polyolefin or polyamide and conductive particles of resin balls having a metal plating thereon or metal balls.