Patent JPS5634034A successfully refreshed from Google Patents.
Patent US5909634A successfully refreshed from Google Patents.
US5909634A
Expired / Lapsed
US
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Method and apparatus for forming solder on a substrate
Assignee: Texas Instruments Inc
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Filing: 1997-12-18
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Granted: 1999-06-01
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Expires: 2017-12-18
Abstract
Abstract The invention discloses a method for forming solder (114) on a substrate (112). The method includes forming a decal (110) with a plurality of solder regions (113). The method further comprises aligning the decal (110) with the substrate (112) and transferring the solder regions (113) on the decal (110) to the substrate (112).
Inventors
- 👤 Gregory B. Hotchkiss
- 👤 Gary D. Stevens
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 22:45
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/099; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3478; B; B23; B23K; B23K1/00; B23K1/0008; B23K1/0016; B23K1/20; H05K3/3485; H05K2201/00; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10734; H05K2203/00; H05K2203/03; H05K2203/0338; H05K2203/04; H05K2203/043; H05K2203/05; H05K2203/0502; H05K2203/0531; H10W72/00; H10W72/01; H10W72/012; H10W72/01204; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
48 words
A method for forming solder regions on a substrate comprising the steps of: forming a decal comprising a plurality of solder regions, on a first substrate, comprising solder paste; aligning the decal with a second substrate; and transferring the solder regions on the decal to the second substrate.
Claim 2
Independent Claim
48 words
A method for forming solder regions on a substrate comprising the steps of: forming a decal comprising a plurality of solder regions, on a first substrate, comprising solder paste; aligning the decal with a second substrate; and transferring the solder regions on the decal to the second substrate.
Claim 3
Dependent Claim
33 words
The method of claim 1 wherein the step of aligning the decal with the second substrate further comprises bringing the plurality of solder regions into contact with a portion of the second substrate.
Claim 4
Dependent Claim
20 words
The method of claim 1 wherein the step of transferring the solder paste regions comprises soaking the decal in fluid.
Claim 5
Dependent Claim
19 words
The method of claim 1 wherein the step of transferring the solder paste regions comprises a solder reflow process.
Claim 6
Dependent Claim
32 words
The method of claim 1 wherein the step of forming a decal comprises arranging the solder paste regions in a pattern corresponding to a pattern of contact pads on the second substrate.
Claim 7
Dependent Claim
21 words
The method of claim 1 wherein the step of forming a decal further comprises forming a decal comprising a release layer.
Claim 8
Dependent Claim
14 words
The method of claim 1 wherein the second substrate comprises a ball grid array.
Claim 9
Independent Claim
79 words
A method for forming solder regions on a substrate comprising the steps of: forming a plurality of apertures in a first substrate; aligning a second substrate with the first substrate; placing solder paste on the first substrate; urging a portion of the solder paste through the apertures onto the second substrate to form a decal having a plurality of solder paste regions; aligning the decal with a third substrate; and transferring the solder paste regions to the third substrate.
Claim 10
Independent Claim
79 words
A method for forming solder regions on a substrate comprising the steps of: forming a plurality of apertures in a first substrate; aligning a second substrate with the first substrate; placing solder paste on the first substrate; urging a portion of the solder paste through the apertures onto the second substrate to form a decal having a plurality of solder paste regions; aligning the decal with a third substrate; and transferring the solder paste regions to the third substrate.
Claim 11
Dependent Claim
12 words
The method of claim 8 wherein the second substrate comprises non-solderable materials.
Claim 12
Dependent Claim
28 words
The method of claim 8 and further comprising forming a release layer on the second substrate to facilitate transfer of the solder paste regions to the third substrate.
Claim 13
Dependent Claim
19 words
The method of claim 10 wherein the step of transferring the solder paste regions comprises decomposing the release layer.
Claim 14
Dependent Claim
14 words
The method of claim 8 wherein the third substrate comprises a flip-chip electronic package.
Claim 15
Dependent Claim
17 words
The method of claim 8 and further comprising removing the second substrate from the solder paste regions.
Claim 16
Dependent Claim
22 words
The method of claim 8 wherein the step of transferring the solder regions to the third substrate comprises a solder reflow process.
Claim 17
Independent Claim
55 words
A method for forming solder regions on a substrate comprising the steps of: aligning a stencil with a first substrate; placing solder paste on the first substrate through the stencil to form a plurality of solder paste regions on the first substrate; and transferring a plurality of the solder paste regions to a second substrate.
Claim 18
Independent Claim
55 words
A method for forming solder regions on a substrate comprising the steps of: aligning a stencil with a first substrate; placing solder paste on the first substrate through the stencil to form a plurality of solder paste regions on the first substrate; and transferring a plurality of the solder paste regions to a second substrate.
Claim 19
Dependent Claim
29 words
The method of claim 15 and further forming a release layer on the first substrate to facilitate transfer of the plurality of solder paste regions to the second substrate.
Claim 20
Dependent Claim
30 words
The method of claim 16 wherein the step of transferring a plurality of solder paste regions to a second substrate comprises decomposing the release layer through heating the release layer.
Claim 21
Dependent Claim
27 words
The method of claim 16 wherein the step of transferring a plurality of solder paste regions to a second substrate comprises deactivating the release layer through photodecomposition.
Claim 22
Dependent Claim
27 words
The method of claim 16 wherein the step of transferring a plurality of solder paste regions to a second substrate comprises soaking the release layer in fluid.
Claim 23
Dependent Claim
24 words
The method of claim 15 wherein the stencil comprises a plurality of regions corresponding to a plurality of contact pads on the second substrate.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-05-31 | 2002-11-30 | 2003-06-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-05-31 | 2006-11-30 | 2007-06-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-05-31 | 2010-11-30 | 2011-06-01 | $7700.00 | Window Closed / Lapsed |