US5906532A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for polishing semiconductor substrate and apparatus for the same
Assignee: Renesas Electronics Corp
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Filing: 1995-07-19
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Granted: 1999-05-25
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Expires: 2015-07-19
Abstract
Abstract The method for polishing a semiconductor substrate includes the steps of (a) forming a flowing liquid layer between a semiconductor substrate and a substrate holder to thereby support the semiconductor substrate therebetween by surface tension of the flowing liquid layer, and (b) compressing the semiconductor substrate onto a polishing cloth including process liquid therein. The method ensures that a semiconductor substrate is not damaged at a reverse surface thereof and also that a semiconductor substrate is not contaminated by particles contained in process liquid, because the flowing liquid layer prevents particles of process liquid from entering between the semiconductor substrate and the substrate holder.
Inventors
- 👤 Tsutomu Nakajima
- 👤 Yoshihiro Hayashi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 19:53
CPC Classifications
B; B24; B24B; B24B37/00; B24B37/27; B24B37/30
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
124 words
A method for polishing a semiconductor substrate, said method comprising steps of: (a) vacuum-chucking a semiconductor substrate at a reverse surface thereof to a substrate holder; (b) providing process liquid into a polishing cloth arranged on a surface table opposed to a surface of said semiconductor substrate; (c) compressing said semiconductor substrate onto said polishing cloth; (d) stopping vacuum-chucking of said semiconductor substrate during a time period substantially-concurrent with said step (c); and (e) providing liquid to thereby form a flowing liquid layer between said semiconductor substrate and said substrate holder substantially concurrent with said steps (c) and (d), thereby supporting said semiconductor substrate between said semiconductor substrate and said substrate holder during said step (c) by surface tension of said flowing liquid layer.
Claim 2
Independent Claim
124 words
A method for polishing a semiconductor substrate, said method comprising steps of: (a) vacuum-chucking a semiconductor substrate at a reverse surface thereof to a substrate holder; (b) providing process liquid into a polishing cloth arranged on a surface table opposed to a surface of said semiconductor substrate; (c) compressing said semiconductor substrate onto said polishing cloth; (d) stopping vacuum-chucking of said semiconductor substrate during a time period substantially-concurrent with said step (c); and (e) providing liquid to thereby form a flowing liquid layer between said semiconductor substrate and said substrate holder substantially concurrent with said steps (c) and (d), thereby supporting said semiconductor substrate between said semiconductor substrate and said substrate holder during said step (c) by surface tension of said flowing liquid layer.
Claim 3
Independent Claim
96 words
An apparatus for polishing a semiconductor substrate, said apparatus comprising: a substrate holder for holding a semiconductor substrate therewith, said substrate holder being formed with at least one through hole reaching a surface thereof; a surface table opposed to said substrate holder surface; a polishing cloth arranged on said surface table for polishing the substrate; means for providing a vacuum through said through-hole; means for providing a liquid through said through-hole concurrent with said polishing cloth polishing the substrate; and means for providing pressurized gas during a substrate release from said substrate holder through said through-hole.
Claim 4
Independent Claim
96 words
An apparatus for polishing a semiconductor substrate, said apparatus comprising: a substrate holder for holding a semiconductor substrate therewith, said substrate holder being formed with at least one through hole reaching a surface thereof; a surface table opposed to said substrate holder surface; a polishing cloth arranged on said surface table for polishing the substrate; means for providing a vacuum through said through-hole; means for providing a liquid through said through-hole concurrent with said polishing cloth polishing the substrate; and means for providing pressurized gas during a substrate release from said substrate holder through said through-hole.
Claim 5
Dependent Claim
32 words
The apparatus as recited in claim 2 wherein said means for providing a vacuum, said means for providing a liquid and said means for providing a pressurized gas comprises a three-way valve.
Claim 6
Dependent Claim
20 words
The apparatus as recited in claim 2 further comprising a motor for rotating said substrate holder and said semiconductor substrate.
Claim 7
Dependent Claim
16 words
The apparatus as recited in claim 2, wherein said liquid comprises pure water containing no solid.
Claim 8
Dependent Claim
19 words
The apparatus as recited in claim 2, wherein said liquid comprises an aqueous solution of electrolyte containing no solid.
Claim 9
Dependent Claim
17 words
The apparatus as recited in claim 2, wherein said liquid comprises an organic solvent containing no solid.
Claim 10
Dependent Claim
41 words
The apparatus as recited in claim 2, wherein said substrate holder is formed with a plurality of through holes each of which reaches said surface of said substrate holder at a position spaced away from an edge of said semiconductor substrate.
Claim 11
Dependent Claim
39 words
The apparatus as recited in claim 2 further comprising a guide ring having an inner diameter greater than an outer diameter of said semiconductor substrate, said guide ring being bonded to said substrate holder and surrounding said semiconductor substrate.
Claim 12
Dependent Claim
29 words
The apparatus as recited in claim 9 further comprising a film composed of a resilient material, said film being interposed only between said substrate holder and said guide ring.
Claim 13
Dependent Claim
25 words
The apparatus as recited in claim 9, wherein said guide ring is formed at a bottom surface thereof with at least one radially extending groove.
Claim 14
Dependent Claim
19 words
The apparatus as recited in claim 2, wherein said surface of said substrate holder is comprises an inorganic material.
Claim 15
Dependent Claim
26 words
The apparatus as recited in claim 12, wherein said inorganic material includes single crystal silicon, sapphire, diamond, quartz, glass, sintered aluminum oxide, and sintered silicon nitride.
Claim 16
Dependent Claim
23 words
An apparatus according to claim 2 further comprising: means for applying said polishing cloth against the substrate while held in said substrate holder.
References Cited (Backward Citations)
US3579916A
Cited
US4519168A
Cited
US4521995A
Cited
US4625463A
Cited
US4466852A
Cited
JPH0475338A
Cited
JPH0530052A
Cited
JPH05154760A
Cited
JPH05277908A
Cited
JPH06224165A
Cited
US5423716A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-05-24 | 2002-11-23 | 2003-05-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-05-24 | 2006-11-23 | 2007-05-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-05-24 | 2010-11-23 | 2011-05-25 | $7700.00 | Window Closed / Lapsed |