Patent US5893749A successfully refreshed from Google Patents.
US5893749A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for forming a hole filling plug for a semiconductor device
Assignee: NEC Corp
•
Filing: 1995-12-20
•
Granted: 1999-04-13
•
Expires: 2015-12-20
Abstract
Abstract In a method for forming a tungsten plug interconnecting an upper level wiring conductor and a lower level wiring conductor insulated from each other by an interlayer insulator film, an adhesion layer is formed on the interlayer insulator film formed on the lower level wiring conductor. A photoresist layer is deposited on the adhesion layer, and an opening is formed in the photoresist layer. The adhesion layer is selectively removed by an isotropic etching using, as a mask, the photoresist layer having the opening formed therein, so that an opening retracted outwardly from the edge of the opening formed in the photoresist layer is formed in the adhesion layer. A hole is formed through the interlayer insulator film so that the lower level wiring conductor is exposed at a bottom of the hole, and a tungsten layer is formed in the hole of the interlayer insulator film so as to form a tungsten filling for the hole of the interlayer insulator film.
Inventors
- 👤 Akira Matumoto
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 09:12
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/01; H10W20/031; H10W20/032; H10W20/054; H10W20/056; H10W20/071; H10W20/081; H10W20/083
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
279 words
A method for forming a tungsten plug interconnecting an upper level conductor and a diffused region in a substrate, insulated from each other by an interlayer insulator film, comprising the steps of: forming said interlayer insulator film on said diffused region; forming an adhesion layer on said interlayer insulator film; forming a photoresist layer on said adhesion layer; forming an opening in said photoresist layer so as to prepare a mask layer of said photoresist layer having said opening for a hole to be formed in said interlayer insulator film; etching using, as a mask, said photoresist layer having said opening formed therein, to selectively remove said adhesion layer to form an opening corresponding to said opening formed in said photoresist layer and to further remove, from around an edge of said opening formed in said photoresist layer, said adhesion layer which would otherwise become a growth core when a tungsten is grown, so that a radially outermost edge of said opening formed in said adhesion layer is retracted outwardly from said edge of said opening formed in said photoresist layer by not less than about 400 Å and not more than about 500 Å; forming a hole through said interlayer insulator film so that said diffused region is exposed at a bottom of said hole; forming an adhesion and barrier layer on a side wall and a bottom of said hole of said interlayer insulator film, in contact with said diffused region; and depositing a tungsten layer in said hole of said interlayer insulator film so as to form a tungsten filling for said hole of said interlayer insulator film in contact with said adhesion and barrier layer.
Claim 2
Independent Claim
279 words
A method for forming a tungsten plug interconnecting an upper level conductor and a diffused region in a substrate, insulated from each other by an interlayer insulator film, comprising the steps of: forming said interlayer insulator film on said diffused region; forming an adhesion layer on said interlayer insulator film; forming a photoresist layer on said adhesion layer; forming an opening in said photoresist layer so as to prepare a mask layer of said photoresist layer having said opening for a hole to be formed in said interlayer insulator film; etching using, as a mask, said photoresist layer having said opening formed therein, to selectively remove said adhesion layer to form an opening corresponding to said opening formed in said photoresist layer and to further remove, from around an edge of said opening formed in said photoresist layer, said adhesion layer which would otherwise become a growth core when a tungsten is grown, so that a radially outermost edge of said opening formed in said adhesion layer is retracted outwardly from said edge of said opening formed in said photoresist layer by not less than about 400 Å and not more than about 500 Å; forming a hole through said interlayer insulator film so that said diffused region is exposed at a bottom of said hole; forming an adhesion and barrier layer on a side wall and a bottom of said hole of said interlayer insulator film, in contact with said diffused region; and depositing a tungsten layer in said hole of said interlayer insulator film so as to form a tungsten filling for said hole of said interlayer insulator film in contact with said adhesion and barrier layer.
Claim 3
Dependent Claim
78 words
The method claimed in claim 1, wherein said diffused region is in a silicon substrate and wherein said adhesion layer is a titanium nitride film, and said adhesion and barrier layer is a titanium film formed on said diffusion region as a contact metal with said diffusion region, and further comprising the step of forming a titanium nitride film on said titanium film as a barrier metal for preventing reaction between said silicon substrate and said tungsten layer.
Claim 4
Dependent Claim
24 words
The method claimed in claim 2, wherein said adhesion layer formed of the titanium nitride film has a thickness of at least 500 Å.
Claim 5
Dependent Claim
104 words
The method of claim 1, wherein the adhesion and barrier layer is formed on the side wall and bottom of the hole and on the photoresist layer but not on the radially outermost edge of the opening in the adhesion layer, and further comprising the step of removing the photoresist layer and the adhesion and barrier layer formed thereon before depositing the tungsten layer, so that the adhesion layer is exposed and so that the interlayer insulator film is exposed between the radially outermost edge of the opening in the adhesion layer and an upper edge of the hole in the interlayer insulator film.
Claim 6
Dependent Claim
16 words
The method of claim 1, wherein said adhesion and barrier layer directly contacts said diffused region.
References Cited (Backward Citations)
US4960732A
Cited
US4822753A
Cited
US5167760A
Cited
US5225372A
Cited
US5374591A
Cited
US5306952A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-04-12 | 2002-10-12 | 2003-04-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-04-12 | 2006-10-12 | 2007-04-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-04-12 | 2010-10-12 | 2011-04-13 | $7700.00 | Window Closed / Lapsed |