Angularly offset and recessed stacked die multichip device

Claim 1

A stacked die multichip device comprising: a substrate having a recess therein sized and shaped to receive a lower die; a lower die having two opposing side edges each including bonding sites therealong to define at least two opposing bonding sites having a perpendicular distance therebetween, the perpendicular distance here defined as W, a base surface and an upper surface, the lower die being attached to the substrate at least partially within the recess with the lower die's base surface facing the substrate; a first upper die having a width less than the perpendicular distance; the first upper die filter having a base surface and an upper surface; the first upper die being attached above the lower die with the first upper die's base surface facing the upper surface of the lower die; and the first upper die being rotated, in a plane substantially parallel to the upper surface of the lower die, through an angle sufficient to insure that no portion of the first upper die interferes with a vertical line of sight of any bonding site on the lower die to permit wire bonding of the bonding sites on the lower die, the first upper die being fixed in this position, wherein the angle through which the first upper die is rotated is defined as the minimum offset angle, α, and is at least equal to the value given by the formula ##EQU3## where L is equal to a maximum distance between two outermost edges of any two bonding sites along one of the side edges of the lower die.