Patent US5877033A successfully refreshed from Google Patents.
US5877033A
Expired / Lapsed
US
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System for detection of unsoldered components
Assignee: MARTIN TERRENCE (TERRY)
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Filing: 1997-03-10
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Granted: 1999-03-02
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Expires: 2017-03-10
Abstract
Abstract A system for detecting certain improperly soldered electrical component connections to a printed circuit board includes methods and apparatus providing an automated means for detecting unsoldered component leads is disclosed. A connection pad divided into two portions, or land areas is bridged by the component lead when soldered. A test pad connected to one of the land areas provides a test point for detecting the presence or absence of an open circuit condition through the lead of an electrical component to a point in the circuit to which it is to be electrically connected.
Inventors
- 👤 Michael L. Matern
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 14:27
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K1/0266; H05K1/0268; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09654; H05K2201/09663; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10636; H05K2201/10651; H05K2201/10689; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
229 words
A method for producing circuit cards that facilitates detection of unsoldered component leads, comprising the steps of: a) providing a circuit card substrate having at least one surface; b) forming at least one solderable connection pad on the surface positioned to underlie a specific component lead the pad including first and second land areas electrically isolated by a separation of the first and second land areas from one another, wherein the separation of the first and second land areas is sufficient to prevent joining them by surface tension of liquid solder alone and the first land area is connected to a circuit path on the circuit card; c) applying a solder mask to portions of the surface, including the separation between the first and second land areas, to prevent plating thereof by a plating solution; d) applying a plating solution to areas of the surface in the absence of the solder mask; wherein the solder mask applied to the separation of the first and second land areas is sufficient to prevent joining them by surface tension of the plating solution; e) joining at least once component having a plurality of electrical connection leads, each located for solder connection to a respective connection pad on the surface, to the respective connection pad by soldering; f) electrically testing the continuity of the connection pad between the first and second land areas.
Claim 2
Independent Claim
229 words
A method for producing circuit cards that facilitates detection of unsoldered component leads, comprising the steps of: a) providing a circuit card substrate having at least one surface; b) forming at least one solderable connection pad on the surface positioned to underlie a specific component lead the pad including first and second land areas electrically isolated by a separation of the first and second land areas from one another, wherein the separation of the first and second land areas is sufficient to prevent joining them by surface tension of liquid solder alone and the first land area is connected to a circuit path on the circuit card; c) applying a solder mask to portions of the surface, including the separation between the first and second land areas, to prevent plating thereof by a plating solution; d) applying a plating solution to areas of the surface in the absence of the solder mask; wherein the solder mask applied to the separation of the first and second land areas is sufficient to prevent joining them by surface tension of the plating solution; e) joining at least once component having a plurality of electrical connection leads, each located for solder connection to a respective connection pad on the surface, to the respective connection pad by soldering; f) electrically testing the continuity of the connection pad between the first and second land areas.
Claim 3
Dependent Claim
42 words
The method of claim 1, further including the step of applying a solder paste layer to at least a portion of respective connection pads, said solder paste layer having a thickness in a range of from about 0.002 to about 0.012 inches.
Claim 4
Dependent Claim
59 words
The method of claim 1, further including the steps of: (e) forming a plurality of test pads, each joined by a respective circuit path electrically connecting the second land area to a respective test pad; and (g) electrically testing the electrical continuity between the first and second land areas of the respective connection pad through the respective test pad.
Claim 5
Dependent Claim
23 words
The method of claim 1, wherein the first and second land areas are positioned to underlie subsequent placement of a specific component lead.
Claim 6
Independent Claim
141 words
A method of detecting unsoldered circuit board component leads, comprising the steps of: (a) providing at least one solderable connection pad on a surface of the circuit board positioned to underlie a specific component lead and including first and second land areas electrically isolated by a separation of the first and second land areas from one another, wherein the separation of the first and second land areas is sufficient to prevent joining them by surface tension of liquid solder alone, and the first land area is connected to a circuit path on the circuit card; (b) electrically connecting the first and second land areas by soldering a component lead onto and joining the first and second land areas to form a single connection pad area; and (c) electrically testing the continuity of the connection pad between the first and second areas.
Claim 7
Independent Claim
141 words
A method of detecting unsoldered circuit board component leads, comprising the steps of: (a) providing at least one solderable connection pad on a surface of the circuit board positioned to underlie a specific component lead and including first and second land areas electrically isolated by a separation of the first and second land areas from one another, wherein the separation of the first and second land areas is sufficient to prevent joining them by surface tension of liquid solder alone, and the first land area is connected to a circuit path on the circuit card; (b) electrically connecting the first and second land areas by soldering a component lead onto and joining the first and second land areas to form a single connection pad area; and (c) electrically testing the continuity of the connection pad between the first and second areas.
Claim 8
Dependent Claim
58 words
The method of claim 5, further including the step of: (d) applying a solder paste layer to at least a portion of respective connection pads, said solder paste layer having a thickness in a range of from about 0.002 to about 0.012 inches, and step (b) is thereafter accomplished by heating of the solder paste until it melts.
Claim 9
Dependent Claim
62 words
The method of claim 5, further including the step of: (d) providing a plurality of test pads, each of respective test pads being joined by a respective circuit path electrically connected to a respective second land area; and thereafter in step (c) electrically testing the continuity of the connection pad between the first and second land areas through said test pad area.
Claim 10
Independent Claim
226 words
A method for producing circuit cards that facilitates detection of unsoldered component leads, comprising the steps of: a) providing a circuit card substrate having at least one surface; b) forming at least one solderable connection pad on the surface positioned to underlie a specific component lead the pad including first and second land areas electrically isolated by a separation of the first and second land areas from one another, wherein the separation of the first and second land areas is sufficient to prevent joining them by surface tension of liquid solder alone and the first land area is connected to a circuit path on the circuit card; c) applying a coating to portions of the surface to facilitate plating thereof by a plating solution, including the separation between the first and second land; d) applying a plating solution to areas of the surface in the absence of a solder mask; wherein the coating applied to the separation of the first and second land areas is sufficient to prevent joining them by surface tension of the plating solution; e) joining at least one component having a plurality of electrical connection leads, each located for solder connection to a respective connection pad on the surface, to the respective connection pad by soldering; f) electrically testing the continuity of the connection pad between the first and second land areas.
Claim 11
Independent Claim
226 words
A method for producing circuit cards that facilitates detection of unsoldered component leads, comprising the steps of: a) providing a circuit card substrate having at least one surface; b) forming at least one solderable connection pad on the surface positioned to underlie a specific component lead the pad including first and second land areas electrically isolated by a separation of the first and second land areas from one another, wherein the separation of the first and second land areas is sufficient to prevent joining them by surface tension of liquid solder alone and the first land area is connected to a circuit path on the circuit card; c) applying a coating to portions of the surface to facilitate plating thereof by a plating solution, including the separation between the first and second land; d) applying a plating solution to areas of the surface in the absence of a solder mask; wherein the coating applied to the separation of the first and second land areas is sufficient to prevent joining them by surface tension of the plating solution; e) joining at least one component having a plurality of electrical connection leads, each located for solder connection to a respective connection pad on the surface, to the respective connection pad by soldering; f) electrically testing the continuity of the connection pad between the first and second land areas.
Claim 12
Dependent Claim
55 words
The method of claim 8, further including the step of: (e) applying a solder paste layer to at least a portion of respective connection pads, said solder paste layer having a thickness in a range of from about 0.002 to about 0.012 inches, and then (f) heating the solder paste until it melts and flows.
Claim 13
Dependent Claim
21 words
The method of claim 9, wherein the solder paste is divided along the separation of the first and second land areas.
Claim 14
Dependent Claim
28 words
The method of claim 9, wherein the solder paste is applied in a layer having a thickness in a range of from about 0.006 to about 0.008 inches.
Claim 15
Dependent Claim
47 words
The method of claim 9, wherein the solder paste is applied in a layer having a volume sufficient to join the component lead to the connection pad and insufficient to bridge the separation of the first and second land areas in the absence of the component lead.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-03-01 | 2002-08-31 | 2003-03-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-03-01 | 2006-08-31 | 2007-03-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-03-01 | 2010-08-31 | 2011-03-02 | $7700.00 | Window Closed / Lapsed |