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US5872058A Expired / Lapsed US ⏱️ 0.0 years remaining

High aspect ratio gapfill process by using HDP

Assignee: Novellus Systems Inc
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Filing: 1997-06-17
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Granted: 1999-02-16
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Expires: 2017-06-17
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Abstract

Abstract A process for filling high aspect ratio gaps on substrates uses conventional high density plasma deposition processes while reducing the concentration of the inert gas, such as Ar, to 0-13% of the total process gas flow. By reducing the inert gas concentration, sputtering or etching is reduced, resulting in reduced sidewall deposition from the sputtered material. Consequently, gaps with aspect ratios of 3.0:1 and higher can be filled without the formation of voids and without damaging circuit elements.

Inventors

  • 👤 Patrick A. Van Cleemput
  • 👤 Thomas W. Mountsier

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-29 20:51
CPC Classifications
C; C23; C23C; C23C16/00; C23C16/22; C23C16/30; C23C16/40; C23C16/401; C23C16/402; C23C16/04; C23C16/045; H; H10; H10P; H10P14/00; H10P14/60; H10P14/69; H10P14/692; H10P14/6921; H10P14/69215; H10W; H10W10/00; H10W10/01; H10W10/011; H10W10/014; H10W10/10; H10W10/17; H10W20/00; H10W20/01; H10W20/071; H10W20/098; H10P14/63; H10P14/6326; H10P14/6328; H10P14/6334; H10P14/6336; H10P14/66; H10P14/668; H10P14/6681; H10P14/6682

Claims Analysis

Total Claims: 12
Claim 1
Independent Claim 57 words
A process for filling gaps during integrated circuit production, comprising the steps of: providing a gas mixture comprised of silicon-containing, oxygen-containing, and inert components, wherein said inert components comprise no more than 13% total concentration of said gas mixture; and depositing a film over said gaps by using said gas mixture for simultaneous CVD and sputter etching.
Claim 2
Dependent Claim 57 words
A process for filling gaps during integrated circuit production, comprising the steps of: providing a gas mixture comprised of silicon-containing, oxygen-containing, and inert components, wherein said inert components comprise no more than 13% total concentration of said gas mixture; and depositing a film over said gaps by using said gas mixture for simultaneous CVD and sputter etching.
Claim 3
Dependent Claim 11 words
The process of claim 1, wherein said silicon-containing component is silane.
Claim 4
Dependent Claim 13 words
The process of claim 1, wherein said oxygen-containing component is O 2 .
Claim 5
Dependent Claim 20 words
The process of claim 1, wherein said inert component is selected from the group consisting of argon, helium and hydrogen.
Claim 6
Dependent Claim 18 words
The process of claim 1, wherein said gas mixture is at a pressure between 1 and 3 mTorr.
Claim 7
Dependent Claim 16 words
The process of claim 5, wherein said gas mixture is at a pressure of 2 mTorr.
Claim 8
Dependent Claim 18 words
The process of claim 2, wherein said silane is at a flow rate of 80 to 250 sccm.
Claim 9
Dependent Claim 19 words
The process of claim 3, wherein said O 2 is at a flow rate of 120 to 250 sccm.
Claim 10
Dependent Claim 20 words
The process of claim 4, wherein said inert component is argon at a flow rate of 0 to 50 sccm.
Claim 11
Dependent Claim 48 words
A process for filling gaps during integrated circuit production, comprising the step of: depositing a film over said gaps by HDP deposition using a gas mixture comprised of silicon-containing, oxygen-containing, and inert components, wherein said inert components comprise no more than 13% total concentration of said gas mixture.
Claim 12
Dependent Claim 48 words
A process for filling gaps during integrated circuit production, comprising the step of: depositing a film over said gaps by HDP deposition using a gas mixture comprised of silicon-containing, oxygen-containing, and inert components, wherein said inert components comprise no more than 13% total concentration of said gas mixture.

References Cited (Backward Citations)

US5670421A Cited
US5162261A Cited
US5614055A Cited
US5691573A Cited
US5776834A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2002-02-15 2002-08-17 2003-02-16 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2006-02-15 2006-08-17 2007-02-16 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2010-02-15 2010-08-17 2011-02-16 $7700.00 Window Closed / Lapsed

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