EPROM in double poly high density CMOS

Claim 1

A method of using two polysilicon layers to make an integrated circuit on a substrate of semiconductor material, which integrated circuit includes MOS transistors, a poly to poly capacitor and at least one EPROM transistor, said method comprising the steps of: forming MOS transistors on thin oxide areas of said substrate using a process having about two micron or less design rules for the MOS transistors; forming at least one capacitor on a field oxide area of said substrate, said capacitor comprising two spaced parallel plates of polycrystalline silicon; concurrently also forming at least one EPROM transistor on said substrate, with the EPROM transistor having two spaced parallel plates of electrically conductive material and also having a first part disposed on a thin oxide area on the substrate and a much larger second part disposed on field oxide on said substrate, using a selected combination of steps used to make the MOS transistors and the capacitor, wherein the EPROM transistor has a charging gate/floating gate first capacitance, and a floating gate/substrate second capacitance; and providing a respective capacitance ratio between said first and second capacitances of about two:one or greater; effective to allow the EPROM transistor to be made along with the MOS transistors and the capacitor by merely incorporating changes in masks used to make said integrated circuit, and the floating gate of the EPROM transistor to be charged at low voltages that can be handled by said MOS transistors.

Claim 2

A method of using two polysilicon layers to make an integrated circuit on a substrate of semiconductor material, which integrated circuit includes MOS transistors, a poly to poly capacitor and at least one EPROM transistor, said method comprising the steps of: forming MOS transistors on thin oxide areas of said substrate using a process having about two micron or less design rules for the MOS transistors; forming at least one capacitor on a field oxide area of said substrate, said capacitor comprising two spaced parallel plates of polycrystalline silicon; concurrently also forming at least one EPROM transistor on said substrate, with the EPROM transistor having two spaced parallel plates of electrically conductive material and also having a first part disposed on a thin oxide area on the substrate and a much larger second part disposed on field oxide on said substrate, using a selected combination of steps used to make the MOS transistors and the capacitor, wherein the EPROM transistor has a charging gate/floating gate first capacitance, and a floating gate/substrate second capacitance; and providing a respective capacitance ratio between said first and second capacitances of about two:one or greater; effective to allow the EPROM transistor to be made along with the MOS transistors and the capacitor by merely incorporating changes in masks used to make said integrated circuit, and the floating gate of the EPROM transistor to be charged at low voltages that can be handled by said MOS transistors.

Claim 8

A method of making an EPROM transistor in a CMOS integrated circuit made with a process having two micron or less design rules, comprising the steps of: forming a well of one conductivity type in a semiconductive substrate surface portion of opposite conductivity type, said well extending into said substrate from a surface area of said portion; forming field oxide on other surface areas of said substrate surface portion; forming gate oxide on said well surface area and on still other surface areas of said surface portion outside of said areas having field oxide; depositing a first blanket layer of gate electrode material on said gate oxide and field oxide regions; defining said first blanket layer into gate electrodes for complementary MOS transistors, a lower plate of a capacitor on said field oxide, and a first gate electrode for an EPROM MOS transistor on gate oxide, said first gate electrode having an integral enlargement that extends up onto said field oxide; forming source and drain regions for said MOS transistors under the thin oxide at opposed edges of said gate electrodes, with the source and drain regions being of opposite conductivity type from the substrate surface in which they are disposed; forming a blanket dielectric coating on said substrate; defining patches of said dielectric coating that cover said lower plate of said capacitor and said EPROM first gate electrode, including the integral enlargement of said EPROM first gate electrode; depositing a second blanket layer of gate electrode material on said dielectric layer; defining said second blanket layer of gate electrode material into a portion of a component of said integrated circuit on said field oxide, and concurrently also defining a charging electrode aligned over said integral enlargement of said EPROM first gate electrode, said second gate electrode significantly overlapping at least said integral enlargement of said EPROM first gate electrode, whereby capacitance between overlapping portions thereof is at least about double any capacitance existing between said first gate electrode and said substrate; and forming appropriate conductive contacts to said source and drain regions and to said gate electrodes but not to said first gate electrode, effective to make an electrically floating gate out of said first gate electrode, and to also make said floating gate electrode chargeable by said charging electrode at voltages that can be safely handled by said MOS transistors in said integrated circuit.

Claim 9

A method of making an EPROM transistor in a CMOS integrated circuit made with a process having two micron or less design rules, comprising the steps of: forming a well of one conductivity type in a semiconductive substrate surface portion of opposite conductivity type, said well extending into said substrate from a surface area of said portion; forming field oxide on other surface areas of said substrate surface portion; forming gate oxide on said well surface area and on still other surface areas of said surface portion outside of said areas having field oxide; depositing a first blanket layer of gate electrode material on said gate oxide and field oxide regions; defining said first blanket layer into gate electrodes for complementary MOS transistors, a lower plate of a capacitor on said field oxide, and a first gate electrode for an EPROM MOS transistor on gate oxide, said first gate electrode having an integral enlargement that extends up onto said field oxide; forming source and drain regions for said MOS transistors under the thin oxide at opposed edges of said gate electrodes, with the source and drain regions being of opposite conductivity type from the substrate surface in which they are disposed; forming a blanket dielectric coating on said substrate; defining patches of said dielectric coating that cover said lower plate of said capacitor and said EPROM first gate electrode, including the integral enlargement of said EPROM first gate electrode; depositing a second blanket layer of gate electrode material on said dielectric layer; defining said second blanket layer of gate electrode material into a portion of a component of said integrated circuit on said field oxide, and concurrently also defining a charging electrode aligned over said integral enlargement of said EPROM first gate electrode, said second gate electrode significantly overlapping at least said integral enlargement of said EPROM first gate electrode, whereby capacitance between overlapping portions thereof is at least about double any capacitance existing between said first gate electrode and said substrate; and forming appropriate conductive contacts to said source and drain regions and to said gate electrodes but not to said first gate electrode, effective to make an electrically floating gate out of said first gate electrode, and to also make said floating gate electrode chargeable by said charging electrode at voltages that can be safely handled by said MOS transistors in said integrated circuit.