Patent US5869884A successfully refreshed from Google Patents.
US5869884A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device having lead terminal on only one side of a package
Assignee: NEC Electronics Corp
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Filing: 1997-06-26
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Granted: 1999-02-09
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Expires: 2017-06-26
Abstract
Abstract A semiconductor device of the present invention in which a plurality of lead terminals are provided for only one side, comprising a plurality of leads connected to the lead terminals, a semiconductor chip provided on an island and having a plurality of pads electrically connected to the leads on one side, a first extension lead which is connected to one lead terminal among the leads and at least a part of which is provided along a side of the semiconductor chip perpendicular to the side of it having the pads, a second extension lead at least a part of which is provided for a side of the semiconductor chip opposite to the side of it having the pads, and a suspension pin provided between one end of the first extension lead and one end of the second extension lead and connected to the island. The semiconductor chip includes a power-supply-voltage provided for a side of the semiconductor chip opposite to the side of it having the pad and pad electrically connected with the other end of the second extension lead, a first auxiliary pad provided for a side of the semiconductor chip other than the side of it having the pads and electrically connected to one end of the first extension lead and a second auxiliary pad electrically connected to one end of the second extension lead, and wiring connecting the first auxiliary pad with the second auxiliary pad.
Inventors
- 👤 Hisamitsu Kimoto
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 14:44
CPC Classifications
H; H10; H10W; H10W72/00; H10W70/00; H10W70/40; H10W70/421; H10W20/00; H10W20/40; H10W20/49; H10W44/00; H10W44/20; H10W44/203; H10W44/206; H10W72/50; H10W72/541; H10W72/5449; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
217 words
A semiconductor device in which a plurality of lead terminals are provided for only one side, comprising: a plurality of leads connected to said lead terminals; a semiconductor chip set on an island and having a plurality of pads on a first side electrically connected with said leads, a plurality of auxiliary pads, and wiring connecting pairs of said auxiliary pads together; a first extension lead which is connected to one lead terminal among said leads and at least a part of which is provided along a second side of said semiconductor chip perpendicular to the first side; a second extension lead at least a part of which is provided along a third side of said semiconductor chip opposite to the first side; and a suspension pin extending from said island between one end of said first extension lead and one end of said second extension lead; wherein said semiconductor chip includes a power-supply-voltage pad on said third side, said power-supply-voltage pad being electrically connected with a second end of said second extension lead, a first said auxiliary pad of one said pair being electrically connected with said one end of said first extension lead and a second said auxiliary pad of said one pair being electrically connected to said one end of said second extension lead.
Claim 2
Dependent Claim
217 words
A semiconductor device in which a plurality of lead terminals are provided for only one side, comprising: a plurality of leads connected to said lead terminals; a semiconductor chip set on an island and having a plurality of pads on a first side electrically connected with said leads, a plurality of auxiliary pads, and wiring connecting pairs of said auxiliary pads together; a first extension lead which is connected to one lead terminal among said leads and at least a part of which is provided along a second side of said semiconductor chip perpendicular to the first side; a second extension lead at least a part of which is provided along a third side of said semiconductor chip opposite to the first side; and a suspension pin extending from said island between one end of said first extension lead and one end of said second extension lead; wherein said semiconductor chip includes a power-supply-voltage pad on said third side, said power-supply-voltage pad being electrically connected with a second end of said second extension lead, a first said auxiliary pad of one said pair being electrically connected with said one end of said first extension lead and a second said auxiliary pad of said one pair being electrically connected to said one end of said second extension lead.
Claim 3
Dependent Claim
30 words
The semiconductor device according to claim 1, wherein the wiring connecting said first auxiliary pad with said second auxiliary pad is electrically independent of other circuits in said semiconductor chip.
Claim 4
Dependent Claim
22 words
The semiconductor device according to claim 1, wherein said first auxiliary pad and said second auxiliary pad are along said second side.
Claim 5
Dependent Claim
22 words
The semiconductor device according to claim 1, wherein said first auxiliary pad and said second auxiliary pad are along said third side.
Claim 6
Dependent Claim
120 words
A semiconductor device in which a plurality of lead terminals are provided for only one side, comprising: a plurality of leads connected to said lead terminals, a semiconductor chip on an island and having a plurality of pads on one side electrically connected with said leads, a power-supply-voltage pad on an opposite side, a plurality of auxiliary pads and wiring connecting pairs of said auxiliary pads together; and an extension lead extending around said semiconductor chip, said extension lead having a first part connected to one of said lead terminals and a second part connected to said power-supply-voltage pad; wherein said two parts of said extension lead are each connected to one said auxiliary pad of one of said pairs.
Claim 7
Dependent Claim
120 words
A semiconductor device in which a plurality of lead terminals are provided for only one side, comprising: a plurality of leads connected to said lead terminals, a semiconductor chip on an island and having a plurality of pads on one side electrically connected with said leads, a power-supply-voltage pad on an opposite side, a plurality of auxiliary pads and wiring connecting pairs of said auxiliary pads together; and an extension lead extending around said semiconductor chip, said extension lead having a first part connected to one of said lead terminals and a second part connected to said power-supply-voltage pad; wherein said two parts of said extension lead are each connected to one said auxiliary pad of one of said pairs.
Claim 8
Dependent Claim
21 words
The semiconductor device according to claim 5, wherein a suspension pin extends from said island between said two extension lead parts.
Claim 9
Dependent Claim
20 words
A semiconductor device according to claim 5, wherein said wiring is electrically independent of other circuits in said semiconductor chip.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-02-08 | 2002-08-10 | 2003-02-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-02-08 | 2006-08-10 | 2007-02-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-02-08 | 2010-08-10 | 2011-02-09 | $7700.00 | Window Closed / Lapsed |