US5867359A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electrostatic chuck
Assignee: Individual
•
Filing: 1996-03-15
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Granted: 1999-02-02
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Expires: 2016-03-15
Abstract
Abstract An electrostatic chuck is provided having a plurality of small electrostatic structures for holding an electrically conductive workpiece forming a plate of a capacitor. Each electrostatic structure includes a first thermally conductive single-crystal dielectric sheet, and a first electrode in sheet form sandwiched between the first dielectric sheet and a second dielectric surface. The workpiece, typically a conductive or semiconductive wafer, is juxtaposed to the first dielectric sheet of each electrostatic structure and forms a second electrode. The second dielectric sheet, if thick, is used as a thermally conducting base plate which can be attached to a low pressure reactor. If the second dielectric is a thin sheet, then it is mounted to a thermally conductive metal base plate through which heat can be controllably conducted. The resultant electrostatic structure may optionally be brazed to the metal base plate if the thermal expansion characteristics of the two elements are sufficiently matched. The first thermally conductive dielectric sheet is preferably formed of sapphire (Al 2 O 3 ), which is sufficiently thermally conductive to allow for rapid heat transfer between the base plate and the workpiece. The first electrodes of different electrostatic structures are held at different electrical potentials (typically of several thousand volts difference) and a charge is maintained by this potential difference between selected electrostatic structures.
Inventors
- 👤 Arthur Sherman
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 04:34
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0431; H10P72/0432; H02; H02N; H02N13/00; H10P72/70; H10P72/72; H10P72/722; Y; Y10; Y10T; Y10T279/00; Y10T279/23
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
106 words
An electrostatic chuck with a holder for attachment to a wafer transfer mechanism, comprising: an electrostatic paddle, including a bottom sapphire plate adjacent the holder, a sapphire frame adjacent the bottom sapphire plate, wherein the sapphire frame defines a plurality of slots, and a top sapphire plate adjacent the frame; and a plurality of conductors, wherein each of the plurality of conductors rests in one of the slots, and wherein a brazing joins the top and bottom sapphire plates to the adjacent surfaces of the plurality of conductors, wherein the brazing pulls the top and bottom sapphire plates tightly against the sapphire frame for electrical isolation.
Claim 2
Dependent Claim
106 words
An electrostatic chuck with a holder for attachment to a wafer transfer mechanism, comprising: an electrostatic paddle, including a bottom sapphire plate adjacent the holder, a sapphire frame adjacent the bottom sapphire plate, wherein the sapphire frame defines a plurality of slots, and a top sapphire plate adjacent the frame; and a plurality of conductors, wherein each of the plurality of conductors rests in one of the slots, and wherein a brazing joins the top and bottom sapphire plates to the adjacent surfaces of the plurality of conductors, wherein the brazing pulls the top and bottom sapphire plates tightly against the sapphire frame for electrical isolation.
Claim 3
Dependent Claim
11 words
The electrostatic chuck of claim 1, wherein the holder comprises metal.
Claim 4
Dependent Claim
28 words
The electrostatic chuck of claim 1, wherein the plurality of conductors are made of solid niobium, and each of the conductors includes a stud brazed to the conductor.
Claim 5
Dependent Claim
25 words
The electrostatic chuck of claim 1, wherein the plurality of conductors are made of a metal that has a thermal expansion coefficient similar to sapphire.
Claim 6
Dependent Claim
31 words
The electrostatic chuck of claim 1, wherein alumina, grown by chemical vapor deposition, joins the adjacent contacting surfaces of the top sapphire plate, the bottom sapphire plate, and the sapphire frame.
Claim 7
Dependent Claim
139 words
An electrostatic chuck with a holder for attachment to a wafer transfer mechanism, comprising: an electrostatic paddle, attached to the holder, including a bottom sapphire plate with a top surface and a bottom surface, a sapphire frame with a top surface and a bottom surface, and a top sapphire plate with a top surface and a bottom surface, wherein the bottom surface of the bottom sapphire plate is adjacent the holder, and the bottom surface of the sapphire frame is adjacent the top surface of the bottom sapphire plate, and the bottom surface of the top sapphire plate is adjacent the top surface of the sapphire frame; and a plurality of conductors, wherein each of the plurality of conductors resides in the sapphire frame, and the conductors, the top sapphire plate, and the bottom sapphire plate are brazed together.
Claim 8
Dependent Claim
139 words
An electrostatic chuck with a holder for attachment to a wafer transfer mechanism, comprising: an electrostatic paddle, attached to the holder, including a bottom sapphire plate with a top surface and a bottom surface, a sapphire frame with a top surface and a bottom surface, and a top sapphire plate with a top surface and a bottom surface, wherein the bottom surface of the bottom sapphire plate is adjacent the holder, and the bottom surface of the sapphire frame is adjacent the top surface of the bottom sapphire plate, and the bottom surface of the top sapphire plate is adjacent the top surface of the sapphire frame; and a plurality of conductors, wherein each of the plurality of conductors resides in the sapphire frame, and the conductors, the top sapphire plate, and the bottom sapphire plate are brazed together.
Claim 9
Dependent Claim
11 words
The electrostatic chuck of claim 6, wherein the holder comprises metal.
Claim 10
Dependent Claim
26 words
The electrostatic chuck of claim 6, wherein the plurality of conductors are made of solid niobium, wherein each conductor includes a stud brazed to the conductor.
Claim 11
Dependent Claim
25 words
The electrostatic chuck of claim 6, wherein the plurality of conductors are made of a metal that has a thermal expansion coefficient similar to sapphire.
Claim 12
Dependent Claim
31 words
The electrostatic chuck of claim 6, wherein alumina, grown by chemical vapor deposition, joins the adjacent contacting surfaces of the top sapphire plate, the bottom sapphire plate, and the sapphire frame.
Claim 13
Dependent Claim
87 words
An electrostatic chuck with a holder for attachment to a wafer transfer mechanism, comprising: an electrostatic paddle, including a plurality of sapphire plates, including a bottom surface adjacent the holder; and a plurality of conductors, adjacent the plurality of sapphire plates; and wherein the plurality of conductors and the plurality of sapphire plates are brazed together, such that the plurality of conductors are sandwiched between the sapphire plates, and wherein alumina, grown by chemical vapor deposition, joins the adjacent contacting surfaces of the plurality of sapphire plates.
Claim 14
Dependent Claim
87 words
An electrostatic chuck with a holder for attachment to a wafer transfer mechanism, comprising: an electrostatic paddle, including a plurality of sapphire plates, including a bottom surface adjacent the holder; and a plurality of conductors, adjacent the plurality of sapphire plates; and wherein the plurality of conductors and the plurality of sapphire plates are brazed together, such that the plurality of conductors are sandwiched between the sapphire plates, and wherein alumina, grown by chemical vapor deposition, joins the adjacent contacting surfaces of the plurality of sapphire plates.
Claim 15
Dependent Claim
11 words
The electrostatic chuck of claim 11, wherein the holder comprises metal.
Claim 16
Dependent Claim
26 words
The electrostatic chuck of claim 11, wherein the plurality of conductors are made of solid niobium, wherein each conductor includes a stud brazed to the conductor.
Claim 17
Dependent Claim
25 words
The electrostatic chuck of claim 11, wherein the plurality of conductors are made of a metal that has a thermal expansion coefficient similar to sapphire.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-02-01 | 2002-08-03 | 2003-02-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-02-01 | 2006-08-03 | 2007-02-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-02-01 | 2010-08-03 | 2011-02-02 | $7700.00 | Window Closed / Lapsed |