Bandstop filter module with shunt zero

Claim 2

A bandstop filter module with a shunt zero, comprising: a circuit substrate having a first major surface with input and output pads deposited thereon and a second major surface with transmission lines deposited thereon, the input and output pads connected to at least one of the transmission lines through the circuit substrate; at least one dielectric monolithic block mounted to the circuit substrate each dielectric monolithic block having a substantially rectangular body made of a dielectric material and having a top surface, a bottom surface, four side surfaces and having a plurality of metallized through holes extending from the top surface to the bottom surface defining resonators, and a plurality of metallized through holes extending from the top surface to the bottom surface adjacent to the resonators defining guard holes, and all surfaces of the dielectric monolithic block being substantially covered with a conductive material defining a metallized ground layer with the exception that the top surface is selectively metallized providing an unshorted metallization pattern relative to a ground plane in proximity to the guard holes; the guard holes and the unshorted metallization pattern relative to a ground plane in proximity to the guard holes on the top surface of the dielectric monolithic block provide a shunt zero in a frequency response curve of the bandstop filter module; the guard holes operating at a frequency which is different than the frequency of the resonators thereby decoupling the resonators and thus providing additional harmonic rejection; a plurality of coupling pads on one of the four side surfaces of the dielectric monolithic block, each of the plurality of coupling pads corresponding with each of the plurality of metallized through holes extending from the top surface to the bottom surface defining resonators, each of the plurality of coupling pads providing capacitive coupling through the dielectric monolithic block into each of the respective resonators; at least one inductor coil mounted on the substrate immediately adjacent the top surface of the dielectric monolithic block; the at least one inductor coil coupled at one end thereof to a first of the resonators via a first of the transmission lines and coupled at another end thereof to a second of the resonators via a second of the transmission lines; the at least one inductor coil providing inductive coupling between the first of the resonators and the second of the resonators; and a shield having tuning windows mounted to the circuit substrate encasing the at least one dielectric monolithic block and the inductor coil.

Claim 3

The bandstop filter module of claim 1, wherein the inductor coil is a chip inductor.

Claim 4

The bandstop filter module of claim 1, wherein the dielectric filter is mounted to the circuit substrate such that both the resonators and the guard holes extend parallel to the first major surface and the second major surface of the circuit substrate.

Claim 5

The bandstop filter module of claim 1, wherein the shield is made from a metal coated material and the tuning windows are substantially aligned with the top surface of the dielectric monolithic block.

Claim 6

The bandstop filter module of claim 1, wherein the resonators are quarter-wave dielectric resonators.

Claim 7

The bandstop filter module of claim 1, wherein the resonators are half-wave dielectric resonators.

Claim 8

The bandstop filter module of claim 1, wherein the circuit substrate comprises an epoxy-resin printed circuit board material.

Claim 9

A duplexer bandstop filter module with a shunt zero, comprising: a circuit substrate having a first major surface with input and output pads deposited thereon and a second major surface with transmission lines deposited thereon, the input and output pads connected to at least one of the transmission lines through the circuit substrate; a transmit dielectric monolithic block mounted to the circuit substrate, the transmit dielectric monolithic block having a substantially rectangular body made of a dielectric material and having a top surface, a bottom surface, four side surfaces and having a plurality of metallized through holes extending from the top surface to the bottom surface defining resonators, and a plurality of metallized through holes extending from the top surface to the bottom surface adjacent to the resonators defining guard holes, and all surfaces of the transmit dielectric monolithic block being substantially covered with a conductive material defining a metallized ground layer with the exception that the top surface is selectively metallized providing an unshorted metallization pattern relative to a ground plane in proximity to the guard holes; a plurality of coupling pads on one of the four side surfaces of the transmit dielectric monolithic block, each of the plurality of coupling pads corresponding with each of the plurality of metallized through holes extending from the top surface to the bottom surface defining resonators, each of the plurality of coupling pads providing capacitive coupling through the transmit dielectric monolithic block into each of the respective resonators; a receive dielectric monolithic block mounted to the circuit substrate, the receive dielectric monolithic block having a substantially rectangular body made of a dielectric material and having a top surface, a bottom surface, four side surfaces and having a plurality of metallized through holes extending from the top surface to the bottom surface defining resonators and a plurality of metallized through holes extending from the top surface to the bottom surface adjacent to the resonators defining guard holes, and all surfaces of the receive dielectric monolithic block being substantially covered with a conductive material defining a metallized ground layer with the exception that the top surface is selectively metallized providing an unshorted metallization pattern relative to a ground plane in proximity to the guard holes; a plurality of coupling pads on one of the four side surfaces of the receive dielectric monolithic block, each of the plurality of coupling pads corresponding with each of the plurality of metallized through holes extending from the top surface to the bottom surface defining resonators, each of the plurality of coupling pads providing capacitive coupling through the receive dielectric monolithic block into each of the respective resonators; the guard holes and the unshorted metallization pattern relative to the ground plane in proximity to the guard holes on the top surfaces of the transmit and receive dielectric monolithic blocks provide a shunt zero in the frequency response curves of a transmit and a receive dielectric filter respectively; the guard holes operating at a frequency which is different than the frequency of the resonators thereby decoupling the resonators and thus providing additional harmonic rejection; at least one inductor coil mounted on the circuit substrate immediately adjacent the top surface of the transmit and receive dielectric monolithic blocks; the at least one inductor coil coupled at one end thereof to a first of the resonators of the transmit dielectric monolithic block via a first of the transmission lines and coupled at another end thereof to a second of the resonators of the transmit and receive dielectric monolithic block via a second of the transmission lines; the at least one inductor coil providing inductive coupling between the first of the resonators and the second of the resonators; and a shield having tuning windows mounted to the circuit substrate encasing the transmit and receive dielectric monolithic blocks and the inductor coil.

Claim 10

A duplexer bandstop filter module with a shunt zero, comprising: a circuit substrate having a first major surface with input and output pads deposited thereon and a second major surface with transmission lines deposited thereon, the input and output pads connected to at least one of the transmission lines through the circuit substrate; a transmit dielectric monolithic block mounted to the circuit substrate, the transmit dielectric monolithic block having a substantially rectangular body made of a dielectric material and having a top surface, a bottom surface, four side surfaces and having a plurality of metallized through holes extending from the top surface to the bottom surface defining resonators, and a plurality of metallized through holes extending from the top surface to the bottom surface adjacent to the resonators defining guard holes, and all surfaces of the transmit dielectric monolithic block being substantially covered with a conductive material defining a metallized ground layer with the exception that the top surface is selectively metallized providing an unshorted metallization pattern relative to a ground plane in proximity to the guard holes; a plurality of coupling pads on one of the four side surfaces of the transmit dielectric monolithic block, each of the plurality of coupling pads corresponding with each of the plurality of metallized through holes extending from the top surface to the bottom surface defining resonators, each of the plurality of coupling pads providing capacitive coupling through the transmit dielectric monolithic block into each of the respective resonators; a receive dielectric monolithic block mounted to the circuit substrate, the receive dielectric monolithic block having a substantially rectangular body made of a dielectric material and having a top surface, a bottom surface, four side surfaces and having a plurality of metallized through holes extending from the top surface to the bottom surface defining resonators and a plurality of metallized through holes extending from the top surface to the bottom surface adjacent to the resonators defining guard holes, and all surfaces of the receive dielectric monolithic block being substantially covered with a conductive material defining a metallized ground layer with the exception that the top surface is selectively metallized providing an unshorted metallization pattern relative to a ground plane in proximity to the guard holes; a plurality of coupling pads on one of the four side surfaces of the receive dielectric monolithic block, each of the plurality of coupling pads corresponding with each of the plurality of metallized through holes extending from the top surface to the bottom surface defining resonators, each of the plurality of coupling pads providing capacitive coupling through the receive dielectric monolithic block into each of the respective resonators; the guard holes and the unshorted metallization pattern relative to the ground plane in proximity to the guard holes on the top surfaces of the transmit and receive dielectric monolithic blocks provide a shunt zero in the frequency response curves of a transmit and a receive dielectric filter respectively; the guard holes operating at a frequency which is different than the frequency of the resonators thereby decoupling the resonators and thus providing additional harmonic rejection; at least one inductor coil mounted on the circuit substrate immediately adjacent the top surface of the transmit and receive dielectric monolithic blocks; the at least one inductor coil coupled at one end thereof to a first of the resonators of the transmit dielectric monolithic block via a first of the transmission lines and coupled at another end thereof to a second of the resonators of the transmit and receive dielectric monolithic block via a second of the transmission lines; the at least one inductor coil providing inductive coupling between the first of the resonators and the second of the resonators; and a shield having tuning windows mounted to the circuit substrate encasing the transmit and receive dielectric monolithic blocks and the inductor coil.

Claim 11

A triplexer bandstop filter module with a shunt zero, comprising: a circuit substrate having a first major surface with input and output pads deposited thereon and a second major surface with transmission lines deposited thereon, the input and output pads connected to at least one of the transmission lines through the circuit substrate; a transmit dielectric monolithic block mounted to the circuit substrate, the transmit dielectric monolithic block having a substantially rectangular body made of a dielectric material and having a top surface, a bottom surface, four side surfaces and having a plurality of metallized through holes extending from the top surface to the bottom surface defining resonators, and a plurality of metallized through holes extending from the top surface to the bottom surface adjacent to the resonators defining guard holes, and all surfaces of the transmit dielectric monolithic block being substantially covered with a conductive material defining a metallized ground layer with the exception that the top surface is selectively metallized providing an unshorted metallization pattern relative to a ground plane in proximity to the guard holes; a plurality of coupling pads on one of the four side surfaces of the transmit dielectric monolithic block, each of the plurality of coupling pads corresponding with each of the plurality of metallized through holes extending from the top surface to the bottom surface defining resonators, each of the plurality of coupling pads providing capacitive coupling through the transmit dielectric monolithic block into each of the respective resonators; a first receive dielectric monolithic block mounted to the circuit substrate, the first receive dielectric monolithic block having a substantially rectangular body made of a dielectric material and having a top surface, a bottom surface, four side surfaces and having a plurality of metallized through holes extending from the top surface to the bottom surface defining resonators, and a plurality of metallized through holes extending from the top surface to the bottom surface adjacent to the resonators defining guard holes, and all surfaces of the first receive dielectric monolithic block being substantially covered with a conductive material defining a metallized ground layer with the exception that the top surface is selectively metallized providing an unshorted metallization pattern relative to a ground plane in proximity to the guard holes; a plurality of coupling pads on one of the four side surfaces of the first receive dielectric monolithic block, each of the plurality of coupling pads corresponding with each of the plurality of metallized through holes extending from the top surface to the bottom surface defining resonators each of the plurality of coupling pads providing capacitive coupling through the first receive dielectric monolithic block into each of the respective resonators; a second receive dielectric monolithic block mounted to the circuit substrate, the second receive dielectric monolithic block having a frequency response curve and a substantially rectangular body made of a dielectric material and having a top surface, a bottom surface, four side surfaces and having a plurality of metallized through holes extending from the top surface to the bottom surface defining resonators, and a plurality of metallized through holes extending from the top surface to the bottom surface adjacent to the resonators defining guard holes, and all surfaces of the second receive dielectric monolithic block being substantially covered with a conductive material defining a metallized ground layer with the exception that the top surface is selectively metallized providing an unshorted metallization pattern relative to a ground plane in proximity to the guard holes; a plurality of coupling pads on one of the four side surfaces of the second receive dielectric monolithic block, each of the plurality of coupling pads corresponding with each of the plurality of metallized through holes extending from the top surface to the bottom surface defining resonators, each of the plurality of coupling pads providing capacitive coupling through the second receive dielectric monolithic block into each of the respective resonators; the guard holes and the unshorted metallization pattern in proximity to the guard holes on the top surface of the transmit dielectric monolithic block and the first receive dielectric monolithic block and the second receive dielectric monolithic block provide a shunt zero in the frequency response curves of a transmit dielectric filter and a first receive dielectric filter and a second receive dielectric filter respectively; the guard holes operating at a frequency which is different than the frequency of the resonators thereby decoupling the resonators and thus providing additional harmonic rejection; at least one inductor coil mounted on the substrate immediately adjacent the top surface of the transmit dielectric monolithic block and the first receive dielectric monolithic block and the second receive dielectric monolithic block; the at least one inductor coil coupled at one end thereof to a first of the resonators of the transmit dielectric monolithic block via a first of the transmission lines and coupled at another end thereof to a second of the resonators of the transmit dielectric monolithic block via a second of the transmission lines; the at least one inductor coil providing inductive coupling between the first of the resonators and the second of the resonators; and a shield having tuning windows mounted to the circuit substrate encasing the transmit and receive dielectric monolithic blocks and the inductor coil.

Claim 12

A triplexer bandstop filter module with a shunt zero, comprising: a circuit substrate having a first major surface with input and output pads deposited thereon and a second major surface with transmission lines deposited thereon, the input and output pads connected to at least one of the transmission lines through the circuit substrate; a transmit dielectric monolithic block mounted to the circuit substrate, the transmit dielectric monolithic block having a substantially rectangular body made of a dielectric material and having a top surface, a bottom surface, four side surfaces and having a plurality of metallized through holes extending from the top surface to the bottom surface defining resonators, and a plurality of metallized through holes extending from the top surface to the bottom surface adjacent to the resonators defining guard holes, and all surfaces of the transmit dielectric monolithic block being substantially covered with a conductive material defining a metallized ground layer with the exception that the top surface is selectively metallized providing an unshorted metallization pattern relative to a ground plane in proximity to the guard holes; a plurality of coupling pads on one of the four side surfaces of the transmit dielectric monolithic block, each of the plurality of coupling pads corresponding with each of the plurality of metallized through holes extending from the top surface to the bottom surface defining resonators, each of the plurality of coupling pads providing capacitive coupling through the transmit dielectric monolithic block into each of the respective resonators; a first receive dielectric monolithic block mounted to the circuit substrate, the first receive dielectric monolithic block having a substantially rectangular body made of a dielectric material and having a top surface, a bottom surface, four side surfaces and having a plurality of metallized through holes extending from the top surface to the bottom surface defining resonators, and a plurality of metallized through holes extending from the top surface to the bottom surface adjacent to the resonators defining guard holes, and all surfaces of the first receive dielectric monolithic block being substantially covered with a conductive material defining a metallized ground layer with the exception that the top surface is selectively metallized providing an unshorted metallization pattern relative to a ground plane in proximity to the guard holes; a plurality of coupling pads on one of the four side surfaces of the first receive dielectric monolithic block, each of the plurality of coupling pads corresponding with each of the plurality of metallized through holes extending from the top surface to the bottom surface defining resonators each of the plurality of coupling pads providing capacitive coupling through the first receive dielectric monolithic block into each of the respective resonators; a second receive dielectric monolithic block mounted to the circuit substrate, the second receive dielectric monolithic block having a frequency response curve and a substantially rectangular body made of a dielectric material and having a top surface, a bottom surface, four side surfaces and having a plurality of metallized through holes extending from the top surface to the bottom surface defining resonators, and a plurality of metallized through holes extending from the top surface to the bottom surface adjacent to the resonators defining guard holes, and all surfaces of the second receive dielectric monolithic block being substantially covered with a conductive material defining a metallized ground layer with the exception that the top surface is selectively metallized providing an unshorted metallization pattern relative to a ground plane in proximity to the guard holes; a plurality of coupling pads on one of the four side surfaces of the second receive dielectric monolithic block, each of the plurality of coupling pads corresponding with each of the plurality of metallized through holes extending from the top surface to the bottom surface defining resonators, each of the plurality of coupling pads providing capacitive coupling through the second receive dielectric monolithic block into each of the respective resonators; the guard holes and the unshorted metallization pattern in proximity to the guard holes on the top surface of the transmit dielectric monolithic block and the first receive dielectric monolithic block and the second receive dielectric monolithic block provide a shunt zero in the frequency response curves of a transmit dielectric filter and a first receive dielectric filter and a second receive dielectric filter respectively; the guard holes operating at a frequency which is different than the frequency of the resonators thereby decoupling the resonators and thus providing additional harmonic rejection; at least one inductor coil mounted on the substrate immediately adjacent the top surface of the transmit dielectric monolithic block and the first receive dielectric monolithic block and the second receive dielectric monolithic block; the at least one inductor coil coupled at one end thereof to a first of the resonators of the transmit dielectric monolithic block via a first of the transmission lines and coupled at another end thereof to a second of the resonators of the transmit dielectric monolithic block via a second of the transmission lines; the at least one inductor coil providing inductive coupling between the first of the resonators and the second of the resonators; and a shield having tuning windows mounted to the circuit substrate encasing the transmit and receive dielectric monolithic blocks and the inductor coil.

Claim 13

A dual band bandstop filter module with a shunt zero, comprising: a circuit substrate having a first major surface with input and output pads deposited thereon and a second major surface with transmission lines deposited thereon, the input and output pads connected to at least one of the transmission lines through the circuit substrate; a first transmit dielectric monolithic block mounted to the circuit substrate, the first transmit dielectric monolithic block having a substantially rectangular body made of a dielectric material and having a top surface, a bottom surface, four side surfaces and having a plurality of metallized through holes extending from the top surface to the bottom surface defining resonators, and a plurality of metallized through holes extending from the top surface to the bottom surface adjacent to the resonators defining guard holes, and all surfaces of the first transmit dielectric monolithic block being substantially covered with a conductive material defining a metallized ground layer with the exception that the top surface is selectively metallized providing an unshorted metallization pattern relative to a ground plane in proximity to the guard holes; a plurality of coupling pads on one of the four side surfaces of the first transmit dielectric monolithic block, each of the plurality of coupling pads corresponding with each of the plurality of metallized through holes extending from the top surface to the bottom surface defining resonators, each of the plurality of coupling pads providing capacitive coupling through the first transmit dielectric monolithic block into each of the respective resonators; a second transmit dielectric monolithic block mounted to the circuit substrate, the second transmit dielectric monolithic block having a substantially rectangular body made of a dielectric material and having a top surface, a bottom surface, four side surfaces and having a plurality of metallized through holes extending from the top surface to the bottom surface defining resonators, and a plurality of metallized through holes extending from the top surface to the bottom surface adjacent to the resonators defining guard holes, and all surfaces of the second transmit dielectric monolithic block being substantially covered with a conductive material defining a metallized ground layer with the exception that the top surface is selectively metallized providing an unshorted metallization pattern relative to a ground plane in proximity to the guard holes; a plurality of coupling pads on one of the four side surfaces of the second transmit dielectric monolithic block, each of the plurality of coupling pads corresponding with each of the plurality of metallized through holes extending from the top surface to the bottom surface defining resonators, each of the plurality of coupling pads providing capacitive coupling through the second transmit dielectric monolithic block into each of the respective resonators; a first receive dielectric monolithic block mounted to the circuit substrate, the first receive dielectric monolithic block having a substantially rectangular body made of a dielectric material and having a top surface, a bottom surface, four side surfaces and having a plurality of metallized through holes extending from the top surface to the bottom surface defining resonators, and a plurality of metallized through holes extending from the top surface to the bottom surface adjacent to the resonators defining guard holes, and all surfaces of the first receive dielectric monolithic block being substantially covered with a conductive material defining a metallized ground layer with the exception that the top surface is selectively metallized providing an unshorted metallization pattern relative to a ground plane in proximity to the guard holes; a plurality of coupling pads on one of the four side surfaces of the first receive dielectric monolithic block, each of the plurality of coupling pads corresponding with each of the plurality of metallized through holes extending from the top surface to the bottom surface defining resonators, each of the plurality of coupling pads providing capacitive coupling through the first receive dielectric monolithic block into each of the respective resonators; a second receive dielectric monolithic block mounted to the circuit substrate, the second receive dielectric monolithic block having a substantially rectangular body made of a dielectric material and having a top surface, a bottom surface, four side surfaces and having a plurality of metallized through holes extending from the top surface to the bottom surface defining resonators, and a plurality of metallized through holes extending from the top surface to the bottom surface adjacent to the resonators defining guard holes, and all surfaces of the second receive dielectric monolithic block being substantially covered with a conductive material defining a metallized ground layer with the exception that the top surface is selectively metallized providing an unshorted metallization pattern relative to a ground plane in proximity to the guard holes; a plurality of coupling pads on one of the four side surfaces of the second receive dielectric monolithic block, each of the plurality of coupling pads corresponding with each of the plurality of metallized through holes extending from the top surface to the bottom surface defining resonators, each of the plurality of coupling pads providing capacitive coupling through the second receive dielectric monolithic block into each of the respective resonators; the guard holes and the unshorted metallization pattern in proximity to the guard holes on the top surface of the first transmit dielectric monolithic block and the second transmit dielectric monolithic block and the first receive dielectric monolithic block and the second receive dielectric monolithic block provide a shunt zero in the frequency response curves of a first transmit dielectric filter and a second transmit dielectric filter and a first receive dielectric filter and a second receive dielectric filter respectively; the guard holes operating at a frequency which is different than the frequency of the resonators thereby decoupling the resonators and thus providing additional harmonic rejection; at least one inductor coil mounted on the substrate immediately adjacent the top surface of the first transmit dielectric monolithic block and the second transmit dielectric monolithic block and the first receive dielectric monolithic block and the second receive dielectric monolithic block; the at least one inductor coil coupled at one end thereof to a first of the resonators of the first or second transmit dielectric monolithic block via a first of the transmission lines and coupled at another end thereof to a second of the resonators of the first or second dielectric monolithic block via a second of the transmission lines; the at least one inductor coil providing inductive coupling between the first of the resonators and the second of the resonators; and a shield having tuning windows mounted to the circuit substrate encasing the transmit and receive dielectric monolithic blocks and the inductor coil.

Claim 14

A dual band bandstop filter module with a shunt zero, comprising: a circuit substrate having a first major surface with input and output pads deposited thereon and a second major surface with transmission lines deposited thereon, the input and output pads connected to at least one of the transmission lines through the circuit substrate; a first transmit dielectric monolithic block mounted to the circuit substrate, the first transmit dielectric monolithic block having a substantially rectangular body made of a dielectric material and having a top surface, a bottom surface, four side surfaces and having a plurality of metallized through holes extending from the top surface to the bottom surface defining resonators, and a plurality of metallized through holes extending from the top surface to the bottom surface adjacent to the resonators defining guard holes, and all surfaces of the first transmit dielectric monolithic block being substantially covered with a conductive material defining a metallized ground layer with the exception that the top surface is selectively metallized providing an unshorted metallization pattern relative to a ground plane in proximity to the guard holes; a plurality of coupling pads on one of the four side surfaces of the first transmit dielectric monolithic block, each of the plurality of coupling pads corresponding with each of the plurality of metallized through holes extending from the top surface to the bottom surface defining resonators, each of the plurality of coupling pads providing capacitive coupling through the first transmit dielectric monolithic block into each of the respective resonators; a second transmit dielectric monolithic block mounted to the circuit substrate, the second transmit dielectric monolithic block having a substantially rectangular body made of a dielectric material and having a top surface, a bottom surface, four side surfaces and having a plurality of metallized through holes extending from the top surface to the bottom surface defining resonators, and a plurality of metallized through holes extending from the top surface to the bottom surface adjacent to the resonators defining guard holes, and all surfaces of the second transmit dielectric monolithic block being substantially covered with a conductive material defining a metallized ground layer with the exception that the top surface is selectively metallized providing an unshorted metallization pattern relative to a ground plane in proximity to the guard holes; a plurality of coupling pads on one of the four side surfaces of the second transmit dielectric monolithic block, each of the plurality of coupling pads corresponding with each of the plurality of metallized through holes extending from the top surface to the bottom surface defining resonators, each of the plurality of coupling pads providing capacitive coupling through the second transmit dielectric monolithic block into each of the respective resonators; a first receive dielectric monolithic block mounted to the circuit substrate, the first receive dielectric monolithic block having a substantially rectangular body made of a dielectric material and having a top surface, a bottom surface, four side surfaces and having a plurality of metallized through holes extending from the top surface to the bottom surface defining resonators, and a plurality of metallized through holes extending from the top surface to the bottom surface adjacent to the resonators defining guard holes, and all surfaces of the first receive dielectric monolithic block being substantially covered with a conductive material defining a metallized ground layer with the exception that the top surface is selectively metallized providing an unshorted metallization pattern relative to a ground plane in proximity to the guard holes; a plurality of coupling pads on one of the four side surfaces of the first receive dielectric monolithic block, each of the plurality of coupling pads corresponding with each of the plurality of metallized through holes extending from the top surface to the bottom surface defining resonators, each of the plurality of coupling pads providing capacitive coupling through the first receive dielectric monolithic block into each of the respective resonators; a second receive dielectric monolithic block mounted to the circuit substrate, the second receive dielectric monolithic block having a substantially rectangular body made of a dielectric material and having a top surface, a bottom surface, four side surfaces and having a plurality of metallized through holes extending from the top surface to the bottom surface defining resonators, and a plurality of metallized through holes extending from the top surface to the bottom surface adjacent to the resonators defining guard holes, and all surfaces of the second receive dielectric monolithic block being substantially covered with a conductive material defining a metallized ground layer with the exception that the top surface is selectively metallized providing an unshorted metallization pattern relative to a ground plane in proximity to the guard holes; a plurality of coupling pads on one of the four side surfaces of the second receive dielectric monolithic block, each of the plurality of coupling pads corresponding with each of the plurality of metallized through holes extending from the top surface to the bottom surface defining resonators, each of the plurality of coupling pads providing capacitive coupling through the second receive dielectric monolithic block into each of the respective resonators; the guard holes and the unshorted metallization pattern in proximity to the guard holes on the top surface of the first transmit dielectric monolithic block and the second transmit dielectric monolithic block and the first receive dielectric monolithic block and the second receive dielectric monolithic block provide a shunt zero in the frequency response curves of a first transmit dielectric filter and a second transmit dielectric filter and a first receive dielectric filter and a second receive dielectric filter respectively; the guard holes operating at a frequency which is different than the frequency of the resonators thereby decoupling the resonators and thus providing additional harmonic rejection; at least one inductor coil mounted on the substrate immediately adjacent the top surface of the first transmit dielectric monolithic block and the second transmit dielectric monolithic block and the first receive dielectric monolithic block and the second receive dielectric monolithic block; the at least one inductor coil coupled at one end thereof to a first of the resonators of the first or second transmit dielectric monolithic block via a first of the transmission lines and coupled at another end thereof to a second of the resonators of the first or second dielectric monolithic block via a second of the transmission lines; the at least one inductor coil providing inductive coupling between the first of the resonators and the second of the resonators; and a shield having tuning windows mounted to the circuit substrate encasing the transmit and receive dielectric monolithic blocks and the inductor coil.