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Patent US5859474A successfully refreshed from Google Patents.
US5859474A
Expired / Lapsed
US
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Reflow ball grid array assembly
Assignee: Adeia Semiconductor Technologies LLC
•
Filing: 1997-04-23
•
Granted: 1999-01-12
•
Expires: 2017-04-23
Abstract
Abstract A first array of elongate pads is formed on a first surface, such as that of an integrated circuit substrate, and a second array of elongate pads is formed on a second surface, such as that of a printed circuit board. An array of solder balls are reflow attached to the pads of the first array and then to the pads of the second array, to thereby electrically connect the substrate to the printed circuit board. The reflow solder balls thereby conform to the elongate shapes of the pads to be configured like truncated ellipsoids. Due to the surface tension forces between the pads and the balls therebetween, the "ellipsoids" advantageously have a high standoff. Also, the pads on each of the sides of the perimeter of the array are aligned longitudinally perpendicular to the respective sides. Thereby, wide channels between adjacent elongate pads are defined, through which one or more additional traces can advantageously be routed on the surface between the pads.
Inventors
- 👤 Yezdi N. Dordi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 20:56
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W90/00; H10W90/701; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09218; H05K2201/09227; H05K2201/09372; H05K2201/0939; H05K2201/094; H05K2203/00; H05K2203/04; H05K2203/0465; H10W72/00; H10W72/20; H10W72/251; H10W72/252; H10W72/851; H10W72/874; H10W72/884; H10W90/721; H10W90/724; H10W90/751; H10W90/754; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 171
Claim 1
Independent Claim
104 words
A reflow ball grid array assembly, comprising: a first structure having a first structure surface; a second structure having a second structure surface; a plurality of reflow balls forming a reflow ball grid array operatively positioned between said first and second structure surfaces; and an array of pads on said first structure surface, at least some of said pads having non-circular elongate shapes to which corresponding ones of said balls are reflow attached and thereby at least partially conform to the non-circular elongate shapes; wherein said balls when reflow attached to and between said first and second structures are shaped generally as truncated ellipsoids.
Claim 2
Dependent Claim
104 words
A reflow ball grid array assembly, comprising: a first structure having a first structure surface; a second structure having a second structure surface; a plurality of reflow balls forming a reflow ball grid array operatively positioned between said first and second structure surfaces; and an array of pads on said first structure surface, at least some of said pads having non-circular elongate shapes to which corresponding ones of said balls are reflow attached and thereby at least partially conform to the non-circular elongate shapes; wherein said balls when reflow attached to and between said first and second structures are shaped generally as truncated ellipsoids.
Claim 3
Dependent Claim
40 words
The assembly of claim 1 wherein respective ones of said solder balls which are reflow attached to respective ones of said elongate pads have high standoffs due to tension surface forces of said reflow solder balls on said elongate pads.
Claim 4
Dependent Claim
13 words
The assembly of claim 1 wherein said first structure is a package substrate.
Claim 5
Dependent Claim
15 words
The assembly of claim 3 wherein said second structure is a circuit board or motherboard.
Claim 6
Dependent Claim
13 words
The assembly of claim 1 wherein said second structure is a package substrate.
Claim 7
Dependent Claim
16 words
The assembly of claim 5 wherein said first structure is a circuit board or a motherboard.
Claim 8
Dependent Claim
21 words
The assembly of claim 1 wherein said first structure is a substrate and said second structure is an integrated circuit chip.
Claim 9
Dependent Claim
21 words
The assembly of claim 1 wherein said first structure is a substrate, and further comprising a die mounted on said substrate.
Claim 10
Dependent Claim
19 words
The assembly of claim 8 wherein said die is mounted on said first structure surface in a "die-down" configuration.
Claim 11
Dependent Claim
22 words
The assembly of claim 8 wherein said die is mounted on a surface of said substrate opposite to said first structure surface.
Claim 12
Dependent Claim
14 words
The assembly of claim 8 wherein said die is wire bonded to said substrate.
Claim 13
Dependent Claim
19 words
The assembly of claim 1 wherein each of said pads of said array of pads has an elongate shape.
Claim 14
Dependent Claim
12 words
The assembly of claim 1 wherein the elongate shape is an ellipse.
Claim 15
Dependent Claim
17 words
The assembly of claim 1 wherein the elongate shapes each have a length-to-width ratio of generally three-to-one.
Claim 16
Dependent Claim
40 words
The assembly of claim 1 wherein said array of pads defines a first array of pads, and further comprising a second array of pads on said second structure surface to which said balls are reflow attached at opposite ends thereof.
Claim 17
Dependent Claim
26 words
The assembly of claim 15 wherein said second array of pads have similar elongate shapes and relative spacings and alignments as said first array of pads.
Claim 18
Dependent Claim
27 words
The assembly of claim 1 wherein at least two of said elongate pads are adjacent one another and longitudinally aligned to provide a wide routing channel therebetween.
Claim 19
Dependent Claim
24 words
The assembly of claim 17 further comprising a plurality of spaced traces on said first structure surface and passing through said wide routing channel.
Claim 20
Dependent Claim
31 words
The assembly of claim 17 wherein said at least two of said elongate pads are on a side of a perimeter of said array and are disposed perpendicular to the side.
Claim 21
Dependent Claim
27 words
The assembly of claim 17 wherein said elongate pads are on all sides of a perimeter of said array and each disposed perpendicular to respective said sides.
Claim 22
Dependent Claim
18 words
The assembly of claim 20 wherein said array includes an elongate pad in each of four corners thereof.
Claim 23
Dependent Claim
23 words
The assembly of claim 21 wherein said corner elongate pads are disposed at a generally 45 degree angle at each of the comers.
Claim 24
Dependent Claim
19 words
The assembly of claim 21 wherein adjacent ones of said corner elongate pads are disposed perpendicular to one another.
Claim 25
Dependent Claim
18 words
The assembly of claim 21 wherein said comer elongate pads are disposed in alternating horizontal and vertical directions.
Claim 26
Dependent Claim
96 words
A reflow ball grid array assembly, comprising: a first structure having a first structure surface; a second structure having a second structure surface; a plurality of reflow balls forming a reflow ball grid array operatively positioned between said first and second structure surfaces; and an array of pads on said first structure surface, at least some of said pads having non-circular elongate shapes to which corresponding ones of said balls are reflow attached and thereby at least partially conform to the non-circular elongate shapes; wherein the elongate shapes each have a length-to-width ratio of generally three-to-one.
Claim 27
Dependent Claim
96 words
A reflow ball grid array assembly, comprising: a first structure having a first structure surface; a second structure having a second structure surface; a plurality of reflow balls forming a reflow ball grid array operatively positioned between said first and second structure surfaces; and an array of pads on said first structure surface, at least some of said pads having non-circular elongate shapes to which corresponding ones of said balls are reflow attached and thereby at least partially conform to the non-circular elongate shapes; wherein the elongate shapes each have a length-to-width ratio of generally three-to-one.
Claim 28
Dependent Claim
40 words
The assembly of claim 25 wherein respective ones of said solder balls which are reflow attached to respective ones of said elongate pads have high standoffs due to tension surface forces of said reflow solder balls on said elongate pads.
Claim 29
Dependent Claim
13 words
The assembly of claim 25 wherein said first structure is a package substrate.
Claim 30
Dependent Claim
16 words
The assembly of claim 27 wherein said second structure is a circuit board or a motherboard.
Claim 31
Dependent Claim
13 words
The assembly of claim 25 wherein said second structure is a package substrate.
Claim 32
Dependent Claim
16 words
The assembly of claim 29 wherein said first structure is a circuit board or a motherboard.
Claim 33
Dependent Claim
21 words
The assembly of claim 25 wherein said first structure is a substrate and said second structure is an integrated circuit chip.
Claim 34
Dependent Claim
21 words
The assembly of claim 25 wherein said first structure is a substrate, and further comprising a die mounted on said substrate.
Claim 35
Dependent Claim
19 words
The assembly of claim 32 wherein said die is mounted on said first structure surface in a "die-down" configuration.
Claim 36
Dependent Claim
22 words
The assembly of claim 32 wherein said die is mounted on a surface of said substrate opposite to said first structure surface.
Claim 37
Dependent Claim
14 words
The assembly of claim 25 wherein said die is wire bonded to said substrate.
Claim 38
Dependent Claim
19 words
The assembly of claim 25 wherein each of said pads of said array of pads has an elongate shape.
Claim 39
Dependent Claim
12 words
The assembly of claim 25 wherein the elongate shape is an ellipse.
Claim 40
Dependent Claim
15 words
The assembly of claim 25 wherein the elongate shape is a rectangle with rounded ends.
Claim 41
Dependent Claim
40 words
The assembly of claim 25 wherein said array of pads defines a first array of pads, and further comprising a second array of pads on said second structure surface to which said balls are reflow attached at opposite ends thereof.
Claim 42
Dependent Claim
26 words
The assembly of claim 39 wherein said second array of pads have similar elongate shapes and relative spacings and alignments as said first array of pads.
Claim 43
Dependent Claim
16 words
The assembly of claim 40 wherein said balls when reflow attached are shaped as truncated ellipsoids.
Claim 44
Dependent Claim
27 words
The assembly of claim 25 wherein at least two of said elongate pads are adjacent one another and longitudinally aligned to provide a wide routing channel therebetween.
Claim 45
Dependent Claim
24 words
The assembly of claim 42 further comprising a plurality of spaced traces on said first structure surface and passing through said wide routing channel.
Claim 46
Dependent Claim
31 words
The assembly of claim 42 wherein said at least two of said elongate pads are on a side of a perimeter of said array and are disposed perpendicular to the side.
Claim 47
Dependent Claim
27 words
The assembly of claim 42 wherein said elongate pads are on all sides of a perimeter of said array and each disposed perpendicular to respective said sides.
Claim 48
Dependent Claim
18 words
The assembly of claim 45 wherein said array includes an elongate pad in each of four corners thereof.
Claim 49
Dependent Claim
23 words
The assembly of claim 46 wherein said corner elongate pads are disposed at a generally 45 degree angle at each of the corners.
Claim 50
Dependent Claim
19 words
The assembly of claim 46 wherein adjacent ones of said corner elongate pads are disposed perpendicular to one another.
Claim 51
Dependent Claim
18 words
The assembly of claim 46 wherein said corner elongate pads are disposed in alternating horizontal and vertical directions.
Claim 52
Dependent Claim
94 words
A reflow ball grid array assembly, comprising: a first structure having a first structure surface; a second structure having a second structure surface; a plurality of reflow balls forming a reflow ball grid array operatively positioned between said first and second structure surfaces; and an array of pads on said first structure surface, at least some of said pads having non-circular elongate shapes to which corresponding ones of said balls are reflow attached and thereby at least partially conform to the non-circular elongate shapes; wherein the elongate shape is a rectangle with rounded ends.
Claim 53
Dependent Claim
94 words
A reflow ball grid array assembly, comprising: a first structure having a first structure surface; a second structure having a second structure surface; a plurality of reflow balls forming a reflow ball grid array operatively positioned between said first and second structure surfaces; and an array of pads on said first structure surface, at least some of said pads having non-circular elongate shapes to which corresponding ones of said balls are reflow attached and thereby at least partially conform to the non-circular elongate shapes; wherein the elongate shape is a rectangle with rounded ends.
Claim 54
Dependent Claim
40 words
The assembly of claim 50 wherein respective ones of said solder balls which are reflow attached to respective ones of said elongate pads have high standoffs due to tension surface forces of said reflow solder balls on said elongate pads.
Claim 55
Dependent Claim
13 words
The assembly of claim 50 wherein said first structure is a package substrate.
Claim 56
Dependent Claim
16 words
The assembly of claim 52 wherein said second structure is a circuit board or a motherboard.
Claim 57
Dependent Claim
13 words
The assembly of claim 50 wherein said second structure is a package substrate.
Claim 58
Dependent Claim
16 words
The assembly of claim 54 wherein said first structure is a circuit board or a motherboard.
Claim 59
Dependent Claim
21 words
The assembly of claim 50 wherein said first structure is a substrate and said second structure is an integrated circuit chip.
Claim 60
Dependent Claim
21 words
The assembly of claim 50 wherein said first structure is a substrate, and further comprising a die mounted on said substrate.
Claim 61
Dependent Claim
19 words
The assembly of claim 57 wherein said die is mounted on said first structure surface in a "die-down" configuration.
Claim 62
Dependent Claim
22 words
The assembly of claim 57 wherein said die is mounted on a surface of said substrate opposite to said first structure surface.
Claim 63
Dependent Claim
14 words
The assembly of claim 57 wherein said die is wire bonded to said substrate.
Claim 64
Dependent Claim
19 words
The assembly of claim 57 wherein each of said pads of said array of pads has an elongate shape.
Claim 65
Dependent Claim
40 words
The assembly of claim 57 wherein said array of pads defines a first array of pads, and further comprising a second array of pads on said second structure surface to which said balls are reflow attached at opposite ends thereof.
Claim 66
Dependent Claim
26 words
The assembly of claim 62 wherein said second array of pads have similar elongate shapes and relative spacings and alignments as said first array of pads.
Claim 67
Dependent Claim
16 words
The assembly of claim 63 wherein said balls when reflow attached are shaped as truncated ellipsoids.
Claim 68
Dependent Claim
27 words
The assembly of claim 57 wherein at least two of said elongate pads are adjacent one another and longitudinally aligned to provide a wide routing channel therebetween.
Claim 69
Dependent Claim
24 words
The assembly of claim 65 further comprising a plurality of spaced traces on said first structure surface and passing through said wide routing channel.
Claim 70
Dependent Claim
31 words
The assembly of claim 65 wherein said at least two of said elongate pads are on a side of a perimeter of said array and are disposed perpendicular to the side.
Claim 71
Dependent Claim
27 words
The assembly of claim 65 wherein said elongate pads are on all sides of a perimeter of said array and each disposed perpendicular to respective said sides.
Claim 72
Dependent Claim
18 words
The assembly of claim 68 wherein said array includes an elongate pad in each of four corners thereof.
Claim 73
Dependent Claim
23 words
The assembly of claim 69 wherein said comer elongate pads are disposed at a generally 45 degree angle at each of the corners.
Claim 74
Dependent Claim
19 words
The assembly of claim 69 wherein adjacent ones of said corner elongate pads are disposed perpendicular to one another.
Claim 75
Dependent Claim
18 words
The assembly of claim 69 wherein said corner elongate pads are disposed in alternating horizontal and vertical directions.
Claim 76
Dependent Claim
127 words
A reflow ball grid array assembly, comprising: a first structure having a first structure surface; a second structure having a second structure surface; a plurality of reflow balls forming a reflow ball grid array operatively positioned between said first and second structure surfaces; a first array of pads on said first structure surface, at least some of said pads having non-circular elongate shapes to which corresponding ones of said balls are reflow attached and thereby at least partially conform to the non-circular elongate shapes; and a second array of pads on said second structure surface to which said balls are reflow attached at opposite ends thereof; wherein said second array of pads have similar elongate shapes and relative spacings and alignments as said first array of pads.
Claim 77
Dependent Claim
127 words
A reflow ball grid array assembly, comprising: a first structure having a first structure surface; a second structure having a second structure surface; a plurality of reflow balls forming a reflow ball grid array operatively positioned between said first and second structure surfaces; a first array of pads on said first structure surface, at least some of said pads having non-circular elongate shapes to which corresponding ones of said balls are reflow attached and thereby at least partially conform to the non-circular elongate shapes; and a second array of pads on said second structure surface to which said balls are reflow attached at opposite ends thereof; wherein said second array of pads have similar elongate shapes and relative spacings and alignments as said first array of pads.
Claim 78
Dependent Claim
40 words
The assembly of claim 73 wherein respective ones of said solder balls which are reflow attached to respective ones of said elongate pads have high standoffs due to tension surface forces of said reflow solder balls on said elongate pads.
Claim 79
Dependent Claim
13 words
The assembly of claim 73 wherein said first structure is a package substrate.
Claim 80
Dependent Claim
15 words
The assembly of claim 75 wherein said second structure is a circuit board or motherboard.
Claim 81
Dependent Claim
13 words
The assembly of claim 73 wherein said second structure is a package substrate.
Claim 82
Dependent Claim
16 words
The assembly of claim 77 wherein said first structure is a circuit board or a motherboard.
Claim 83
Dependent Claim
21 words
The assembly of claim 73 wherein said first structure is a substrate and said second structure is an integrated circuit chip.
Claim 84
Dependent Claim
21 words
The assembly of claim 73 wherein said first structure is a substrate, and further comprising a die mounted on said substrate.
Claim 85
Dependent Claim
19 words
The assembly of claim 80 wherein said die is mounted on said first structure surface in a "die-down" configuration.
Claim 86
Dependent Claim
22 words
The assembly of claim 80 wherein said die is mounted on a surface of said substrate opposite to said first structure surface.
Claim 87
Dependent Claim
14 words
The assembly of claim 80 wherein said die is wire bonded to said substrate.
Claim 88
Dependent Claim
19 words
The assembly of claim 73 wherein each of said pads of said array of pads has an elongate shape.
Claim 89
Dependent Claim
12 words
The assembly of claim 73 wherein the elongate shape is an ellipse.
Claim 90
Dependent Claim
16 words
The assembly of claim 73 wherein said balls when reflow attached are shaped as truncated ellipsoids.
Claim 91
Dependent Claim
27 words
The assembly of claim 73 wherein at least two of said elongate pads are adjacent one another and longitudinally aligned to provide a wide routing channel therebetween.
Claim 92
Dependent Claim
24 words
The assembly of claim 87 further comprising a plurality of spaced traces on said first structure surface and passing through said wide routing channel.
Claim 93
Dependent Claim
31 words
The assembly of claim 87 wherein said at least two of said elongate pads are on a side of a perimeter of said array and are disposed perpendicular to the side.
Claim 94
Dependent Claim
27 words
The assembly of claim 87 wherein said elongate pads are on all sides of a perimeter of said array and each disposed perpendicular to respective said sides.
Claim 95
Dependent Claim
18 words
The assembly of claim 90 wherein said array includes an elongate pad in each of four corners thereof.
Claim 96
Dependent Claim
23 words
The assembly of claim 91 wherein said comer elongate pads are disposed at a generally 45 degree angle at each of the corners.
Claim 97
Dependent Claim
19 words
The assembly of claim 91 wherein adjacent ones of said comer elongate pads are disposed perpendicular to one another.
Claim 98
Dependent Claim
18 words
The assembly of claim 91 wherein said corner elongate pads are disposed in alternating horizontal and vertical directions.
Claim 99
Dependent Claim
122 words
A reflow ball grid array assembly, comprising: a first structure having a first structure surface; a second structure having a second structure surface; a plurality of reflow balls forming a reflow ball grid array operatively positioned between said first and second structure surfaces; an array of pads on said first structure surface, at least some of said pads having non-circular elongate shapes to which corresponding ones of said balls are reflow attached and thereby at least partially conform to the non-circular elongate shapes; at least two of said elongate pads are adjacent one another and longitudinally aligned to provide a wide routing channel therebetween; and a plurality of spaced traces on said first structure surface and passing through said wide routing channel.
Claim 100
Dependent Claim
122 words
A reflow ball grid array assembly, comprising: a first structure having a first structure surface; a second structure having a second structure surface; a plurality of reflow balls forming a reflow ball grid array operatively positioned between said first and second structure surfaces; an array of pads on said first structure surface, at least some of said pads having non-circular elongate shapes to which corresponding ones of said balls are reflow attached and thereby at least partially conform to the non-circular elongate shapes; at least two of said elongate pads are adjacent one another and longitudinally aligned to provide a wide routing channel therebetween; and a plurality of spaced traces on said first structure surface and passing through said wide routing channel.
Claim 101
Dependent Claim
40 words
The assembly of claim 95 wherein respective ones of said solder balls which are reflow attached to respective ones of said elongate pads have high standoffs due to tension surface forces of said reflow solder balls on said elongate pads.
Claim 102
Dependent Claim
13 words
The assembly of claim 95 wherein said first structure is a package substrate.
Claim 103
Dependent Claim
16 words
The assembly of claim 97 wherein said second structure is a circuit board or a motherboard.
Claim 104
Dependent Claim
13 words
The assembly of claim 95 wherein said second structure is a package substrate.
Claim 105
Dependent Claim
16 words
The assembly of claim 99 wherein said first structure is a circuit board or a motherboard.
Claim 106
Dependent Claim
21 words
The assembly of claim 95 wherein said first structure is a substrate and said second structure is an integrated circuit chip.
Claim 107
Dependent Claim
21 words
The assembly of claim 95 wherein said first structure is a substrate, and further comprising a die mounted on said substrate.
Claim 108
Dependent Claim
19 words
The assembly of claim 102 wherein said die is mounted on said first structure surface in a "die-down" configuration.
Claim 109
Dependent Claim
22 words
The assembly of claim 102 wherein said die is mounted on a surface of said substrate opposite to said first structure surface.
Claim 110
Dependent Claim
14 words
The assembly of claim 102 wherein said die is wire bonded to said substrate.
Claim 111
Dependent Claim
19 words
The assembly of claim 95 wherein each of said pads of said array of pads has an elongate shape.
Claim 112
Dependent Claim
12 words
The assembly of claim 95 wherein the elongate shape is an ellipse.
Claim 113
Dependent Claim
40 words
The assembly of claim 95 wherein said array of pads defines a first array of pads, and further comprising a second array of pads on said second structure surface to which said balls are reflow attached at opposite ends thereof.
Claim 114
Dependent Claim
26 words
The assembly of claim 108 wherein said second array of pads have similar elongate shapes and relative spacings and alignments as said first array of pads.
Claim 115
Dependent Claim
16 words
The assembly of claim 109 wherein said balls when reflow attached are shaped as truncated ellipsoids.
Claim 116
Dependent Claim
31 words
The assembly of claim 95 wherein said at least two of said elongate pads are on a side of a perimeter of said array and are disposed perpendicular to the side.
Claim 117
Dependent Claim
27 words
The assembly of claim 95 wherein said elongate pads are on all sides of a perimeter of said array and each disposed perpendicular to respective said sides.
Claim 118
Dependent Claim
18 words
The assembly of claim 112 wherein said array includes an elongate pad in each of four corners thereof.
Claim 119
Dependent Claim
23 words
The assembly of claim 113 wherein said comer elongate pads are disposed at a generally 45 degree angle at each of the corners.
Claim 120
Dependent Claim
19 words
The assembly of claim 113 wherein adjacent ones of said corner elongate pads are disposed perpendicular to one another.
Claim 121
Dependent Claim
18 words
The assembly of claim 113 wherein said corner elongate pads are disposed in alternating horizontal and vertical directions.
Claim 122
Dependent Claim
160 words
A reflow ball grid array assembly, comprising: a first structure having a first structure surface; a second structure having a second structure surface; a plurality of reflow balls forming a reflow ball grid array operatively positioned between said first and second structure surfaces; and an array of pads on said first structure surface, at least some of said pads having non-circular elongate shapes to which corresponding ones of said balls are reflow attached and thereby at least partially conform to the non-circular elongate shapes; wherein at least two of said elongate pads are adjacent one another and longitudinally aligned to provide a wide routing channel therebetween; wherein said elongate pads are on all sides of a perimeter of said array and each disposed perpendicular to respective said sides; wherein said array includes an elongate pad in each of four corners thereof; and wherein said corner elongate pads are disposed at a generally 45 degree angle at each of the corners.
Claim 123
Dependent Claim
160 words
A reflow ball grid array assembly, comprising: a first structure having a first structure surface; a second structure having a second structure surface; a plurality of reflow balls forming a reflow ball grid array operatively positioned between said first and second structure surfaces; and an array of pads on said first structure surface, at least some of said pads having non-circular elongate shapes to which corresponding ones of said balls are reflow attached and thereby at least partially conform to the non-circular elongate shapes; wherein at least two of said elongate pads are adjacent one another and longitudinally aligned to provide a wide routing channel therebetween; wherein said elongate pads are on all sides of a perimeter of said array and each disposed perpendicular to respective said sides; wherein said array includes an elongate pad in each of four corners thereof; and wherein said corner elongate pads are disposed at a generally 45 degree angle at each of the corners.
Claim 124
Dependent Claim
40 words
The assembly of claim 117 wherein respective ones of said solder balls which are reflow attached to respective ones of said elongate pads have high standoffs due to tension surface forces of said reflow solder balls on said elongate pads.
Claim 125
Dependent Claim
13 words
The assembly of claim 117 wherein said first structure is a package substrate.
Claim 126
Dependent Claim
16 words
The assembly of claim 119 wherein said second structure is a circuit board or a motherboard.
Claim 127
Dependent Claim
13 words
The assembly of claim 117 wherein said second structure is a package substrate.
Claim 128
Dependent Claim
16 words
The assembly of claim 121 wherein said first structure is a circuit board or a motherboard.
Claim 129
Dependent Claim
21 words
The assembly of claim 117 wherein said first structure is a substrate and said second structure is an integrated circuit chip.
Claim 130
Dependent Claim
21 words
The assembly of claim 117 wherein said first structure is a substrate, and further comprising a die mounted on said substrate.
Claim 131
Dependent Claim
19 words
The assembly of claim 124 wherein said die is mounted on said first structure surface in a "die-down" configuration.
Claim 132
Dependent Claim
22 words
The assembly of claim 124 wherein said die is mounted on a surface of said substrate opposite to said first structure surface.
Claim 133
Dependent Claim
14 words
The assembly of claim 124 wherein said die is wire bonded to said substrate.
Claim 134
Dependent Claim
19 words
The assembly of claim 117 wherein each of said pads of said array of pads has an elongate shape.
Claim 135
Dependent Claim
12 words
The assembly of claim 117 wherein the elongate shape is an ellipse.
Claim 136
Dependent Claim
24 words
The assembly of claim 117 further comprising a plurality of spaced traces on said first structure surface and passing through said wide routing channel.
Claim 137
Dependent Claim
19 words
The assembly of claim 130 wherein adjacent ones of said corner elongate pads are disposed perpendicular to one another.
Claim 138
Dependent Claim
18 words
The assembly of claim 130 wherein said corner elongate pads are disposed in alternating horizontal and vertical directions.
Claim 139
Dependent Claim
156 words
A reflow ball grid array assembly, comprising: a first structure having a first structure surface; a second structure having a second structure surface; a plurality of reflow balls forming a reflow ball grid array operatively positioned between said first and second structure surfaces; and an array of pads on said first structure surface, at least some of said pads having non-circular elongate shapes to which corresponding ones of said balls are reflow attached and thereby at least partially conform to the non-circular elongate shapes; wherein at least two of said elongate pads are adjacent one another and longitudinally aligned to provide a wide routing channel therebetween; wherein said elongate pads are on all sides of a perimeter of said array and each disposed perpendicular to respective said sides; wherein said array includes an elongate pad in each of four comers thereof; and wherein adjacent ones of said corner elongate pads are disposed perpendicular to one another.
Claim 140
Dependent Claim
156 words
A reflow ball grid array assembly, comprising: a first structure having a first structure surface; a second structure having a second structure surface; a plurality of reflow balls forming a reflow ball grid array operatively positioned between said first and second structure surfaces; and an array of pads on said first structure surface, at least some of said pads having non-circular elongate shapes to which corresponding ones of said balls are reflow attached and thereby at least partially conform to the non-circular elongate shapes; wherein at least two of said elongate pads are adjacent one another and longitudinally aligned to provide a wide routing channel therebetween; wherein said elongate pads are on all sides of a perimeter of said array and each disposed perpendicular to respective said sides; wherein said array includes an elongate pad in each of four comers thereof; and wherein adjacent ones of said corner elongate pads are disposed perpendicular to one another.
Claim 141
Dependent Claim
40 words
The assembly of claim 133 wherein respective ones of said solder balls which are reflow attached to respective ones of said elongate pads have high standoffs due to tension surface forces of said reflow solder balls on said elongate pads.
Claim 142
Dependent Claim
13 words
The assembly of claim 133 wherein said first structure is a package substrate.
Claim 143
Dependent Claim
15 words
The assembly of claim 135 wherein said second structure is a circuit board or motherboard.
Claim 144
Dependent Claim
13 words
The assembly of claim 133 wherein said second structure is a package substrate.
Claim 145
Dependent Claim
16 words
The assembly of claim 137 wherein said first structure is a circuit board or a motherboard.
Claim 146
Dependent Claim
21 words
The assembly of claim 133 wherein said first structure is a substrate, and said second structure is an integrated circuit chip.
Claim 147
Dependent Claim
21 words
The assembly of claim 133 wherein said first structure is a substrate, and further comprising a die mounted on said substrate.
Claim 148
Dependent Claim
19 words
The assembly of claim 140 wherein said die is mounted on said first structure surface in a "die-down" configuration.
Claim 149
Dependent Claim
22 words
The assembly of claim 140 wherein said die is mounted on a surface of said substrate opposite to said first structure surface.
Claim 150
Dependent Claim
14 words
The assembly of claim 140 wherein said die is wire bonded to said substrate.
Claim 151
Dependent Claim
19 words
The assembly of claim 133 wherein each of said pads of said array of pads has an elongate shape.
Claim 152
Dependent Claim
12 words
The assembly of claim 133 wherein the elongate shape is an ellipse.
Claim 153
Dependent Claim
40 words
The assembly of claim 133 wherein said array of pads defines a first array of pads, and further comprising a second array of pads on said second structure surface to which said balls are reflow attached at opposite ends thereof.
Claim 154
Dependent Claim
31 words
The assembly of claim 133 wherein said at least two of said elongate pads are on a side of a perimeter of said array and are disposed perpendicular to the side.
Claim 155
Dependent Claim
23 words
The assembly of claim 133 wherein said corner elongate pads are disposed at a generally 45 degree angle at each of the corners.
Claim 156
Dependent Claim
18 words
The assembly of claim 133 wherein said comer elongate pads are disposed in alternating horizontal and vertical directions.
Claim 157
Dependent Claim
155 words
A reflow ball grid array assembly, comprising: a first structure having a first structure surface; a second structure having a second structure surface; a plurality of reflow balls forming a reflow ball grid array operatively positioned between said first and second structure surfaces; and an array of pads on said first structure surface, at least some of said pads having non-circular elongate shapes to which corresponding ones of said balls are reflow attached and thereby at least partially conform to the non-circular elongate shapes; wherein at least two of said elongate pads are adjacent one another and longitudinally aligned to provide a wide routing channel therebetween; wherein said elongate pads are on all sides of a perimeter of said array and each disposed perpendicular to respective said sides; wherein said array includes an elongate pad in each of four corners thereof.; and wherein said corner elongate pads are disposed in alternating horizontal and vertical directions.
Claim 158
Dependent Claim
155 words
A reflow ball grid array assembly, comprising: a first structure having a first structure surface; a second structure having a second structure surface; a plurality of reflow balls forming a reflow ball grid array operatively positioned between said first and second structure surfaces; and an array of pads on said first structure surface, at least some of said pads having non-circular elongate shapes to which corresponding ones of said balls are reflow attached and thereby at least partially conform to the non-circular elongate shapes; wherein at least two of said elongate pads are adjacent one another and longitudinally aligned to provide a wide routing channel therebetween; wherein said elongate pads are on all sides of a perimeter of said array and each disposed perpendicular to respective said sides; wherein said array includes an elongate pad in each of four corners thereof.; and wherein said corner elongate pads are disposed in alternating horizontal and vertical directions.
Claim 159
Dependent Claim
40 words
The assembly of claim 150 wherein respective ones of said solder balls which are reflow attached to respective ones of said elongate pads have high standoffs due to tension surface forces of said reflow solder balls on said elongate pads.
Claim 160
Dependent Claim
13 words
The assembly of claim 150 wherein said first structure is a package substrate.
Claim 161
Dependent Claim
15 words
The assembly of claim 152 wherein said second structure is a circuit board or motherboard.
Claim 162
Dependent Claim
13 words
The assembly of claim 150 wherein said second structure is a package substrate.
Claim 163
Dependent Claim
16 words
The assembly of claim 154 wherein said first structure is a circuit board or a motherboard.
Claim 164
Dependent Claim
21 words
The assembly of claim 150 wherein said first structure is a substrate, and said second structure is an integrated circuit chip.
Claim 165
Dependent Claim
21 words
The assembly of claim 150 wherein said first structure is a substrate, and further comprising a die mounted on said substrate.
Claim 166
Dependent Claim
19 words
The assembly of claim 157 wherein said die is mounted on said first structure surface in a "die-down" configuration.
Claim 167
Dependent Claim
22 words
The assembly of claim 157 wherein said die is mounted on a surface of said substrate opposite to said first structure surface.
Claim 168
Dependent Claim
14 words
The assembly of claim 157 wherein said die is wire bonded to said substrate.
Claim 169
Dependent Claim
19 words
The assembly of claim 150 wherein each of said pads of said array of pads has an elongate shape.
Claim 170
Dependent Claim
12 words
The assembly of claim 150 wherein the elongate shape is an ellipse.
Claim 171
Dependent Claim
40 words
The assembly of claim 150 wherein said array of pads defines a first array of pads, and further comprising a second array of pads on said second structure surface to which said balls are reflow attached at opposite ends thereof.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-01-11 | 2002-07-13 | 2003-01-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-01-11 | 2006-07-13 | 2007-01-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-01-11 | 2010-07-13 | 2011-01-12 | $7700.00 | Window Closed / Lapsed |