Patent US5851337A successfully refreshed from Google Patents.
US5851337A
Expired / Lapsed
US
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Method of connecting TEHS on PBGA and modified connecting structure
Assignee: Siliconware Precision Industries Co Ltd
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Filing: 1997-06-30
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Granted: 1998-12-22
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Expires: 2017-06-30
Abstract
Abstract A method for connecting TEHS to PBGA and a modified connecting structure for TEHS and PBGA are disclosed. The structure improves both heat dissipation efficiency of PBGA by TEHS with high heat conductivity and electrical performance of PBGA by TEHS which is electrically connected to the circuit in PBGA substrate. There are two methods of connecting TEHS to PBGA, including metallic soldering and nonmetallic adhesion. In the metallic soldering, the contact region of the TEHS is covered with a layer of solder tin and soldered to metallic contact region of the growing circuit in the substrate. In the nonmetallic adhesion, the metallic contact region of the growing circuit is covered with a layer of conductive resin. The TEHS is adhered and fixed to the metallic region by curing the conductive resin. Such two methods achieve that the TEHS is completely connected to the ground circuit in the substrate and the inductance of the whole device is reduced to decrease the noise which is generated by the inductance, and further to improve the quality of high speed transmission. Modified structures for soldering TEHS are also provided to reduce the concentration of stress.
Inventors
- 👤 Shih-Li Chen
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 18:57
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/117
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
106 words
A method for connecting a TEHS to a PBGA, comprising the steps of: (a) preparing a TEHS having connecting parts; (b) forming hollow structures in said connecting parts; (c) preparing a PBGA based on a substrate having connecting regions; (d) covering a layer of thermally conductive elastic connecting medium over said connecting regions; (e) connecting said connecting parts of said TEHS to said connecting regions of said substrate by means of the layer of said connecting medium, the hollow structures in said connecting parts being filled with a portion of said connecting medium; and (f) treating said connecting medium appropriately for forming an elastic connecting structure.
Claim 2
Independent Claim
106 words
A method for connecting a TEHS to a PBGA, comprising the steps of: (a) preparing a TEHS having connecting parts; (b) forming hollow structures in said connecting parts; (c) preparing a PBGA based on a substrate having connecting regions; (d) covering a layer of thermally conductive elastic connecting medium over said connecting regions; (e) connecting said connecting parts of said TEHS to said connecting regions of said substrate by means of the layer of said connecting medium, the hollow structures in said connecting parts being filled with a portion of said connecting medium; and (f) treating said connecting medium appropriately for forming an elastic connecting structure.
Claim 3
Dependent Claim
13 words
The method according to claim 1, said connecting parts comprising hollow connecting pins.
Claim 4
Dependent Claim
14 words
The method according to claim 1, said elastic connecting medium comprising a non-metallic adhesive.
Claim 5
Dependent Claim
53 words
The method according to claim 1, said substrate further comprising a circuit having a part exposed in said connecting regions, said elastic connecting medium being thermally as well as electrically conductive, and said connecting parts of said TEHS, being electrically and thermally connected to the exposed part of the circuit of said substrate.
Claim 6
Dependent Claim
13 words
The method according to claim 4, said connecting parts comprising hollow connecting pins.
Claim 7
Dependent Claim
14 words
The method according to claim 4, said elastic connecting medium comprising a non-metallic adhesive.
Claim 8
Dependent Claim
17 words
The method according to claim 4, said elastic connecting medium comprising a resin having silver particle filler.
Claim 9
Dependent Claim
18 words
The method according to claim 7, wherein treating said elastic connecting medium comprises heating, exposing ultraviolet and curing.
Claim 10
Dependent Claim
13 words
The method according to claim 4, said elastic connecting medium comprising solder tin.
Claim 11
Dependent Claim
17 words
The method according to claim 9, wherein treating said elastic connecting medium comprises thermal soldering and cooling.
Claim 12
Dependent Claim
24 words
The method according to claim 4, further comprising a step of coating an electrically conductive anti-oxidation layer on said connecting parts of said TEHS.
Claim 13
Dependent Claim
73 words
A connecting structure for connecting and fixing a TEHS to a substrate of a PBGA, comprising: a plurality of connecting parts of said TEHS, said connecting parts having hollow structures; a connecting region of said substrate; and a thermally conductive elastic connecting medium connecting said connecting parts of said TEHS to said connecting region of said substrate, said hollow structure in said connecting parts being filled with a portion of said connecting medium.
Claim 14
Dependent Claim
73 words
A connecting structure for connecting and fixing a TEHS to a substrate of a PBGA, comprising: a plurality of connecting parts of said TEHS, said connecting parts having hollow structures; a connecting region of said substrate; and a thermally conductive elastic connecting medium connecting said connecting parts of said TEHS to said connecting region of said substrate, said hollow structure in said connecting parts being filled with a portion of said connecting medium.
Claim 15
Dependent Claim
14 words
The connecting structure according to claim 12, said connecting parts comprising hollow connecting pins.
Claim 16
Dependent Claim
15 words
The connecting structure according to claim 12, said elastic connecting medium comprising a non-metallic adhesive.
Claim 17
Dependent Claim
54 words
The connecting structure according to claim 12, said substrate further comprising a circuit having a part exposed in said connecting regions, said elastic connecting medium being thermally as well as electrically conductive, and said connecting parts of said TEHS being electrically and thermally connected to the exposed part of the circuit of said substrate.
Claim 18
Dependent Claim
14 words
The connecting structure according to claim 15, said connecting parts comprising hollow connecting pins.
Claim 19
Dependent Claim
15 words
The connecting structure according to claim 15, said elastic connecting medium comprising a non-metallic adhesive.
Claim 20
Dependent Claim
18 words
The connecting structure according to claim 15, said elastic connecting medium comprising a resin having silver particle filler.
Claim 21
Dependent Claim
14 words
The connecting structure according to claim 15, said elastic connecting medium comprising solder tin.
Claim 22
Dependent Claim
23 words
The connecting structure according to claim 15, said connecting parts of said TEHS further comprising a coating of an electrically conductive anti-oxidation layer.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-12-21 | 2002-06-22 | 2002-12-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-12-21 | 2006-06-22 | 2006-12-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-12-21 | 2010-06-22 | 2010-12-22 | $7700.00 | Window Closed / Lapsed |