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US5846852A Expired / Lapsed US ⏱️ 0.0 years remaining

Process for mounting an electronic component to a substrate and process for spray-cooling the electronic component mounted to a substrate

Assignee: Motorola Solutions Inc
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Filing: 1997-09-15
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Granted: 1998-12-08
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Expires: 2017-09-15
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Abstract

Abstract The electronic component (10) has a die (22) and a terminal (14) coupled to the die (22). The substrate has a first side (20) and a second side (82) and a passage (26) therethrough. The terminal (14) is in communication with the first side (20) and the die (22) is disposed within the passage (26). The apparatus includes a cover (16) which encloses the die (22) and a portion of the terminal (14), and has a fixed portion (28) and a removable portion. The fixed portion (28) includes a connection region coupled to the terminal (14) and an extension region disposed within the passage (26). The extension region has a surface that is substantially coplanar with the second side (82). There is a space (32) between the extension region and the substrate (18). An adhesive (34) is disposed on the surface of the extension region, extending into the space (32). A sealing frame (36) overlaps the space (32) and is in communication with the adhesive (34) and the second side (82).

Inventors

  • 👤 Linda Limper-Brenner
  • 👤 Detlef W. Schmidt
  • 👤 Kevin J. McDunn
  • 👤 Minoo D. Press

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 14:49
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/18; H10; H10W; H10W40/00; H10W40/40; H10W40/47; H10W40/475; H05K1/182

Claims Analysis

Total Claims: 7
Claim 1
Independent Claim 127 words
An apparatus for mounting an electronic component to a substrate, the electronic component having a die and the substrate having a first side and a second side, the method comprising the steps of: providing a passage through the substrate; locating a cover within the passage, the cover enclosing at least a portion of the die, the cover having a fixed portion and a removable portion, the removable portion detachably connected to the fixed portion, the fixed portion having a first end and a second end, the first end coupled to the first side, the second end having a surface that is substantially coplanar with the second side; supplying an adhesive to the surface; and providing a sealing frame in communication with the adhesive and the second side.
Claim 2
Independent Claim 127 words
An apparatus for mounting an electronic component to a substrate, the electronic component having a die and the substrate having a first side and a second side, the method comprising the steps of: providing a passage through the substrate; locating a cover within the passage, the cover enclosing at least a portion of the die, the cover having a fixed portion and a removable portion, the removable portion detachably connected to the fixed portion, the fixed portion having a first end and a second end, the first end coupled to the first side, the second end having a surface that is substantially coplanar with the second side; supplying an adhesive to the surface; and providing a sealing frame in communication with the adhesive and the second side.
Claim 3
Independent Claim 116 words
A method for spray-cooling an electronic component mounted to a substrate, the electronic component having a die and the substrate having a first side and a second side, the method comprising the steps of: providing a passage through the substrate; locating a wall within the passage, the wall surrounding the die and having a base surface and a top surface, the base surface coupled to the first side, the top surface substantially planar to the second side; supplying an adhesive in communication with the top surface; providing a sealing frame in communication with the adhesive and the second side; and coupling a housing defining a chamber to the second side, the housing enclosing the sealing frame.
Claim 4
Independent Claim 116 words
A method for spray-cooling an electronic component mounted to a substrate, the electronic component having a die and the substrate having a first side and a second side, the method comprising the steps of: providing a passage through the substrate; locating a wall within the passage, the wall surrounding the die and having a base surface and a top surface, the base surface coupled to the first side, the top surface substantially planar to the second side; supplying an adhesive in communication with the top surface; providing a sealing frame in communication with the adhesive and the second side; and coupling a housing defining a chamber to the second side, the housing enclosing the sealing frame.
Claim 5
Dependent Claim 64 words
The method according to claim 2, further comprising the steps of: receiving a fluid by a nozzle disposed in the housing, the nozzle having a spray end in communication with the chamber and an aperture disposed at a tip of the spray end; atomizing the fluid by the spray end of the nozzle; and discharging the atomized fluid into the chamber via the aperture.
Claim 6
Dependent Claim 42 words
The method according to claim 3, further comprising the steps of: providing the fluid to the nozzle via a fluid inlet port disposed in the housing; and removing the fluid from the chamber via a fluid outlet port disposed in the housing.
Claim 7
Dependent Claim 45 words
The method according to claim 4, further comprising: receiving the fluid from the fluid outlet port by a condenser; and supplying the fluid by the condenser to a fluid pump, the fluid pump in communication with the fluid inlet port, forming a closed-loop fluid flow.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2001-12-07 2002-06-08 2002-12-08 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2005-12-07 2006-06-08 2006-12-08 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2009-12-07 2010-06-08 2010-12-08 $7700.00 Window Closed / Lapsed

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