Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
127 words
An apparatus for mounting an electronic component to a substrate, the electronic component having a die and the substrate having a first side and a second side, the method comprising the steps of: providing a passage through the substrate; locating a cover within the passage, the cover enclosing at least a portion of the die, the cover having a fixed portion and a removable portion, the removable portion detachably connected to the fixed portion, the fixed portion having a first end and a second end, the first end coupled to the first side, the second end having a surface that is substantially coplanar with the second side; supplying an adhesive to the surface; and providing a sealing frame in communication with the adhesive and the second side.
Claim 2
Independent Claim
127 words
An apparatus for mounting an electronic component to a substrate, the electronic component having a die and the substrate having a first side and a second side, the method comprising the steps of: providing a passage through the substrate; locating a cover within the passage, the cover enclosing at least a portion of the die, the cover having a fixed portion and a removable portion, the removable portion detachably connected to the fixed portion, the fixed portion having a first end and a second end, the first end coupled to the first side, the second end having a surface that is substantially coplanar with the second side; supplying an adhesive to the surface; and providing a sealing frame in communication with the adhesive and the second side.
Claim 3
Independent Claim
116 words
A method for spray-cooling an electronic component mounted to a substrate, the electronic component having a die and the substrate having a first side and a second side, the method comprising the steps of: providing a passage through the substrate; locating a wall within the passage, the wall surrounding the die and having a base surface and a top surface, the base surface coupled to the first side, the top surface substantially planar to the second side; supplying an adhesive in communication with the top surface; providing a sealing frame in communication with the adhesive and the second side; and coupling a housing defining a chamber to the second side, the housing enclosing the sealing frame.
Claim 4
Independent Claim
116 words
A method for spray-cooling an electronic component mounted to a substrate, the electronic component having a die and the substrate having a first side and a second side, the method comprising the steps of: providing a passage through the substrate; locating a wall within the passage, the wall surrounding the die and having a base surface and a top surface, the base surface coupled to the first side, the top surface substantially planar to the second side; supplying an adhesive in communication with the top surface; providing a sealing frame in communication with the adhesive and the second side; and coupling a housing defining a chamber to the second side, the housing enclosing the sealing frame.
Claim 5
Dependent Claim
64 words
The method according to claim 2, further comprising the steps of: receiving a fluid by a nozzle disposed in the housing, the nozzle having a spray end in communication with the chamber and an aperture disposed at a tip of the spray end; atomizing the fluid by the spray end of the nozzle; and discharging the atomized fluid into the chamber via the aperture.
Claim 6
Dependent Claim
42 words
The method according to claim 3, further comprising the steps of: providing the fluid to the nozzle via a fluid inlet port disposed in the housing; and removing the fluid from the chamber via a fluid outlet port disposed in the housing.
Claim 7
Dependent Claim
45 words
The method according to claim 4, further comprising: receiving the fluid from the fluid outlet port by a condenser; and supplying the fluid by the condenser to a fluid pump, the fluid pump in communication with the fluid inlet port, forming a closed-loop fluid flow.