US5842628A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Wire bonding method, semiconductor device, capillary for wire bonding and ball bump forming method
Assignee: Fujitsu Ltd
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Filing: 1996-04-08
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Granted: 1998-12-01
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Expires: 2016-04-08
Abstract
Abstract A wire bonding method includes a first bonding process for forming a first ball-shaped part in a wire and bonding the first ball-shaped part to a first connected member; a ball-shaped part forming process for guiding the wire away from a position where the wire is bonded to an inner lead so as to form a predetermined loop, and forming a second ball-shaped part in a predetermined position in the wire; and a second bonding process for bonding the second ball-shaped part to a semiconductor element pad that serves as a second connected member.
Inventors
- 👤 Ryuji Nomoto
- 👤 Kazuto Tsuji
- 👤 Mitsutaka Sato
- 👤 Junichi Kasai
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:53
CPC Classifications
B; B23; B23K; B23K20/00; B23K20/002; B23K20/004; H; H10; H10W; H10W72/00; H10W72/071; H10W72/01; H10W72/019; B23K2101/00; B23K2101/36; B23K2101/40; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W70/685; H10W72/015; H10W72/01551; H10W72/0711; H10W72/07141; H10W72/075; H10W72/07511; H10W72/07521; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/07551; H10W72/07553; H10W72/07554; H10W72/20; H10W72/29; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/5366; H10W72/537; H10W72/541; H10W72/5434; H10W72/547; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/59; H10W72/90; H10W72/951; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/753; H10W90/756
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
131 words
A wire bonding method comprising: a first bonding process for forming a first ball-shaped part in a wire and bonding said first ball-shaped part to a first connected member; a ball-shaped part forming process for guiding said wire away from said first connected member so as to form a predetermined loop and forming a second ball-shaped part in a predetermined position in said wire; and a second bonding process for bonding said second ball-shaped part to a second connected member, said ball-shaped part forming process including guiding said wire using a member after said first ball-shaped part is bonded to said first connected member, and continuously guiding said wire using said member to form said predetermined loop, whereupon said second ball-shaped part is formed and bonded to the second connected member.
Claim 2
Dependent Claim
131 words
A wire bonding method comprising: a first bonding process for forming a first ball-shaped part in a wire and bonding said first ball-shaped part to a first connected member; a ball-shaped part forming process for guiding said wire away from said first connected member so as to form a predetermined loop and forming a second ball-shaped part in a predetermined position in said wire; and a second bonding process for bonding said second ball-shaped part to a second connected member, said ball-shaped part forming process including guiding said wire using a member after said first ball-shaped part is bonded to said first connected member, and continuously guiding said wire using said member to form said predetermined loop, whereupon said second ball-shaped part is formed and bonded to the second connected member.
Claim 3
Dependent Claim
27 words
The wire bonding method as claimed in claim 1, wherein, in said ball-shaped part forming process, said second ball-shaped part is formed while said wire remains uncut.
Claim 4
Dependent Claim
21 words
The wire bonding method as claimed in claim 1, wherein at least said second ball-shaped part is formed by spark discharge.
Claim 5
Dependent Claim
55 words
The wire bonding method as claimed in claim 1, wherein said wire is guided generally vertically upward after said first ball-shaped part is bonded to said first connected member; and said wire is then guided horizontally, generally forming a right angle, whereupon said second ball-shaped part is formed and bonded to the second connected member.
Claim 6
Dependent Claim
65 words
The wire bonding method as claimed in claim 1, further comprising the steps of: forming a third ball-shaped part in a second wire and bonding said third ball-shaped part to the second connected member; and guiding said second wire away from said second connected member so as to form a loop above said first wire, and stitch-bonding said second wire to the first connected member.
Claim 7
Dependent Claim
31 words
The wire bonding method as claimed in claim 1, wherein said first connected member is embodied by a lead frame, and said second connected member is embodied by a semiconductor element.
Claim 8
Dependent Claim
24 words
The wire bonding method as claimed in claim 1, wherein said first connected member and said second connected member are embodied by a semiconductor.
Claim 9
Dependent Claim
39 words
The wire bonding method as claimed in claim 1, wherein said wire is embodied by a thin gold wire, and a ball bonding process is employed to bond at least said second ball-shaped part to said second connected member.
References Cited (Backward Citations)
US4142288A
Cited
US4732313A
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US4875618A
Cited
JPH06140454A
Cited
US5431329A
Cited
US5476211A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-11-30 | 2002-06-01 | 2002-12-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-11-30 | 2006-06-01 | 2006-12-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-11-30 | 2010-06-01 | 2010-12-01 | $7700.00 | Window Closed / Lapsed |