Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
112 words
A wafer map conversion method comprising: preparing a wafer map format file including a header portion recorded with basic information about a wafer and a data portion recorded with category grades of dies of the wafer; converting the wafer map format file to create a converted file by translating the wafer map format file, the converted file including a variety of information about the wafer recorded by items and category grades and actual positions of the dies recorded in accordance with the type of the wafer; and forming, using the converted file, a processing mode which displays category grades and actual positions of the dies, and information about the wafer and dies.
Claim 2
Dependent Claim
112 words
A wafer map conversion method comprising: preparing a wafer map format file including a header portion recorded with basic information about a wafer and a data portion recorded with category grades of dies of the wafer; converting the wafer map format file to create a converted file by translating the wafer map format file, the converted file including a variety of information about the wafer recorded by items and category grades and actual positions of the dies recorded in accordance with the type of the wafer; and forming, using the converted file, a processing mode which displays category grades and actual positions of the dies, and information about the wafer and dies.
Claim 3
Dependent Claim
41 words
The wafer map conversion method in accordance with claim 1, wherein the converted file is a configuration file which is formed by directly translating items of the wafer map format file, which have various formats, without any processing for those items.
Claim 4
Dependent Claim
40 words
The wafer map conversion method in accordance with claim 1, wherein the converted file is a standard file which is formed by translating items of the wafer map format file after standardizing the items in accordance with a desired format.
Claim 5
Dependent Claim
21 words
The wafer map conversion method in accordance with claim 1, wherein converting includes editing a die for a wafer mapping process.
Claim 6
Dependent Claim
21 words
The wafer map conversion method in accordance with claim 1, wherein converting includes selecting one or more dies to be processed.
Claim 7
Dependent Claim
20 words
The wafer map conversion method in accordance with claim 1, wherein converting includes rotating map data by a desired angle.
Claim 8
Dependent Claim
30 words
The wafer map conversion method in accordance with claim 1, wherein converting includes determining an actual direction of the wafer based on map data in accordance with a processing condition.
Claim 9
Dependent Claim
18 words
The wafer map conversion method in accordance with claim 1, further comprising editing using a wafer map converter.
Claim 10
Dependent Claim
20 words
The wafer map conversion method in accordance with claim 2, wherein the configuration file is a row type configuration file.
Claim 11
Dependent Claim
20 words
The wafer map conversion method in accordance with claim 2, wherein the configuration file is an array type configuration file.
Claim 12
Dependent Claim
20 words
The wafer map conversion method in accordance with claim 2, wherein the configuration file is a Cartesian type configuration file.
Claim 13
Dependent Claim
26 words
The wafer map conversion method in accordance with claim 5, further comprising bonding one or more dies after selecting one or more dies to be processed.
Claim 14
Dependent Claim
48 words
The wafer map conversion method in accordance with claim 1, wherein forming a processing mode further comprises forming first and second areas, said first area including information representing grade levels and actual positions of the dies, and said second area including information about the dies and the wafer.