US5828116A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device with bonded wires
Assignee: Denso Corp
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Filing: 1997-01-21
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Granted: 1998-10-27
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Expires: 2017-01-21
Abstract
Abstract The present invention provides an improved method of wire-bonding on a semiconductor chip, especially a small acceleration sensor chip which is mounted on a substrate with an adhesive having low stress characteristics such as a silicon resin. Further, the present invention provides a semiconductor device having a structure in which the improved method of wire bonding is easily applicable. The wire-bonding is performed by giving ultrasonic vibrations to the wires and the pads on which the wires are bonded while imposing pressure thereon. The vibration is given in a direction along a radial line extending from the center of the semiconductor chip.
Inventors
- 👤 Kenichi Ao
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 20:09
CPC Classifications
G; G01; G01P; G01P15/00; G01P15/02; G01P15/08; G01P15/0802; G01P15/12; G01P15/123; H; H10; H10W; H10W72/00; H10W72/90; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W72/071; H10W72/0711; H10W72/07141; H10W72/075; H10W72/07521; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/50; H10W72/531; H10W72/5363; H10W72/541; H10W72/5445; H10W72/5449; H10W72/551; H10W72/552; H10W72/5524; H10W72/59; H10W72/851; H10W72/874; H10W72/884; H10W72/931; H10W72/932; H10W72/951; H10W72/952; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/753; H10W90/754
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
55 words
A semiconductor device comprising: a substrate; a semiconductor chip having bonding pads thereon, the semiconductor chip being mounted on the substrate with an adhesive; and wires bonded to the bonding pads, each wire having a bonded portion that has a shape elongated substantially along a line extending radially from a center of the semiconductor chip.
Claim 2
Dependent Claim
55 words
A semiconductor device comprising: a substrate; a semiconductor chip having bonding pads thereon, the semiconductor chip being mounted on the substrate with an adhesive; and wires bonded to the bonding pads, each wire having a bonded portion that has a shape elongated substantially along a line extending radially from a center of the semiconductor chip.
Claim 3
Dependent Claim
34 words
The semiconductor device according to claim 1, wherein: the semiconductor chip includes thin bridge portions which are not in contact with the substrate, and each thin bridge portion has a strain gage formed thereon.
Claim 4
Dependent Claim
19 words
The semiconductor device according to claim 1 or 2, wherein: the adhesive is a material made of silicon resin.
Claim 5
Dependent Claim
30 words
The semiconductor device according to claim 1 or 2, wherein: an upper surface of the semiconductor chip and an upper surface of the substrate are substantially at the same level.
Claim 6
Dependent Claim
28 words
The semiconductor device according to claim 3, wherein: an upper surface of the semiconductor chip and an upper surface of the substrate are substantially at the same level.
Claim 7
Dependent Claim
16 words
The semiconductor device according to claim 1 or 2, wherein: the substrate is made of ceramics.
Claim 8
Dependent Claim
26 words
The semiconductor device according to claim 1 or 2, further comprising: an integrated circuit chip, wherein the bonded wires are connected to the integrated circuit chip.
Claim 9
Dependent Claim
31 words
The semiconductor device according to claim 1, wherein: the bonded portion of each wire is formed by applying ultrasonic vibrations to the wire in a direction along the radially extending line.
Claim 10
Dependent Claim
16 words
The semiconductor device according to claim 1, wherein: each wire extends substantially in a radial direction.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-10-26 | 2002-04-27 | 2002-10-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-10-26 | 2006-04-27 | 2006-10-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-10-26 | 2010-04-27 | 2010-10-27 | $7700.00 | Window Closed / Lapsed |