US4949160A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device
Assignee: Toshiba Corp
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Filing: 1988-12-16
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Granted: 1990-08-14
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Expires: 2008-12-16
Abstract
Abstract A semiconductor device is provided with a plurality of inner leads substantially radially arranged around a pellet mounting area of a lead frame, an insulating sheet arranged on the pellet mounting area so as to adhesively fix inner lead tip portions, and a semiconductor pellet mounted on the insulating sheet, wherein each tip portion of at least every other inner lead is provided with a broader portion broader than the width of each of the other inner lead tip portions, the broader portion is positioned closer to the central portion of the lead frame than the other inner lead tip portions, and an opening or a thin portion is provided within the broader portion.
Inventors
- 👤 Jun-ichi Ohno
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 01:45
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/453; H10W70/421; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W74/00
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
124 words
A semiconductor device comprising: a semiconductor pellet, insulating sheet means for mounting said semiconductor pellet thereon; and a plurality of inner leads for supporting said sheet means and for electrically connecting to said semiconductor pellet, said inner leads being substantially radially arranged around a pellet mounting area of said sheet means, the tip portions of at least every other inner lead being provided with a portion which is broader than the tip portions of remaining inner leads; said broad portion being positioned closer to the central portion of said sheet means than the tip portions of the remaining inner leads, the broad portions having means for strengthening an adhesive force acting between said insulating sheet means and said broad portions of the inner leads.
Claim 2
Dependent Claim
124 words
A semiconductor device comprising: a semiconductor pellet, insulating sheet means for mounting said semiconductor pellet thereon; and a plurality of inner leads for supporting said sheet means and for electrically connecting to said semiconductor pellet, said inner leads being substantially radially arranged around a pellet mounting area of said sheet means, the tip portions of at least every other inner lead being provided with a portion which is broader than the tip portions of remaining inner leads; said broad portion being positioned closer to the central portion of said sheet means than the tip portions of the remaining inner leads, the broad portions having means for strengthening an adhesive force acting between said insulating sheet means and said broad portions of the inner leads.
Claim 3
Dependent Claim
23 words
A semiconductor device according to claim 1, wherein said means for strengthening the adhesive force is an opening provided within said broad portion.
Claim 4
Dependent Claim
23 words
A semiconductor device according to claim 1, wherein said means for strengthening adhesive force is a thin portion provided within said broad portion.
Claim 5
Dependent Claim
14 words
A semiconductor device according to claim 1, wherein said sheet means is a polyamide.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-08-13 | 1994-02-12 | 1994-08-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-08-13 | 1998-02-12 | 1998-08-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-08-13 | 2002-02-12 | 2002-08-14 | $7700.00 | Window Closed / Lapsed |