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US5821628A
Expired / Lapsed
US
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Semiconductor device and two-layer lead frame for it
Assignee: Nitto Denko Corp
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Filing: 1997-11-28
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Granted: 1998-10-13
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Expires: 2017-11-28
Abstract
Abstract By employing the structure that in a two-layer lead frame comprising a lamination layer of lead portions and a metal layer, the thickness of an adhesive layer for fixing the a semiconductor element to the adhesive layer is defined to be from 100 to 350 μm and the semiconductor element is buried in the adhesive layer in a depth of at least 1/3o the thickness of the semiconductor element, the extent of the unevenness in the resin-sealed region is reduced and the occurrences of die shift and void are restrained.
Inventors
- 👤 Yuji Hotta
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 21:12
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/417; H10W74/00; H10W74/01; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W70/451; H10W74/40; H10W74/47; H10W90/00; H10W90/811; H10W72/00; H10W72/851; H10W72/874; H10W72/884; H10W74/10; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
65 words
A semiconductor device comprising: a metal layer; a semiconductor element fixed on said metal layer by an adhesive layer; and a lead portion laminated on said metal layer; wherein a thickness of the adhesive layer is from 100 to 350 μm and said semiconductor element is buried in the adhesive layer in a depth of at least 1/3 of a thickness of said semiconductor element.
Claim 2
Dependent Claim
65 words
A semiconductor device comprising: a metal layer; a semiconductor element fixed on said metal layer by an adhesive layer; and a lead portion laminated on said metal layer; wherein a thickness of the adhesive layer is from 100 to 350 μm and said semiconductor element is buried in the adhesive layer in a depth of at least 1/3 of a thickness of said semiconductor element.
Claim 3
Dependent Claim
20 words
The semiconductor device according to claim 1, wherein a thickness of the semiconductor device is from 400 to 800 μm.
Claim 4
Dependent Claim
35 words
The semiconductor device according to claim 1, wherein a surface of said metal layer which is opposite to a side of fixing said semiconductor element is exposed on a first surface of the semiconductor device.
Claim 5
Dependent Claim
33 words
The semiconductor device according to claim 1, further comprising a metal foil layer being formed on a second surface of the semiconductor device corresponding to a circuit surface side of said semiconductor element.
Claim 6
Dependent Claim
17 words
The semiconductor device according to claim 1, wherein a principal component of the adhesive layer is polycarbodiimide.
Claim 7
Dependent Claim
20 words
The semiconductor device according to claim 2, wherein a thickness of said semiconductor element is from 150 to 400 μm.
Claim 8
Dependent Claim
20 words
The semiconductor device according to claim 1, further comprising a sealing resin for sealing a circumference of said semiconductor element.
Claim 9
Dependent Claim
17 words
The semiconductor device according to claim 7, wherein a principal component of the sealing resin is polycarbodiimide.
Claim 10
Dependent Claim
39 words
A two-layer lead frame comprising: a metal layer for mounting a semiconductor element via an adhesive layer; and a lead portion laminated on said metal layer; wherein a thickness of the adhesive layer is from 100 to 350 μm.
Claim 11
Dependent Claim
39 words
A two-layer lead frame comprising: a metal layer for mounting a semiconductor element via an adhesive layer; and a lead portion laminated on said metal layer; wherein a thickness of the adhesive layer is from 100 to 350 μm.
Claim 12
Dependent Claim
18 words
The two-layer lead frame according to claim 9, wherein a principal component of the adhesive layer is polycarbodiimde.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-10-12 | 2002-04-13 | 2002-10-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-10-12 | 2006-04-13 | 2006-10-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-10-12 | 2010-04-13 | 2010-10-13 | $7700.00 | Window Closed / Lapsed |