Multi-chip module and production method thereof

Claim 2

A multi-chip module comprising: a substrate comprising an inorganic material having a first wiring circuit, a first area formed on a first surface and a second area formed on the first surface which encloses the first area, the substrate having a mounting pad formed on the first area, and the substrate having a sealing pattern formed on the second area; an electronic element having a first surface facing the first area of the substrate, the electronic element having an electrode formed on the first surface; essentially lead-free mounting means for mounting the electronic element onto the first area of the substrate; an essentially lead-free metal cap having an opening end; and essentially lead-free sealing means for sealing the sealing pattern of the substrate and the opening end of the metal cap.

Claim 3

A multi-chip module as set forth in claim 1, wherein the substrate comprises a multilayered substrate.

Claim 4

A multi-chip module as set forth in claim 1, wherein the first area is covered with a film comprising resin, the film having a second wiring circuit connected with the first wiring circuit, and wherein the mounting pad is formed on the exposed surface of the film.

Claim 5

A multi-chip module set forth in claim 1, wherein the mounting means for mounting the electronic element comprise an essentially lead-free metal film deposited on the electrode and an essentially lead-free conductive resin which connects the mounting pad and the electrode having the metal film, electrically and mechanically.

Claim 6

A multi-chip module as set forth in claim 4, wherein the metal film comprises at least one element selected from a group consisting of Au, Ag, and Pd.

Claim 7

A multi-chip module as set forth in claim 4, wherein the conductive resin consists of at least one element selected from a group consisting of Au, Ag, Cu, Pd and Pt as a conductive particle.

Claim 8

A multi-chip module as set forth in claim 1 wherein the mounting pad and the sealing pattern are made of at least one element selected from a group consisting of W, Ni, Au, Ag, Cu, Pd, and Pt.

Claim 9

A multi-chip module as set forth in claim 1, wherein the sealing means for sealing the sealing pattern of the substrate and the opening end of the metal cap comprise a weld ring brazed onto the sealing pattern with an essentially lead-free solder, and a deposited zone which connects the weld ring and the metal cap.

Claim 10

A multi-chip module comprising; a substrate comprising inorganic material having a first wiring circuit, a first area formed on a first surface and a second area formed on the first surface which encloses the first area, the substrate having a mounting pad and a bonding pad formed on the first area, and the substrate having a sealing pattern formed on the second area; a first electronic element having a first surface, the electronic element having a second surface facing the first area of the substrate, the electric element having an electrode formed on the first surface; essentially lead-free mounting means for mounting the first electronic element onto the first area of the substrate; an essentially lead-free metal cap having an opening end; and essentially lead-free sealing means for sealing the sealing pattern of the substrate and the opening end of the metal cap.

Claim 11

A multi-chip module comprising; a substrate comprising inorganic material having a first wiring circuit, a first area formed on a first surface and a second area formed on the first surface which encloses the first area, the substrate having a mounting pad and a bonding pad formed on the first area, and the substrate having a sealing pattern formed on the second area; a first electronic element having a first surface, the electronic element having a second surface facing the first area of the substrate, the electric element having an electrode formed on the first surface; essentially lead-free mounting means for mounting the first electronic element onto the first area of the substrate; an essentially lead-free metal cap having an opening end; and essentially lead-free sealing means for sealing the sealing pattern of the substrate and the opening end of the metal cap.

Claim 12

A multi-chip module as set forth in claim 9, wherein the substrate is a multi-layered substrate.

Claim 13

A multi-chip module as set forth in claim 10, wherein the first area is covered with a film comprising resin, the film having a second wiring circuit connected with the first wiring circuit, and wherein the mounting pad and the bonding pad are formed on the exposed surface of the film.

Claim 14

A multi-chip module as set forth in claim 9, wherein the mounting means for mounting the electronic element comprise an essentially lead-free conductive resin mechanically connecting the mounting pad and the second surface of the first electronic element and an essentially lead-free bonding wire electrically connecting the bonding pad of the substrate and the electrode of the first electronic element.

Claim 15

A multi-chip module as set forth in claim 12, wherein the bonding wire is made of at least one element selected from a group consisting of Au, Al and Cu.

Claim 16

A multi-chip module as set forth in claim 9; wherein the second surface of the electronic element is metallized, wherein the mounting means consists of an essentially lead-free conductive resin electrically and mechanically connecting the mounting pad and the second surface of the first electronic element, and an essentially lead-free bonding wire electrically connecting the bonding pad of the substrate and the electrode of the first electronic element.

Claim 17

A multi-chip module as set forth in claim 9, wherein the mounting pad, bonding pad and the sealing pattern comprise at least one element selected from a group consisting of W, Ni, Au, Ag, Cu, Pd and Pt.

Claim 18

A multi-chip module as set forth in claim 9, wherein the sealing means for sealing the sealing pattern of the substrate and the opening end of the metal cap comprise a weld ring brazed onto the sealing pattern with an essentially lead-free solder, and a deposited zone which connects the weld ring and the metal cap.

Claim 19

A multi-chip module comprising: a substrate comprising inorganic material having a first wiring circuit, a first area formed on a first surface and a second area formed on the first surface which encloses the first area, the substrate having a first mounting pad and a second mounting pad formed on the first area, the substrate having a bonding pad formed on the first area, and the substrate having a sealing pattern formed on the second area; an active element having a first surface, a second surface facing the first area of the substrate, and the active element having an electrode formed on the first surface; a passive element having an electrode, the passive element having an essentially lead-free metal layer deposited on the electrode; essentially lead-free mounting means for mounting the active element and the passive element onto the first area of the substrate; an essentially lead-free metal cap having an opening end; and essentially lead-free sealing means for sealing the sealing pattern of the substrate and the opening end of the metal cap.

Claim 20

A multi-chip module comprising: a substrate comprising inorganic material having a first wiring circuit, a first area formed on a first surface and a second area formed on the first surface which encloses the first area, the substrate having a first mounting pad and a second mounting pad formed on the first area, the substrate having a bonding pad formed on the first area, and the substrate having a sealing pattern formed on the second area; an active element having a first surface, a second surface facing the first area of the substrate, and the active element having an electrode formed on the first surface; a passive element having an electrode, the passive element having an essentially lead-free metal layer deposited on the electrode; essentially lead-free mounting means for mounting the active element and the passive element onto the first area of the substrate; an essentially lead-free metal cap having an opening end; and essentially lead-free sealing means for sealing the sealing pattern of the substrate and the opening end of the metal cap.

Claim 21

A multi-chip module as set forth in claim 17, wherein the mounting means for mounting the electronic element comprise a first connecting means and a second connecting means, the first connecting means having an essentially lead-free conducting resin which connects the first mounting pad and the second surface of the active element, the first connecting means having an essentially lead-free conducting resin which connects the second mounting pad and the electrode of the passive element having the deposited metal layer, and the second connecting means having an essentially lead-free bonding wire which connects the bonding pad and the electrode of the active element.

Claim 22

A multi-chip module comprising: a substrate comprising an approximately lead-free inorganic material having a first wiring circuit, a first area formed on a first surface and a second area formed on the first surface which encloses the first area; electronic elements; essentially lead-free mounting means for mounting the electronic elements onto the first area of the substrate; an essentially lead-free metal cap having an opening end; and essentially lead-free sealing means for sealing the second area of the substrate and the opening end of the metal cap.

Claim 23

A multi-chip module comprising: a substrate comprising an approximately lead-free inorganic material having a first wiring circuit, a first area formed on a first surface and a second area formed on the first surface which encloses the first area; electronic elements; essentially lead-free mounting means for mounting the electronic elements onto the first area of the substrate; an essentially lead-free metal cap having an opening end; and essentially lead-free sealing means for sealing the second area of the substrate and the opening end of the metal cap.

Claim 24

A multi-chip module comprising: a substrate comprising an inorganic material having a first wiring circuit, a first area formed on a first surface and a second area formed on the first surface which encloses the first area, the substrate having a mounting pad formed on the first area, and the substrate having a sealing pattern formed on the second area; an electronic element having a first surface facing the first area of the substrate, the electronic element having an electrode formed on the first surface; mounting means for mounting the electronic element onto the first area of the substrate comprising an essentially lead-free bump formed at the electrode of the electric element and an essentially lead-free conductive resin which connects the mounting pad and the bump, electrically and mechanically; an essentially lead-free metal cap having an opening end; and sealing means for sealing the sealing pattern of the substrate and the opening end of the metal cap comprising a weld ring brazed onto the sealing pattern with an essentially lead-free solder, and a deposited zone which connects the weld ring and the metal cap.

Claim 25

A multi-chip module comprising: a substrate comprising an inorganic material having a first wiring circuit, a first area formed on a first surface and a second area formed on the first surface which encloses the first area, the substrate having a mounting pad formed on the first area, and the substrate having a sealing pattern formed on the second area; an electronic element having a first surface facing the first area of the substrate, the electronic element having an electrode formed on the first surface; mounting means for mounting the electronic element onto the first area of the substrate comprising an essentially lead-free bump formed at the electrode of the electric element and an essentially lead-free conductive resin which connects the mounting pad and the bump, electrically and mechanically; an essentially lead-free metal cap having an opening end; and sealing means for sealing the sealing pattern of the substrate and the opening end of the metal cap comprising a weld ring brazed onto the sealing pattern with an essentially lead-free solder, and a deposited zone which connects the weld ring and the metal cap.

Claim 26

A multi-chip module comprising: a substrate comprising an inorganic material having a first wiring circuit, a first area formed on a first surface and a second area formed on the first surface which encloses the first area, the substrate having a mounting pad formed on the first area, and the substrate having a sealing pattern formed on the second area; an electronic element having a first surface facing the first area of the substrate, the electronic element having an electrode formed on the first surface; mounting means for mounting the electronic element onto the first area of the substrate comprising an essentially lead-free metal film deposited on the electrode and an essentially lead-free conductive resin which connects the mounting pad and the electrode having the metal film, electrically and mechanically; an essentially lead-free metal cap having an opening end; and sealing means for sealing the sealing pattern of the substrate and the opening end of the metal cap comprising a weld ring brazed onto the sealing pattern with an essentially lead-free solder, and a deposited zone which connects the weld ring and the metal cap.

Claim 27

A multi-chip module comprising: a substrate comprising an inorganic material having a first wiring circuit, a first area formed on a first surface and a second area formed on the first surface which encloses the first area, the substrate having a mounting pad formed on the first area, and the substrate having a sealing pattern formed on the second area; an electronic element having a first surface facing the first area of the substrate, the electronic element having an electrode formed on the first surface; mounting means for mounting the electronic element onto the first area of the substrate comprising an essentially lead-free metal film deposited on the electrode and an essentially lead-free conductive resin which connects the mounting pad and the electrode having the metal film, electrically and mechanically; an essentially lead-free metal cap having an opening end; and sealing means for sealing the sealing pattern of the substrate and the opening end of the metal cap comprising a weld ring brazed onto the sealing pattern with an essentially lead-free solder, and a deposited zone which connects the weld ring and the metal cap.

Claim 28

A multi-chip module comprising: a substrate comprising an inorganic material having a first wiring circuit, a first area formed on a first surface and a second area formed on the first surface which encloses the first area, the substrate having a mounting pad and a bonding pad formed on the first area, and the substrate having a sealing pattern formed on the second area; a first electronic element having a first surface, the electronic element having a second surface facing the first area of the substrate, the electric element having an electrode formed on the first surface; mounting means for mounting the first electronic element onto the first area of the substrate comprising essentially lead-free conductive resin mechanically connecting the mounting pad and the second surface of the first electronic element and an essentially lead-free bonding wire electrically connecting the bonding pad of the substrate and the electrode of the first electronic element; an essentially lead-free metal cap having an opening end; and sealing means for sealing the sealing pattern of the substrate and the opening end of the metal cap comprising a weld ring brazed onto the sealing pattern with an approximately lead-free solder, and a deposited zone which connects the weld ring and the metal cap.

Claim 29

A multi-chip module comprising: a substrate comprising an inorganic material having a first wiring circuit, a first area formed on a first surface and a second area formed on the first surface which encloses the first area, the substrate having a mounting pad and a bonding pad formed on the first area, and the substrate having a sealing pattern formed on the second area; a first electronic element having a first surface, the electronic element having a second surface facing the first area of the substrate, the electric element having an electrode formed on the first surface; mounting means for mounting the first electronic element onto the first area of the substrate comprising essentially lead-free conductive resin mechanically connecting the mounting pad and the second surface of the first electronic element and an essentially lead-free bonding wire electrically connecting the bonding pad of the substrate and the electrode of the first electronic element; an essentially lead-free metal cap having an opening end; and sealing means for sealing the sealing pattern of the substrate and the opening end of the metal cap comprising a weld ring brazed onto the sealing pattern with an approximately lead-free solder, and a deposited zone which connects the weld ring and the metal cap.

Claim 30

A multi-chip module comprising: a substrate comprising an inorganic material having a first wiring circuit, a first area formed on a first surface and a second area formed on the first surface which encloses the first area, the substrate having a mounting pad formed on the first area, and the substrate having a sealing pattern formed on the second area; an electronic element having first surface facing the first area of the substrate, the electronic element having an electrode formed on the first surface; essentially lead-free mounting means for mounting the electronic element onto the first area of the substrate, the mounting means comprising an essentially lead-free bump formed at the electrode of the electric element and an essentially lead-free conductive resin which connects the mounting pad and the bump, electrically and mechanically; an essentially lead-free metal cap having an opening end; and essentially lead-free sealing means for sealing the sealing pattern of the substrate and the opening end of the metal cap.

Claim 31

A multi-chip module comprising: a substrate comprising an inorganic material having a first wiring circuit, a first area formed on a first surface and a second area formed on the first surface which encloses the first area, the substrate having a mounting pad formed on the first area, and the substrate having a sealing pattern formed on the second area; an electronic element having first surface facing the first area of the substrate, the electronic element having an electrode formed on the first surface; essentially lead-free mounting means for mounting the electronic element onto the first area of the substrate, the mounting means comprising an essentially lead-free bump formed at the electrode of the electric element and an essentially lead-free conductive resin which connects the mounting pad and the bump, electrically and mechanically; an essentially lead-free metal cap having an opening end; and essentially lead-free sealing means for sealing the sealing pattern of the substrate and the opening end of the metal cap.

Claim 32

A multi-chip module as set forth in claim 23, wherein the conductive resin consists of at least one element selected from a group of consisting of Au, Ag, Cu, Pd and Pt as a conductive particle.

Claim 33

A multi-chip module as set forth in claim 23, wherein the conductive resin is an anisotropic conductive film.

Claim 34

A multi-chip module as set forth in claim 23, wherein the bump comprises at least one element selected from a group consisting of Au, Ag, Cu, Pd, Ni, Cr and Ti.

Claim 35

A multi-chip module comprising: a substrate comprising an inorganic material having a first wiring circuit, a first area formed on a first surface and a second area formed on the first surface which encloses the first area, the substrate having a mounting pad formed on the first area, and the substrate having a sealing pattern formed on the second area; an electronic element having a first surface facing with the first area of the substrate, the electronic element having an electrode formed on the first surface; essentially lead-free mounting means for mounting the electronic element onto the first area of the substrate; an essentially lead-free metal cap having an opening end; and essentially lead-free sealing means for sealing the sealing pattern of the substrate and the opening end of the metal cap, the sealing means comprising a weld ring brazed onto the sealing pattern with an essentially lead-free solder, and a deposited zone which connects the weld ring and the metal cap, and the weld ring, the metal cap and the deposited zone which comprise an Fe--Ni--Co alloy.

Claim 36

A multi-chip module comprising: a substrate comprising an inorganic material having a first wiring circuit, a first area formed on a first surface and a second area formed on the first surface which encloses the first area, the substrate having a mounting pad formed on the first area, and the substrate having a sealing pattern formed on the second area; an electronic element having a first surface facing with the first area of the substrate, the electronic element having an electrode formed on the first surface; essentially lead-free mounting means for mounting the electronic element onto the first area of the substrate; an essentially lead-free metal cap having an opening end; and essentially lead-free sealing means for sealing the sealing pattern of the substrate and the opening end of the metal cap, the sealing means comprising a weld ring brazed onto the sealing pattern with an essentially lead-free solder, and a deposited zone which connects the weld ring and the metal cap, and the weld ring, the metal cap and the deposited zone which comprise an Fe--Ni--Co alloy.

Claim 37

A multi-chip module comprising: a substrate comprising inorganic material having a first wiring circuit, a first area formed on a first surface and a second area formed on the first surface which encloses the first area, the substrate having a mounting pad and a bonding pad formed on the first area, and the substrate having a sealing pattern formed on the second area; a first electronic element having a first surface, the electronic element having a second surface facing the first area of the substrate, the electric element having an electrode formed on the first surface; essentially lead-free mounting means for mounting the first electronic element onto the first area of the substrate; an essentially lead-free metal cap having an opening end; and essentially lead-free sealing means for sealing the sealing pattern of the substrate and the opening end of the metal cap, the sealing means comprising a weld ring brazed onto the sealing pattern with an essentially lead-free solder, and a deposited zone which connects the weld ring and the metal cap, and the weld ring, the metal cap and the deposited zone which comprise an Fe--Ni--Co alloy.

Claim 38

A multi-chip module comprising: a substrate comprising inorganic material having a first wiring circuit, a first area formed on a first surface and a second area formed on the first surface which encloses the first area, the substrate having a mounting pad and a bonding pad formed on the first area, and the substrate having a sealing pattern formed on the second area; a first electronic element having a first surface, the electronic element having a second surface facing the first area of the substrate, the electric element having an electrode formed on the first surface; essentially lead-free mounting means for mounting the first electronic element onto the first area of the substrate; an essentially lead-free metal cap having an opening end; and essentially lead-free sealing means for sealing the sealing pattern of the substrate and the opening end of the metal cap, the sealing means comprising a weld ring brazed onto the sealing pattern with an essentially lead-free solder, and a deposited zone which connects the weld ring and the metal cap, and the weld ring, the metal cap and the deposited zone which comprise an Fe--Ni--Co alloy.