US5818113A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device
Assignee: Toshiba Corp
•
Filing: 1996-09-12
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Granted: 1998-10-06
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Expires: 2016-09-12
Abstract
Abstract A semiconductor device wherein a sealing resin is filled in a space between an interconnecting wiring board and a semiconductor chip after the semiconductor chip is flip chip-mounted on the wiring board in which at least a non-planar region consisting of a through hole, a concave portion or a convex portion, or a region exhibiting poor wettability to the sealing resin is formed on the surface of the wiring board or the semiconductor chip so as to provide a void in the sealed resin filled between the wiring board and the semiconductor chip for the purpose of minimizing any bad influence from the sealing resin on the interconnecting wirings or elements formed on the semiconductor chip.
Inventors
- 👤 Yuji Iseki
- 👤 Yasushi Shizuki
- 👤 Hiroshi Yamada
- 👤 Takashi Togasaki
- 👤 Kunio Yoshihara
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:35
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W72/00; H10W72/30; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H10W70/681; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/073; H10W72/20; H10W72/241; H10W72/851; H10W72/853; H10W72/856; H10W90/00; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 28
Claim 1
Independent Claim
169 words
A semiconductor device comprising an interconnecting wiring board, a semiconductor chip flip chip-mounted on the wiring board having an effective region in which at least either one of an interconnecting wiring and an element on a surface facing the wiring board is provided and having a non-effective region surrounding said effective region, and a sealing resin filled in a space between the wiring board and the semiconductor chip, wherein; said effective region has a region in which said sealing resin is formed and a region in which said sealing resin is not formed, and part of a surface of said wiring board which faces at least either one of the wiring and the element formed on the surface of the semiconductor chip comprises one non-planar region formed of at least one of a through hole, a concave portion and a convex portion; and a void devoid of said sealing resin is formed at least in a space between said non-planar region of the wiring board and the semiconductor chip.
Claim 2
Dependent Claim
169 words
A semiconductor device comprising an interconnecting wiring board, a semiconductor chip flip chip-mounted on the wiring board having an effective region in which at least either one of an interconnecting wiring and an element on a surface facing the wiring board is provided and having a non-effective region surrounding said effective region, and a sealing resin filled in a space between the wiring board and the semiconductor chip, wherein; said effective region has a region in which said sealing resin is formed and a region in which said sealing resin is not formed, and part of a surface of said wiring board which faces at least either one of the wiring and the element formed on the surface of the semiconductor chip comprises one non-planar region formed of at least one of a through hole, a concave portion and a convex portion; and a void devoid of said sealing resin is formed at least in a space between said non-planar region of the wiring board and the semiconductor chip.
Claim 3
Dependent Claim
29 words
The semiconductor device according to claim 1, wherein a region having a surface which is poor in wettability to the sealing resin is further formed in said non-planar region.
Claim 4
Dependent Claim
53 words
The semiconductor device according to claim 2, wherein said region having a surface which is poor in wettability to the sealing resin is formed of at least one material selected from the group consisting of Teflon resin, a hydrocarbon-based wax, a fatty acid-based wax, a fatty acid amide-based wax and an ester-based wax.
Claim 5
Dependent Claim
34 words
The semiconductor device according to claim 1, wherein a region which is poor in wettability to the sealing resin is further formed on part of surface of said semiconductor chip facing said non-planar region.
Claim 6
Dependent Claim
50 words
The semiconductor device according to claim 4, wherein said region which is poor in wettability to the sealing resin is formed of at least one material selected from the group consisting of Teflon resin, a hydrocarbon-based wax, a fatty acid-based wax, a fatty acid amide-based wax and an ester-based wax.
Claim 7
Dependent Claim
24 words
The semiconductor device according to claim 1, wherein said convex portion is made of a dry film consisting of one of acrylate and polyimide.
Claim 8
Dependent Claim
40 words
The semiconductor device according to claim 1, wherein a shorter diameter of said through hole, said concave portion and a convex portion is at least 10 times as large as a distance between the semiconductor chip and the wiring board.
Claim 9
Dependent Claim
35 words
The semiconductor device according to claim 1, wherein a distance between said concave portion and said semiconductor chip is at least 2 times as large as that between said wiring board and said semiconductor chip.
Claim 10
Dependent Claim
36 words
The semiconductor device according to claim 1, wherein a distance between said convex portion and said semiconductor chip is not more than 3/4 times as large as that between said wiring board and said semiconductor chip.
Claim 11
Dependent Claim
24 words
The semiconductor device according to claim 1, wherein said concave portion is surrounded by a dry film consisting of one of acrylate and polyimide.
Claim 12
Dependent Claim
160 words
A semiconductor device comprising an interconnecting wiring board, a semiconductor chip flip chip-mounted on the wiring board having an effective region in which at least either one of an interconnecting wiring and an element on a surface facing the wiring board is provided and having a non-effective region surrounding said effective region, and a sealing resin filled in a space between the wiring board and the semiconductor chip, wherein; said effective region has a region in which said sealing resin is formed and a region in which said sealing resin is not formed, and a patterned insulating film is formed on the semiconductor chip thereby forming thereon at least one non-planar region formed of one of a concave portion and a convex portion in the region of at least either one of the wiring and the element; and a void devoid of said sealing resin is formed at least in a space between said wiring board and said non-planar region.
Claim 13
Dependent Claim
160 words
A semiconductor device comprising an interconnecting wiring board, a semiconductor chip flip chip-mounted on the wiring board having an effective region in which at least either one of an interconnecting wiring and an element on a surface facing the wiring board is provided and having a non-effective region surrounding said effective region, and a sealing resin filled in a space between the wiring board and the semiconductor chip, wherein; said effective region has a region in which said sealing resin is formed and a region in which said sealing resin is not formed, and a patterned insulating film is formed on the semiconductor chip thereby forming thereon at least one non-planar region formed of one of a concave portion and a convex portion in the region of at least either one of the wiring and the element; and a void devoid of said sealing resin is formed at least in a space between said wiring board and said non-planar region.
Claim 14
Dependent Claim
39 words
The semiconductor device according to claim 11, wherein a region having a surface which is poor in wettability to the sealing resin is further formed in a region of a surface of said wiring board facing said non-planar region.
Claim 15
Dependent Claim
53 words
The semiconductor device according to claim 12, wherein said region having a surface which is poor in wettability to the sealing resin is formed of at least one material selected from the group consisting of Teflon resin, a hydrocarbon-based wax, a fatty acid-based wax, a fatty acid amide-based wax and an ester-based wax.
Claim 16
Dependent Claim
26 words
The semiconductor device according to claim 11, wherein a region which is poor in wettability to the sealing resin is further formed in said non-planar region.
Claim 17
Dependent Claim
50 words
The semiconductor device according to claim 14, wherein said region which is poor in wettability to the sealing resin is formed of at least one material selected from the group consisting of Teflon resin, a hydrocarbon-based wax, a fatty acid-based wax, a fatty acid amide-based wax and an ester-based wax.
Claim 18
Dependent Claim
24 words
The semiconductor device according to claim 11, wherein said convex portion is made of a dry film consisting of one of acrylate and polyimide.
Claim 19
Dependent Claim
37 words
The semiconductor device according to claim 11, wherein a shorter diameter of said concave portion and a convex portion is at least 10 times as large as a distance between the semiconductor chip and the wiring board.
Claim 20
Dependent Claim
35 words
The semiconductor device according to claim 11, wherein a distance between said concave portion and said semiconductor chip is at least 2 times as large as that between said wiring board and said semiconductor chip.
Claim 21
Dependent Claim
36 words
The semiconductor device according to claim 11, wherein a distance between said convex portion and said semiconductor chip is not more than 3/4 times as large as that between said wiring board and said semiconductor chip.
Claim 22
Dependent Claim
24 words
The semiconductor device according to claim 11, wherein said concave portion is surrounded by a dry film consisting of one of acrylate and polyimide.
Claim 23
Dependent Claim
154 words
A semiconductor device comprising an interconnecting wiring board, a semiconductor chip flip chip-mounted on the wiring board having an effective region in which at least either one of an interconnecting wiring and an element on a surface facing the wiring board is provided and having a non-effective region surrounding said effective region, and a sealing resin filled in a space between the wiring board and the semiconductor chip, wherein; said effective region has a region in which said sealing resin is formed and a region in which said sealing resin is not formed, and part of a surface of said wiring board which faces at least either one of the wiring and the element has surface characteristics made poor in wettability to said sealing resin; and a void devoid of said sealing resin is formed at least in a space between said part of the surface exhibiting a poor wettability and said semiconductor chip.
Claim 24
Dependent Claim
154 words
A semiconductor device comprising an interconnecting wiring board, a semiconductor chip flip chip-mounted on the wiring board having an effective region in which at least either one of an interconnecting wiring and an element on a surface facing the wiring board is provided and having a non-effective region surrounding said effective region, and a sealing resin filled in a space between the wiring board and the semiconductor chip, wherein; said effective region has a region in which said sealing resin is formed and a region in which said sealing resin is not formed, and part of a surface of said wiring board which faces at least either one of the wiring and the element has surface characteristics made poor in wettability to said sealing resin; and a void devoid of said sealing resin is formed at least in a space between said part of the surface exhibiting a poor wettability and said semiconductor chip.
Claim 25
Dependent Claim
53 words
The semiconductor device according to claim 21, wherein said region having a surface which is poor in wettability to the sealing resin is formed of at least one material selected from the group consisting of Teflon resin, a hydrocarbon-based wax, a fatty acid-based wax, a fatty acid amide-based wax and an ester-based wax.
Claim 26
Dependent Claim
157 words
A semiconductor device comprising an interconnecting wiring board, a semiconductor chip flip chip-mounted on the wiring board having an effective region in which at least either one of an interconnecting wiring and an element on a surface facing the wiring board is provided and having a non-effective region surrounding said effective region, and a sealing resin filled in a space between the wiring board and the semiconductor chip, wherein; said effective region has a region in which said sealing resin is formed and a region in which said sealing resin is not formed, and part of a surface of said semiconductor chip bearing at least either one of the wiring and the element has surface characteristics made poor in wettability to said sealing resin; and a void devoid of said sealing resin is formed at least in a space between said part of the surface of said semiconductor chip exhibiting a poor wettability and said wiring board.
Claim 27
Dependent Claim
157 words
A semiconductor device comprising an interconnecting wiring board, a semiconductor chip flip chip-mounted on the wiring board having an effective region in which at least either one of an interconnecting wiring and an element on a surface facing the wiring board is provided and having a non-effective region surrounding said effective region, and a sealing resin filled in a space between the wiring board and the semiconductor chip, wherein; said effective region has a region in which said sealing resin is formed and a region in which said sealing resin is not formed, and part of a surface of said semiconductor chip bearing at least either one of the wiring and the element has surface characteristics made poor in wettability to said sealing resin; and a void devoid of said sealing resin is formed at least in a space between said part of the surface of said semiconductor chip exhibiting a poor wettability and said wiring board.
Claim 28
Dependent Claim
53 words
The semiconductor device according to claim 23, wherein said region having a surface which is poor in wettability to the sealing resin is formed of at least one material selected from the group consisting of Teflon resin, a hydrocarbon-based wax, a fatty acid-based wax, a fatty acid amide-based wax and an ester-based wax.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-10-05 | 2002-04-06 | 2002-10-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-10-05 | 2006-04-06 | 2006-10-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-10-05 | 2010-04-06 | 2010-10-06 | $7700.00 | Window Closed / Lapsed |