Patent US5808236A successfully refreshed from Google Patents.
US5808236A
Expired / Lapsed
US
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High density heatsink attachment
Assignee: International Business Machines Corp
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Filing: 1997-04-10
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Granted: 1998-09-15
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Expires: 2017-04-10
Abstract
Abstract An apparatus and method therefore mount an array of different heatsinks to a closely packed array of data processing elements utilized within a data processing system. The apparatus includes a metal frame with multiple apertures in the bottom to allow access to the tops of the devices for which heatsinks will be provided. The metal frame has multiple apertures that allow access to the tops of the data processing elements underneath. The metal frame serves as a containment vehicle for multiple heatsinks, and also provides rigidity to the printed circuit board in the particularly vulnerable vicinity of the corners where the devices are attached to the printed circuit board.
Inventors
- 👤 Johnny Roy Brezina
- 👤 John Saunders Corbin, Jr.
- 👤 Howard Victor Mahaney, Jr.
- 👤 James Robert Taylor
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 10:11
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/60; H10W40/641
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
140 words
An apparatus for attaching a first heatsink to a printed circuit board, wherein the printed circuit board comprises a plurality of data processing elements mounted thereon, the apparatus comprising: a plurality of apertures, wherein each of the plurality of apertures corresponds to one of the plurality of data processing elements of the printed circuit board; and first attachment means for attaching the first heatsink over at least a first one of the plurality of apertures, wherein the plurality of data processing elements comprise an uncapped device and a capped device, and the capped device extends above the printed circuit board higher than the uncapped device, wherein a top of the uncapped device remains between the printed circuit board and a bottom surface of the apparatus, and wherein the capped device protrudes through a first one of the plurality of apertures.
Claim 2
Independent Claim
140 words
An apparatus for attaching a first heatsink to a printed circuit board, wherein the printed circuit board comprises a plurality of data processing elements mounted thereon, the apparatus comprising: a plurality of apertures, wherein each of the plurality of apertures corresponds to one of the plurality of data processing elements of the printed circuit board; and first attachment means for attaching the first heatsink over at least a first one of the plurality of apertures, wherein the plurality of data processing elements comprise an uncapped device and a capped device, and the capped device extends above the printed circuit board higher than the uncapped device, wherein a top of the uncapped device remains between the printed circuit board and a bottom surface of the apparatus, and wherein the capped device protrudes through a first one of the plurality of apertures.
Claim 3
Independent Claim
146 words
An apparatus for attaching a first heatsink to a printed circuit board, wherein the printed circuit board comprises a plurality of data processing elements mounted thereon, the apparatus comprising: a plurality of apertures, wherein each of the plurality of apertures corresponds to one of the plurality of data processing elements of the printed circuit board; first attachment means for attaching the first heatsink over at least a first one of the plurality of apertures; and a plurality of standoffs coupled to a bottom surface of the apparatus for coupling the apparatus to the printed circuit board, wherein the plurality of data processing elements comprise an uncapped device and a capped device, and the capped device extends above the printed circuit board higher than the uncapped device, wherein a top of the uncapped device remains between the printed circuit board and a bottom surface of the apparatus.
Claim 4
Independent Claim
146 words
An apparatus for attaching a first heatsink to a printed circuit board, wherein the printed circuit board comprises a plurality of data processing elements mounted thereon, the apparatus comprising: a plurality of apertures, wherein each of the plurality of apertures corresponds to one of the plurality of data processing elements of the printed circuit board; first attachment means for attaching the first heatsink over at least a first one of the plurality of apertures; and a plurality of standoffs coupled to a bottom surface of the apparatus for coupling the apparatus to the printed circuit board, wherein the plurality of data processing elements comprise an uncapped device and a capped device, and the capped device extends above the printed circuit board higher than the uncapped device, wherein a top of the uncapped device remains between the printed circuit board and a bottom surface of the apparatus.
Claim 5
Independent Claim
194 words
An apparatus for attaching the first heatsink to a printed circuit board, wherein the printed circuit board comprises a plurality of data processing elements mounted thereon, the apparatus comprising: a plurality of apertures, wherein each of the plurality of apertures corresponds to one of the plurality of data processing elements of the printed circuit board; and first attachment means for attaching the first heat sink over at least a first one of the plurality of apertures, wherein the plurality of data processing elements comprise an uncapped device and a capped device, and the cap device extends above the printed circuit board higher than the uncapped device, wherein a top of the uncapped device remains between the printed circuit board and a bottom surface of the apparatus, and wherein the first attachment means, further comprises: a first torsion bar having a first end and a second end; a first anchor slot coupled to a top surface of the apparatus, the first anchor slot receiving the first end of the first torsion bar; and a first latch coupled to the top surface of the apparatus, the first latch latching the second end of the torsion bar.
Claim 6
Independent Claim
194 words
An apparatus for attaching the first heatsink to a printed circuit board, wherein the printed circuit board comprises a plurality of data processing elements mounted thereon, the apparatus comprising: a plurality of apertures, wherein each of the plurality of apertures corresponds to one of the plurality of data processing elements of the printed circuit board; and first attachment means for attaching the first heat sink over at least a first one of the plurality of apertures, wherein the plurality of data processing elements comprise an uncapped device and a capped device, and the cap device extends above the printed circuit board higher than the uncapped device, wherein a top of the uncapped device remains between the printed circuit board and a bottom surface of the apparatus, and wherein the first attachment means, further comprises: a first torsion bar having a first end and a second end; a first anchor slot coupled to a top surface of the apparatus, the first anchor slot receiving the first end of the first torsion bar; and a first latch coupled to the top surface of the apparatus, the first latch latching the second end of the torsion bar.
Claim 7
Dependent Claim
26 words
The apparatus of claim 3, further comprising: second attachment means for attaching a second heatsink over at least a second one of the plurality of apertures.
Claim 8
Dependent Claim
75 words
The apparatus of claim 4, wherein the second attachment means further comprises: a second torsion bar having a first end and a second end; a second anchor slot perpendicularly coupled to a top surface of the frame, the second anchor slot receiving the first end of the second torsion bar; and a second latch perpendicularly coupled to the top surface of the frame, the second latch latching the second end of the second torsion bar.
Claim 9
Dependent Claim
102 words
A printed circuit board, comprising: a first data processing element, wherein the first data processing element is a capped element; a second data processing element, wherein the second data processing element is an uncapped element; a frame coupled to the printed circuit board, the frame comprising: a first aperture positioned over the first data processing element; and a second aperture positioned over the second data processing element, wherein the first data processing element protrudes through the first aperture of the frame and a top of the second data processing element remains below a bottom surface of the second aperture of the frame.
Claim 10
Dependent Claim
102 words
A printed circuit board, comprising: a first data processing element, wherein the first data processing element is a capped element; a second data processing element, wherein the second data processing element is an uncapped element; a frame coupled to the printed circuit board, the frame comprising: a first aperture positioned over the first data processing element; and a second aperture positioned over the second data processing element, wherein the first data processing element protrudes through the first aperture of the frame and a top of the second data processing element remains below a bottom surface of the second aperture of the frame.
Claim 11
Dependent Claim
32 words
The printed circuit board of claim 6, further comprising: a first heatsink positioned over the first aperture of the frame; and a second heatsink positioned over the second aperture of the frame.
Claim 12
Dependent Claim
46 words
The printed circuit board of claim 6, further comprising: a heatsink having a pedestal positioned over the second aperture of the frame, wherein the pedestal extends past the bottom surface of the second aperture of the frame towards the top of the second data processing element.
Claim 13
Dependent Claim
121 words
The printed circuit board of claim 6, wherein the frame further comprises: a first anchor slot coupled to a top surface of the frame, the first anchor slot being capable of receiving a first end of a first torsion bar; a first latch coupled to the top surface of the frame, the first latch being capable of latching the second end of the first torsion bar; a second anchor slot coupled to a top surface of the frame, the second anchor slot being capable of receiving the first end of a second torsion bar; and a second latch coupled to the top surface of the frame, the second latch being capable of latching the second end of the second torsion bar.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-09-14 | 2002-03-16 | 2002-09-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-09-14 | 2006-03-16 | 2006-09-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-09-14 | 2010-03-16 | 2010-09-15 | $7700.00 | Window Closed / Lapsed |