US5803246A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Surface package type semiconductor package and method of producing semiconductor memory
Assignee: Hitachi Ltd
•
Filing: 1996-09-13
•
Granted: 1998-09-08
•
Expires: 2016-09-13
Abstract
Abstract In surface packaging of thin resin packages such as surface mount resin molded memory ICs or the like, cracks of the package occur frequently at a solder reflow step where thermal impact is applied to the package because the resin has absorbed moisture before packaging. To solve this problem, the devices are packaged moisture-tight at an assembly step of the resin molded devices where the resin is still dry, and are taken out from the bags immediately before the execution of surface packaging.
Inventors
- 👤 Wahei Kitamura
- 👤 Gen Murakami
- 👤 Kunihiko Nishi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 15:27
CPC Classifications
B; B32; B32B; B32B27/00; B32B27/06; B32B27/08; B32B27/18; B32B27/30; B32B27/304; B32B27/32; B65; B65D; B65D79/00; B65D79/02; B65D81/00; B65D81/24; B65D81/26; B65D81/266; H; H05; H05K; H05K13/00; H05K13/0084; H10; H10P; H10P72/00; H10P72/04; H10P72/0438; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/413; H10W70/456; H10W70/457; H10W72/00; H10W72/50; H10W74/00; H10W74/10; H10W74/111; H10W74/121; B32B2307/00; B32B2307/70; B32B2307/724; B32B2307/7242; B32B2307/7246; B32B2311/00; B32B2311/24; B32B2323/00; B32B2323/04; B32B2327/00; B32B2327/06; B32B2439/00; H10W72/01; H10W72/015; H10W72/01515; H10W72/071; H10W72/075; H10W72/531; H10W72/536; H10W72/5363; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/5525; H10W72/59; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/754; H10W90/756; Y; Y10; Y10S; Y10S174/00; Y10S174/08; Y10S428/00; Y10S428/922; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
101 words
A packaged device comprising: a moisture-proofing bag made of a laminate film, said laminate film being made of (a) a barrier layer for preventing intrusion of moisture, (b) an inner charge-preventing layer inside of said barrier layer and (c) an outer charge-preventing layer outside of said barrier layer; a surface-mount resin molded semiconductor device, to be surface-mounted on a printed circuit board, sealed in said moisture-proofing bag, said surface-mount resin molded semiconductor device being a device subjected to heat when said surface-mount resin molded semiconductor device is surface-mounted on a printed circuit board; and a desiccant sealed in said moisture-proofing bag.
Claim 2
Dependent Claim
101 words
A packaged device comprising: a moisture-proofing bag made of a laminate film, said laminate film being made of (a) a barrier layer for preventing intrusion of moisture, (b) an inner charge-preventing layer inside of said barrier layer and (c) an outer charge-preventing layer outside of said barrier layer; a surface-mount resin molded semiconductor device, to be surface-mounted on a printed circuit board, sealed in said moisture-proofing bag, said surface-mount resin molded semiconductor device being a device subjected to heat when said surface-mount resin molded semiconductor device is surface-mounted on a printed circuit board; and a desiccant sealed in said moisture-proofing bag.
Claim 3
Dependent Claim
29 words
A packaged device according to claim 1, wherein said surface-mount resin molded semiconductor device is a device that will be surface-mounted on said printed circuit board by solder reflow.
Claim 4
Dependent Claim
16 words
A packaged device according to claim 1, wherein said barrier layer is made of vinylidene chloride.
Claim 5
Dependent Claim
15 words
A packaged device according to claim 1, wherein said barrier layer is an aluminum film.
Claim 6
Dependent Claim
27 words
A packaged device according to claim 1, wherein said inner charge-preventing layer is an innermost layer of said moisture-proofing bag, said innermost layer being made of polyethylene.
Claim 7
Dependent Claim
16 words
A packaged device according to claim 5, wherein said polyethylene contains an antistatic agent kneaded therein.
Claim 8
Dependent Claim
17 words
A packaged device according to claim 5, wherein said moisture-proofing bag is sealed by heat-sealing said polyethylene.
Claim 9
Dependent Claim
27 words
A packaged device according to claim 5, further comprising: a film layer for reinforcing mechanical strength, disposed between said inner charge-preventing layer and said outer charge-preventing layer.
Claim 10
Dependent Claim
21 words
A packaged device according to claim 8, wherein said film layer for reinforcing mechanical strength is made of a polyester film.
Claim 11
Dependent Claim
17 words
A packaged device according to claim 1, wherein said outer charge-preventing layer is a carbon conductive layer.
Claim 12
Dependent Claim
68 words
A packaged device comprising: a moisture-proofing bag made of a laminate film; a surface-mount resin molded semiconductor device, to be surface-mounted on a printed circuit board, sealed in said moisture-proofing bag, said surface-mount resin molded semiconductor device being a device which will be subject to heat when said surface-mount resin molded semiconductor device is surface-mounted on a printed circuit board; and a desiccant sealed in said moisture-proofing bag.
Claim 13
Dependent Claim
68 words
A packaged device comprising: a moisture-proofing bag made of a laminate film; a surface-mount resin molded semiconductor device, to be surface-mounted on a printed circuit board, sealed in said moisture-proofing bag, said surface-mount resin molded semiconductor device being a device which will be subject to heat when said surface-mount resin molded semiconductor device is surface-mounted on a printed circuit board; and a desiccant sealed in said moisture-proofing bag.
Claim 14
Dependent Claim
19 words
A packaged device according to claim 11, wherein said moisture-proofing bag includes a layer for preventing intrusion of moisture.
Claim 15
Dependent Claim
19 words
A packaged device according to claim 12, wherein said layer for preventing intrusion of moisture is a barrier layer.
Claim 16
Dependent Claim
16 words
A packaged device according to claim 13, wherein said barrier layer is made of vinylidene chloride.
Claim 17
Dependent Claim
15 words
A packaged device according to claim 13, wherein said barrier layer is an aluminum film.
Claim 18
Dependent Claim
83 words
A packaged device comprising: a moisture-proofing bag made of a laminate film; a surface-mount resin molded semiconductor device, to be mounted on a printed circuit board, sealed in said moisture-proofing bag, said surface-mount resin molded semiconductor device being a device which will be subject to heat when said surface-mount resin molded semiconductor device is surface-mounted on a printed circuit board; and a desiccant sealed in said moisture-proofing bag, so that said surface-mount resin molded semiconductor device is substantially not affected by external moisture.
Claim 19
Dependent Claim
83 words
A packaged device comprising: a moisture-proofing bag made of a laminate film; a surface-mount resin molded semiconductor device, to be mounted on a printed circuit board, sealed in said moisture-proofing bag, said surface-mount resin molded semiconductor device being a device which will be subject to heat when said surface-mount resin molded semiconductor device is surface-mounted on a printed circuit board; and a desiccant sealed in said moisture-proofing bag, so that said surface-mount resin molded semiconductor device is substantially not affected by external moisture.
Claim 20
Dependent Claim
19 words
A packaged device according to claim 16, wherein said moisture-proofing bag includes a layer for preventing intrusion of moisture.
Claim 21
Dependent Claim
44 words
A packaged device according to claim 16, wherein said laminate film includes (a) a barrier layer for preventing intrusion of moisture, (b) an inner charge-preventing layer formed inside of said barrier layer and (c) an outer charge-preventing layer formed outside of said barrier layer.
Claim 22
Dependent Claim
28 words
A packaged device according to claim 18, wherein said inner charge-preventing layer is an innermost layer of said moisture-proofing bag, and said innermost layer is made of polyethylene.
Claim 23
Dependent Claim
17 words
A packaged device according to claim 19, wherein said moisture-proofing bag is sealed by heat-sealing said polyethylene.
Claim 24
Dependent Claim
20 words
A packaged device according to claim 11, wherein said desiccant is provided on an interior surface of the moisture-proofing bag.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-09-07 | 2002-03-09 | 2002-09-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-09-07 | 2006-03-09 | 2006-09-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-09-07 | 2010-03-09 | 2010-09-08 | $7700.00 | Window Closed / Lapsed |