Patent US5798563A successfully refreshed from Google Patents.
US5798563A
Expired / Lapsed
US
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Polytetrafluoroethylene thin film chip carrier
Assignee: GlobalFoundries Inc
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Filing: 1997-01-28
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Granted: 1998-08-25
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Expires: 2017-01-28
Abstract
Abstract The present invention provides an organic chip carrier particularly useful with flip chips, comprising an organic dielectric layer, a first layer of circuitry disposed on the dielectric layer, an organic conformational coating disposed over the first layer of dielectric and the first layer of circuitry, and a layer of fine line circuitry having line width of about 2.0 mil or less, preferably about 1.0 mil or less, preferably about 0.7 mil, and a space between lines of about 1.5 mil or less, preferably about 1.1 mil or less, disposed on the conformational layer. Preferably the dielectric layer is free of woven fiber glass. The conformational coating preferably has a dielectric constant of about 1.5 to about 3.5, and a percent planarization of greater than about 3.5% The invention also relates to methods of making the dielectric coated chip carrier.
Inventors
- 👤 Natalie Barbara Feilchenfeld
- 👤 John Steven Kresge
- 👤 Scott Preston Moore
- 👤 Ronald Peter Nowak
- 👤 James Warren Wilson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:11
CPC Classifications
H; H10; H10P; H10P74/00; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/69; H05; H05K; H05K3/00; H05K3/46; H05K3/4602; H10W70/01; H10W70/05; H10W70/62; H10W70/65; H10W70/695; H10W72/00; H10W72/851; H05K1/00; H05K1/02; H05K1/03; H05K1/05; H05K1/056; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/015; H05K2201/0154; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09536; H05K2203/00; H05K2203/15; H05K2203/1581; H05K3/40; H05K3/4038; H05K3/4053; H05K3/4069; H05K3/4611; H05K3/4641; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/07251; H10W72/20; H10W90/00; H10W90/701; H10W90/721; H10W90/724; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49165
Claims Analysis
Total Claims: 26
Claim 1
Independent Claim
122 words
An organic chip carrier comprising: a. a dielectric layer having a dielectric constant of from about 1.5 to 3.5; b. a first layer of circuitry disposed on and adhering to the dielectric layer; c. a conformational coating having a percent planarization of greater than about 30% and a dielectric constant of from about 1.5 to about 3.5, disposed on the first layer of circuitry and the dielectric layer; d. a second layer of circuitry disposed on the conformational coating, comprising lines having a line width less than 1 mil and line spacing of 1.5 mil or less; and e. at least one conductive via disposed through the conformational coating to connect the first layer of circuitry and the second layer of circuitry.
Claim 2
Dependent Claim
122 words
An organic chip carrier comprising: a. a dielectric layer having a dielectric constant of from about 1.5 to 3.5; b. a first layer of circuitry disposed on and adhering to the dielectric layer; c. a conformational coating having a percent planarization of greater than about 30% and a dielectric constant of from about 1.5 to about 3.5, disposed on the first layer of circuitry and the dielectric layer; d. a second layer of circuitry disposed on the conformational coating, comprising lines having a line width less than 1 mil and line spacing of 1.5 mil or less; and e. at least one conductive via disposed through the conformational coating to connect the first layer of circuitry and the second layer of circuitry.
Claim 3
Dependent Claim
12 words
The carrier of claim 1 wherein the conformational coating is a polyimide.
Claim 4
Dependent Claim
11 words
The carrier of claim 1 wherein the dielectric layer is polytetrafluoroethylene.
Claim 5
Dependent Claim
22 words
The carrier of claim 1, wherein the dielectric layer characterized in being filled with particulate filler and free of woven fiberglass cloth.
Claim 6
Dependent Claim
17 words
The carrier of claim 1, wherein the conformational coating is a polyimide, and dielectric layer is polytetrafluoroethylene.
Claim 7
Dependent Claim
34 words
The carrier of claim 1, further comprising: at least one through hole disposed through the dielectric layer; at least one pad, disposed atop the through hole, in electrical and mechanical connection with the via.
Claim 8
Dependent Claim
172 words
An organic chip carrier comprising: a compensator; a first inner dielectric layer disposed on one side of the compensator; a second inner dielectric layer disposed on the other side of compensator; a first ground plane disposed on the first inner dielectric layer; a second ground plane disposed on the second inner dielectric layer; a second dielectric layer disposed on the second ground plane, having a dielectric constant of from about 1.5 to 3.5; a first layer of circuitry disposed on and adhering to the second dielectric layer; a conformational coating having a percent planarization of greater than about 30% and a dielectric constant of from about 1.5 to about 3.5, disposed on the first layer of circuitry and the second dielectric layer; a second layer of circuitry disposed on the conformational coating, comprising lines having a line width less than 1 mil and line spacing of 1.5 mil or less; at least one conductive via disposed through the conformational coating connecting the second layer of circuitry to the first layer of circuitry.
Claim 9
Dependent Claim
172 words
An organic chip carrier comprising: a compensator; a first inner dielectric layer disposed on one side of the compensator; a second inner dielectric layer disposed on the other side of compensator; a first ground plane disposed on the first inner dielectric layer; a second ground plane disposed on the second inner dielectric layer; a second dielectric layer disposed on the second ground plane, having a dielectric constant of from about 1.5 to 3.5; a first layer of circuitry disposed on and adhering to the second dielectric layer; a conformational coating having a percent planarization of greater than about 30% and a dielectric constant of from about 1.5 to about 3.5, disposed on the first layer of circuitry and the second dielectric layer; a second layer of circuitry disposed on the conformational coating, comprising lines having a line width less than 1 mil and line spacing of 1.5 mil or less; at least one conductive via disposed through the conformational coating connecting the second layer of circuitry to the first layer of circuitry.
Claim 10
Dependent Claim
45 words
The carrier of claim 7, further comprising: at least one through hole disposed through the second dielectric layer; at least one pad, disposed atop the through hole; at least one conductive via disposed through the conformational coating, in electrical and mechanical connection with the pads.
Claim 11
Dependent Claim
11 words
The carrier of claim 7, wherein the dielectric layer is polytetrafluoroethylene.
Claim 12
Dependent Claim
12 words
The carrier of claim 9, wherein the polytetrafluoroethylene contains a silica filler.
Claim 13
Dependent Claim
22 words
The carrier of claim 7, wherein there is a plurality of pads and vias and the pad diameter exceeds the via diameter.
Claim 14
Dependent Claim
15 words
The carrier of claim 7, wherein the second dielectric layer is free of fiber glass.
Claim 15
Dependent Claim
12 words
The carrier of claim 7, wherein the conformational coating is a polyimide.
Claim 16
Dependent Claim
14 words
The carrier of claim 7, wherein the dielectric layer is free of fiber glass.
Claim 17
Dependent Claim
113 words
A circuitized structure comprising: a. a circuitized substrate; and b. a carrier, electrically and mechanically connected to the substrate, comprising: a dielectric layer; at least one through hole disposed in the dielectric layer; a pad disposed atop the through hole; a conformational coating having a percent planarization greater than 30% disposed on the dielectric layer; fine line circuitry comprising lines having a line width less than 1 mil and line spacing of 1.5 mil or less, disposed in the conformational coating; at least one conductive via disposed through the dielectric layer and positioned over the pad; c. a chip, disposed on the carrier and electrically and mechanically connected to the fine line circuitry.
Claim 18
Dependent Claim
113 words
A circuitized structure comprising: a. a circuitized substrate; and b. a carrier, electrically and mechanically connected to the substrate, comprising: a dielectric layer; at least one through hole disposed in the dielectric layer; a pad disposed atop the through hole; a conformational coating having a percent planarization greater than 30% disposed on the dielectric layer; fine line circuitry comprising lines having a line width less than 1 mil and line spacing of 1.5 mil or less, disposed in the conformational coating; at least one conductive via disposed through the dielectric layer and positioned over the pad; c. a chip, disposed on the carrier and electrically and mechanically connected to the fine line circuitry.
Claim 19
Dependent Claim
13 words
The circuitized structure of claim 15, wherein the conformational coating is a polyimide.
Claim 20
Dependent Claim
13 words
The circuitized structure of claim 15, wherein the first dielectric layer is polytetrafluoroethylene.
Claim 21
Dependent Claim
17 words
The circuitized structure of claim 15, further comprising a layer of circuitry disposed on the dielectric layer.
Claim 22
Dependent Claim
100 words
A circuitized structure comprising: a. a carrier comprising: a dielectric layer; at least one through hole disposed in the dielectric layer; a pad disposed atop the through hole; a conformational coating having a percent planarization greater than 30% disposed on the dielectric layer; fine line circuitry comprising lines having a line width less than 1 mil and line spacing of 1.5 mil or less, disposed on the conformational coating; at least one via disposed through the dielectric layer and positioned over the pad; b. a chip, disposed on the carrier and electrically and mechanical connected to the fine line circuitry.
Claim 23
Dependent Claim
100 words
A circuitized structure comprising: a. a carrier comprising: a dielectric layer; at least one through hole disposed in the dielectric layer; a pad disposed atop the through hole; a conformational coating having a percent planarization greater than 30% disposed on the dielectric layer; fine line circuitry comprising lines having a line width less than 1 mil and line spacing of 1.5 mil or less, disposed on the conformational coating; at least one via disposed through the dielectric layer and positioned over the pad; b. a chip, disposed on the carrier and electrically and mechanical connected to the fine line circuitry.
Claim 24
Dependent Claim
13 words
The circuitized structure of claim 19, wherein the conformational coating is a polyimide.
Claim 25
Dependent Claim
13 words
The circuitized structure of claim 19, wherein the first dielectric layer is polytetrafluoroethylene.
Claim 26
Dependent Claim
17 words
The circuitized structure of claim 19, further comprising a layer of circuitry disposed on the dielectric layer.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-08-24 | 2002-02-23 | 2002-08-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-08-24 | 2006-02-23 | 2006-08-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-08-24 | 2010-02-23 | 2010-08-25 | $7700.00 | Window Closed / Lapsed |